• IEC 60748-22-1:1997

    Current The latest, up-to-date edition.

    Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  10-04-1997

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    1 Characteristics and conditions of use
    2 Recommended methods of mounting
    3 Marking
    4 Ordering information
    5 Certified records of released lots
    6 Additional information
    7 Additional or increased severities or requirements
               to those specified in the generic and/or sectional
               specification
    8 Inspection requirements (see tables 2 and 3 or 4
               and 5)
    9 Supplement - Tables of method B
    Tables
    1 Where a range of circuits
    2 Method A - Groups A and B - Lot-by-lot
    3a Method A - Group C - Periodic tests
    3b Method A - Group D - Periodic tests
    4a Method B - Group A - Lot-by-lot
    4b Method B - Group B - Lot-by-lot
    5a Method B - Group C - Periodic tests
    5b Method B - Group D - Periodic tests

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47A
    Development Note Also numbered as BS QC760201(1997). (09/2003) Supersedes IEC 60186B. (07/2004) Stability Date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS QC 760200:1997 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures
    BS QC 760200:1992 Harmonized system of quality assessment for electronic components. Semiconductor devices. Integrated circuits. Sectional specification for film integrated circuits and hybrid film integrated circuits: capability approval
    IEC 61747-1:1998+AMD1:2003 CSV Liquid crystal and solid-state display devices - Part 1: Generic specification
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