IEC 61191-1:2013

Current

Current The latest, up-to-date edition.

PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES

Available format(s): Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

Language(s): English - French

Published date: 21-05-2013

Publisher: International Electrotechnical Committee

Table of Contents - (Show below) - (Hide below)

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Materials requirements
6 Components and printed board requirements
7 Assembly process requirements
8 Assembly soldering requirements
9 Cleanliness requirements
10 Assembly requirements
11 Coating and encapsulation
12 Rework and repair
13 Product quality assurance
14 Other requirements
15 Ordering data
Annex A (normative) - Requirements for soldering
tools and equipment
Annex B (normative) - Qualification of fluxes
Annex C (normative) - Quality assessment
Bibliography

Abstract - (Show below) - (Hide below)

Provides requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies.

General Product Information - (Show below) - (Hide below)

Committee	TC 91
Development Note	Stability date: 2015. (05/2013)
Document Type	Standard
ISBN
Pages
Published
Publisher	International Electrotechnical Committee
Status	Current
Superseded By	IEC 61191-1:2018

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
NF EN 61191-1 : 2014	Identical
SS-EN IEC 61191-1:2019	Identical
BS EN 61191-1 : 2013	Identical
CEI EN 61191-1 : 2014	Identical
DS EN 61191-1 : 2013	Identical
NF EN IEC 61191-1:2018	Identical
NEN EN IEC 61191-1 : 2013	Identical
DIN EN 61191-1 : 2015	Identical
UNE-EN 61191-1:1998	Identical
PN EN 61191-1 : 2013	Identical
SN EN IEC 61191-1:2018	Identical
UNE-EN 61191-1:2013	Identical
SN EN 61191-1:2013	Identical
GOST R IEC 61191-1 : 2010	Identical
SN EN 61191-1 : 1998	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

I.S. EN 61188-5-5:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
97/230541 DC : DRAFT AUG 1997
DIN EN 61191-3 : 2016	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
BS EN 61193-1 : 2002	QUALITY ASSESSMENT SYSTEMS - REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
CECC 200025 : 1998	PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES
BS CECC200025(1998) : 1998	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - PROCESS ASSESSMENT SCHEDULE - PRINTED BOARD ASSEMBLY FACILITIES
BS EN 61192-4 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
BS EN 61188-5-5 : 2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
BS EN 61192-5 : 2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
BS EN 61192-2 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
BS EN 61191-6 : 2010	PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
05/30133283 DC : DRAFT MAY 2005	IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
CEI CECC 200025 : 2000	PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES
17/30352677 DC : 0	BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN
15/30329572 DC : 0	BS EN 61191-4 - PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61188-5-2:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
BS EN 61192-1 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
UTEC 90 720-1 : 2000	ELECTRONIC ASSEMBLY TECHNOLOGY - MANUFACTURING LINE CERTIFICATION FOR ELECTRONIC BOARDS (QML) - PART 1: GUIDE FOR DESIGN AND MANUFACTURING OF ELECTRONIC ASSEMBLIES
BS EN 61190-1-1 : 2002	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
BS EN 61192-3 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
BS EN 61188-5-4 : 2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
97/206324 DC : DRAFT MAY 1997
I.S. EN 61188-5-3:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
15/30328104 DC : DRAFT JULY 2015	BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
BS EN 61188-5-1 : 2002	PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
07/30169763 DC : 0	BS EN 62515 - EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA
NBR IEC 61191-3 : 2012	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
BS EN 61188-5-8 : 2008	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
NBR IEC 61192-1 : 2008	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
11/30255128 DC : 0	BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
12/30258438 DC : 0	BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
I.S. EN 61191-6:2010	PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
15/30330490 DC : 0	BS EN 61191-3 - PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
BS EN 61188-5-3 : 2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
DIN EN 61191-4 : 2016	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61192-3:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
NBR IEC 61191-4 : 2012	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61193-1:2002	QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
I.S. EN 61192-5:2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
CEI EN 61191-4 : 2005	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61192-1:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
BS EN 50548 : 2011	JUNCTION BOXES FOR PHOTOVOLTAIC MODULES
I.S. EN 61192-2:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
I.S. EN 50548:2011	JUNCTION BOXES FOR PHOTOVOLTAIC MODULES
I.S. EN 61190-1-1:2002	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
I.S. EN 61192-4:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
I.S. EN 61188-5-1:2002	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
I.S. EN 61188-5-8:2008	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
I.S. EN 61188-5-4:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
NF EN 61191-2 : 2014	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
I.S. EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
EN 61191-2 : 2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
BS PD IEC TS 62647-1 : 2012	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN
BS EN 61191-3 : 2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
BS EN 61191-4 : 2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES (IEC 61191-4:2017)
IEC 61188-5-1:2002	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
IEC 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
17/30355792 DC : 0	BS EN 62790 AMENDMENT 1 - JUNCTION BOXES FOR PHOTOVOLTAIC MODULES - SAFETY REQUIREMENTS AND TESTS
IEC 61193-1:2001	QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
IEC 61191-4:2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
IEC 61188-5-3:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
BS EN 61188-5-2 : 2003	PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC 61190-1-1:2002	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
IEC 61191-6:2010	PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
IEC PAS 62647-1 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
IEC 61188-5-4:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
BS EN 61191-2 : 2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
BS PD IEC/PAS 62647-1 : 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
IEC 61188-5-8:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
IEC 61192-1:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
IEC 61192-5:2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
IEC 61192-4:2002	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
IEC 61192-2:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
IEC 61188-5-5:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
IEC 61188-5-2:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC 61191-3:2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
I.S. EN 61191-4:2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61191-3:2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
EN 61188-5-1 : 2002	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
NF EN 61188-5-1 : 2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS

Standards Referencing This Book - (Show below) - (Hide below)

IEC 61193-3:2013	QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING
IEC 61193-1:2001	QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
IEC 61188-5-3:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
IEC 61188-5-2:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
IEC PAS 62326-7-1 : 1.0	PERFORMANCE GUIDE FOR SINGLE- AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING BOARDS
J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IEC 61190-1-2:2014	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
IEC 61340-5-1:2016	Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
IEC 61188-1-1:1997	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES
IEC TR 61340-5-2:2007	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
IEC 62326-1:2002	PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
J STD 006 : C	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC TM 650 : 0	TEST METHODS MANUAL
IEC 61189-1:1997+AMD1:2001 CSV	TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
IPC PC 1990 : 1990	GENERAL REQUIREMENTS FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL
IEC 62326-4:1996	PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION
IPC A 610 : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
J STD 005 : A	REQUIREMENTS FOR SOLDERING PASTES
J STD 002 : D	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IEC 61760-2:2007	Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
IEC 61188-7:2017	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION
IEC 61190-1-1:2002	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
IEC 61189-3:2007	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
IEC 61188-5-6:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
IEC 61188-5-1:2002	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
IEC 60194:2015	PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
IEC 61188-5-5:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
ISO 9001:2015	Quality management systems — Requirements
IEC 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
IEC 61191-4:2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
IEC 62326-4-1:1996	PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B AND C
IPC OI 645 : 0	STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
IEC 61188-5-4:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS
IEC 61249-8-8:1997	MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS
IPC SM 817 : A	GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
J STD 020 : D-1	MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
IEC 61189-2:2006	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES
IEC 60721-3-1:1997	CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - PART 3-1: CLASSIFICATION OF GROUPS OF ENVIRONMENTAL PARAMETERS AND THEIR SEVERITIES - STORAGE
IEC 61190-1-3:2007+AMD1:2010 CSV	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 61191-3:2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES

Add To Cart

Product Format

Quantity

Buy Now

(Use this option to buy this Standard)

Add to Cart

(Use this option to add more Standards to your cart)

IEC 61191-1:2013

Table of Contents - (Show below) - (Hide below)

Abstract - (Show below) - (Hide below)

General Product Information - (Show below) - (Hide below)

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Standards Referenced By This Book - (Show below) - (Hide below)

Standards Referencing This Book - (Show below) - (Hide below)

Add To Cart

Publisher

Category

Sub Category

Looking for Subscription Services?