BS IEC 61189-5-4 : 2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
12/30274796 DC : 0
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BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX |
12/30274804 DC : 0
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BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE |
BS IEC 61189-5-2 : 2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
BS EN 61191-1:2013
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Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
EN 61189-11 : 2013
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS |
EN 61189-5-1:2016
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
EN 61249-8-7:1996
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Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks |
EN 61189-6:2006
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Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
EN 61189-5-4:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
EN 62878-1-1:2015
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Device embedded substrate - Part 1-1: Generic specification - Test methods |
I.S. EN 61191-1:2013
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PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
EN 61189-5-3:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
BS EN 62326-20:2016
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Printed boards Printed circuit boards for high-brightness LEDs |
BS EN 61189-11:2013
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Measurement of melting temperature or melting temperature ranges of solder alloys |
I.S. EN 61249-8-7:1999
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MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
12/30274800 DC : 0
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BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE |
BS EN 61249-8-7:1997
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Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Marking legend inks |
NF EN 61189-5-4 : 2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
NF EN 61249 8-8 : 1998
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MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS |
NF EN 61189-5 : 2008
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
BS EN 61189-5-1:2016
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies |
IEC 61189-5-2:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
IEC 61189-5-4:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
14/30309692 DC : 0
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BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS |
BS EN 61189-5-4:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies |
BS EN 61249-2-13:1999
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Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Cyanate ester non-woven aramid laminate of defined flammability, copper-clad |
09/30208696 DC : 0
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BS EN 61189-11 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE AND MELTING TEMPERATURE RANGES OF SOLDER ALLOYS |
BS EN 61189-5-2:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies |
BS IEC 61189-5-3 : 2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
BS EN 61189-5-3:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies |
I.S. EN 61189-5:2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 61189-3:2008
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS) |
I.S. EN 61249-8-8:1999
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MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - TEMPORARY POLYMER |
IEC 61249-8-8:1997
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Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings |
IEC 61189-5:2006
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Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies |
BS EN 61249-8-8:1997
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Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings |
BS EN 61189-5:2006
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Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies |
BS EN 62878-1-1:2015
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Device embedded substrate Generic specification. Test methods |
BS EN 61189-6:2006
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Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies |
I.S. EN 61189-5-4:2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES |
IEC 61191-1:2013
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Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
I.S. EN 61189-6:2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES |
I.S. EN 62878-1-1:2015
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DEVICE EMBEDDED SUBSTRATE - PART 1-1: GENERIC SPECIFICATION - TEST METHODS |
IEC 61189-6:2006
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Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies |
15/30327712 DC : 0
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BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 61189-5-1:2016
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
11/30255124 DC : 0
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BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC 61189-5-3:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies |
IEC 61189-11:2013
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys |
IEC 61189-3:2007
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
BS EN 61189-3:2008
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards) |
BS EN 61249-2-12:1999
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Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad Epoxide non-woven aramid laminate of defined flammability, copper-clad |
I.S. EN 61189-11:2013
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS (IEC 61189-11:2013 (EQV)) |
CEI EN 61249-8-7 : 1997
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MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 7: MARKING LEGEND INKS |
I.S. EN 61189-5-3:2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES |
I.S. EN 62326-20:2016
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PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS |
I.S. EN 61189-5-2:2015
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TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES |
IEC 62326-20:2016
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Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
EN 61249-8-8:1997
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Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings |
EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
EN 61189-5-2:2015
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies |
EN 62326-20:2016
|
Printed boards - Part 20: Printed circuit boards for high-brightness LEDs |
EN 61189-5 : 2006
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TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES |
EN 61189-3:2008
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Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |