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  • IEC 61189-5-503:2017

    Current The latest, up-to-date edition.

    Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French, English

    Published date:  22-05-2017

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Testing condition
    5 Specimen
    6 Equipment/Apparatus or material
    7 Resistance measurement method
    8 Test method
    9 Procedure
    Annex A (informative) - Forms of electrochemical migration
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 61189-5-503:2017 specifies the conductive anodic filament (hereafter referred to as CAF) and specifies not only the steady-state temperature and humidity test, but also a temperature-humidity cyclic test and an unsaturated pressurized vapour test (HAST).

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Stability Date: 2022. (05/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60721-1:1990+AMD1:1992+AMD2:1995 CSV Classification of environmental conditions - Part 1: Environmental parameters and their severities
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC TR 62866:2014 Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
    ASTM D 257 : 2014 Standard Test Methods for DC Resistance or Conductance of Insulating Materials
    IEC 60068-2-66:1994 Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour)
    IPC TM 650 : 0 TEST METHODS MANUAL
    IEC 60068-2-67:1995 Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
    IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
    IEC 60721-2-1:2013 Classification of environmental conditions - Part 2-1: Environmental conditions appearing in nature - Temperature and humidity
    IPC 9691 : A USER GUIDE FOR THE IPC-TM-650, METHOD 2.6.25, CONDUCTIVE ANODIC FILAMENT (CAF) RESISTANCE AND OTHER INTERNAL ELECTROCHEMICAL MIGRATION TESTING
    IEC 60068-3-5:2001 Environmental testing - Part 3-5: Supporting documentation and guidance - Confirmation of the performance of temperature chambers
    IEC 60721-3-0:1984+AMD1:1987 CSV Classification of environmental conditions - Part 3: Classification of groups of environmental parameters and their severities - Introduction
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 60068-3-4:2001 Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests
    IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
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