• IEC 60749-4:2017

    Current The latest, up-to-date edition.

    Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French, English

    Published date:  03-03-2017

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 HAST test - General remarks
    5 Test apparatus
    6 Test conditions
    7 Procedure
    8 Failure criteria
    9 Safety
    10 Summary

    Abstract - (Show below) - (Hide below)

    IEC 60749-4:2017 provides a highly accelerated temperature and humidity stress test (HAST) for the purpose of evaluating the reliability of non-hermetic packaged semiconductor devices in humid environments. This edition includes the following significant technical changes with respect to the previous edition:
    a) clarification of requirements for temperature, relative humidity and duration detailed in Table 1;
    b) recommendations that current limiting resistor(s) be placed in the test set-up to prevent test board or DUT damage;
    c) allowance of additional time-to-test delay or return-to-stress delay.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47
    Development Note Supersedes IEC PAS 62177 (08/2002) Supersedes IEC 60749. (03/2008) Stability Date: 2022. (03/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 60749-5:2017 Semiconductor devices. Mechanical and climatic test methods Steady-state temperature humidity bias life test
    13/30264591 DC : 0 BS EN 60747-14-6 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-6: SEMICONDUCTOR SENSORS - HUMIDITY SENSOR
    BS EN 60749-30 : 2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    EN 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
    NF EN 60749-30 : 2005 AMD 1 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    CEI EN 60749-5 : 2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
    NF EN 60749-5 : 2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
    IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
    IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
    EN 60749-30 : 2005 AMD 1 2011 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    IEC TS 62686-1:2015 Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors
    I.S. EN 60749-30:2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING
    I.S. EN 60749-5:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST (IEC 60749-5:2017)
    PD IEC/TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies. Mechanisms and testing
    PD IEC/TS 62686-1:2015 Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors
    13/30264596 DC : 0 BS EN 60747-14-7 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-7: SEMICONDUCTOR SENSORS - FLOW METER
    13/30264600 DC : 0 BS EN 60747-14-8 ED 1.0 - SEMICONDUCTOR DEVICES - PART 14-8: SEMICONDUCTOR SENSORS - CAPACITIVE DEGRADATION SENSOR OF LIQUID
    IEC 60749-30:2005+AMD1:2011 CSV Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
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