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Semiconductor devices – Mechanical and climatic test methods – Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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Available format(s): Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users
Language(s): English
Published date: 31-08-2020
Publisher: International Electrotechnical Committee
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs).
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