IEC 61191-1 : 2.0

Current

Current The latest, up-to-date edition.

PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES

Available format(s): Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

Language(s): English - French

Published date: 21-05-2013

Publisher: International Electrotechnical Committee

Table of Contents - (Show below) - (Hide below)

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Materials requirements
6 Components and printed board requirements
7 Assembly process requirements
8 Assembly soldering requirements
9 Cleanliness requirements
10 Assembly requirements
11 Coating and encapsulation
12 Rework and repair
13 Product quality assurance
14 Other requirements
15 Ordering data
Annex A (normative) - Requirements for soldering
tools and equipment
Annex B (normative) - Qualification of fluxes
Annex C (normative) - Quality assessment
Bibliography

Abstract - (Show below) - (Hide below)

Provides requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies.

General Product Information - (Show below) - (Hide below)

Committee	TC 91
Development Note	Stability date: 2015. (05/2013)
Document Type	Standard
ISBN
Pages
Published
Publisher	International Electrotechnical Committee
Status	Current
Superseded By	IEC 61191-1:2018

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
NF EN 61191-1 : 2014	Identical
SS-EN IEC 61191-1:2019	Identical
BS EN 61191-1 : 2013	Identical
CEI EN 61191-1 : 2014	Identical
DS EN 61191-1 : 2013	Identical
NF EN IEC 61191-1:2018	Identical
NEN EN IEC 61191-1 : 2013	Identical
DIN EN 61191-1 : 2015	Identical
UNE EN 61191-1 : 1998	Identical
PN EN 61191-1 : 2013	Identical
SN EN IEC 61191-1:2018	Identical
UNE-EN 61191-1:2013	Identical
GOST R IEC 61191-1 : 2010	Identical
SN EN 61191-1 : 1998	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

I.S. EN 61188-5-5:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
97/230541 DC : DRAFT AUG 1997
DIN EN 61191-3 : 2016	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
IEC 61192-3 : 1.0	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
BS EN 61193-1 : 2002	QUALITY ASSESSMENT SYSTEMS - REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
CECC 200025 : 1998	PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES
BS CECC200025(1998) : 1998	HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS - PROCESS ASSESSMENT SCHEDULE - PRINTED BOARD ASSEMBLY FACILITIES
BS EN 61192-4 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
BS EN 61188-5-5 : 2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
BS EN 61192-5 : 2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
BS EN 61192-2 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
BS EN 61191-6 : 2010	PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
05/30133283 DC : DRAFT MAY 2005	IEC 61190-1-2 ED 2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTE FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
CEI CECC 200025 : 2000	PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD ASSEMBLY FACILITIES
17/30352677 DC : 0	BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN
15/30329572 DC : 0	BS EN 61191-4 - PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61188-5-2:2003	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
BS EN 61192-1 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
UTEC 90 720-1 : 2000	ELECTRONIC ASSEMBLY TECHNOLOGY - MANUFACTURING LINE CERTIFICATION FOR ELECTRONIC BOARDS (QML) - PART 1: GUIDE FOR DESIGN AND MANUFACTURING OF ELECTRONIC ASSEMBLIES
BS EN 61190-1-1 : 2002	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
BS EN 61192-3 : 2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
BS EN 61188-5-4 : 2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
97/206324 DC : DRAFT MAY 1997
I.S. EN 61188-5-3:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
15/30328104 DC : DRAFT JULY 2015	BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
BS EN 61188-5-1 : 2002	PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
07/30169763 DC : 0	BS EN 62515 - EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA
NBR IEC 61191-3 : 2012	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
BS EN 61188-5-8 : 2008	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
NBR IEC 61192-1 : 2008	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
11/30255128 DC : 0	BS EN 61191-2 - PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
12/30258438 DC : 0	BS EN 61190-1-2 AMD 1ED.2 - ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
I.S. EN 61191-6:2010	PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
15/30330490 DC : 0	BS EN 61191-3 - PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
BS EN 61188-5-3 : 2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
DIN EN 61191-4 : 2016	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61192-3:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
NBR IEC 61191-4 : 2012	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61193-1:2002	QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
I.S. EN 61192-5:2007	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
CEI EN 61191-4 : 2005	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61192-1:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
BS EN 50548 : 2011	JUNCTION BOXES FOR PHOTOVOLTAIC MODULES
I.S. EN 61192-2:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - SURFACE-MOUNT ASSEMBLIES
I.S. EN 50548:2011	JUNCTION BOXES FOR PHOTOVOLTAIC MODULES
I.S. EN 61190-1-1:2002	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
I.S. EN 61192-4:2003	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
I.S. EN 61188-5-1:2002	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
I.S. EN 61188-5-8:2008	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
I.S. EN 61188-5-4:2007	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
NF EN 61191-2 : 2014	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
I.S. EN 61191-2:2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
EN 61191-2 : 2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
BS PD IEC TS 62647-1 : 2012	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN
BS EN 61191-3 : 2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
BS EN 61191-4 : 2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES (IEC 61191-4:2017)
IEC 61188-5-1 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
IEC 61191-2 : 3.0	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
17/30355792 DC : 0	BS EN 62790 AMENDMENT 1 - JUNCTION BOXES FOR PHOTOVOLTAIC MODULES - SAFETY REQUIREMENTS AND TESTS
IEC 61193-1 : 1.0	QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
IEC 61191-4 : 2.0	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
IEC 61188-5-3 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
BS EN 61188-5-2 : 2003	PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC 61190-1-1 : 1.0	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
IEC 61191-6 : 1.0	PRINTED BOARD ASSEMBLIES - PART 6: EVALUATION CRITERIA FOR VOIDS IN SOLDERED JOINTS OF BGA AND LGA AND MEASUREMENT METHOD
IEC PAS 62647-1 : 1.0	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
IEC 61188-5-4 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
BS EN 61191-2 : 2017	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
BS PD IEC/PAS 62647-1 : 2011	PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
IEC 61188-5-8 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-8: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - AREA ARRAY COMPONENTS (BGA, FBGA, CGA, LGA)
IEC 61192-1 : 1.0	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 1: GENERAL
IEC 61192-5 : 1.0	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
IEC 61192-4 : 1.0	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 4: TERMINAL ASSEMBLIES
IEC 61192-2 : 1.0	WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 2: SURFACE-MOUNT ASSEMBLIES
IEC 61188-5-5 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
IEC 61188-5-2 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC 61191-3 : 2.0	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
GEIA STD 0005-1 : 2012	PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
I.S. EN 61191-4:2017	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
I.S. EN 61191-3:2017	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
EN 61188-5-1 : 2002	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS

Standards Referencing This Book - (Show below) - (Hide below)

IEC 61193-3 : 1ED 2013	QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING
IEC 61193-1 : 1.0	QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
IEC 61188-5-3 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-3: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON TWO SIDES
IEC 61188-5-2 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
IEC 60068-2-58 : 4.1	ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
IEC 60068-2-20 : 5.0	ENVIRONMENTAL TESTING - PART 2-20: TESTS - TEST T: TEST METHODS FOR SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT OF DEVICES WITH LEADS
IEC PAS 62326-7-1 : 1.0	PERFORMANCE GUIDE FOR SINGLE- AND DOUBLE-SIDED FLEXIBLE PRINTED WIRING BOARDS
J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IEC 61190-1-2 : 3.0	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY
IEC 61340-5-1 : 2.0	ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
IEC 61188-1-1 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - GENERIC REQUIREMENTS - FLATNESS CONSIDERATIONS FOR ELECTRONIC ASSEMBLIES
IEC TR 61340-5-2 : 1.0	ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE
IEC 62326-1 : 2.0	PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
J STD 006 : C	REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IPC TM 650 : 0	TEST METHODS MANUAL
IEC 61189-1 : 1.1	TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
IPC PC 1990 : 1990	GENERAL REQUIREMENTS FOR IMPLEMENTATION OF STATISTICAL PROCESS CONTROL
IEC 62326-4 : 1.0	PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION
IPC A 610 : F	ACCEPTABILITY OF ELECTRONIC ASSEMBLIES
J STD 005 : A	REQUIREMENTS FOR SOLDERING PASTES
J STD 002 : D	SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
IEC 61760-2 : 2.0	SURFACE MOUNTING TECHNOLOGY - PART 2: TRANSPORTATION AND STORAGE CONDITIONS OF SURFACE MOUNTING DEVICES (SMD) - APPLICATION GUIDE
IEC 61188-7 : 2.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 7: ELECTRONIC COMPONENT ZERO ORIENTATION FOR CAD LIBRARY CONSTRUCTION
IEC 61190-1-1 : 1.0	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-1: REQUIREMENTS FOR SOLDERING FLUXES FOR HIGH-QUALITY INTERCONNECTIONS IN ELECTRONICS ASSEMBLY
IEC 61189-3 : 2.0	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
IEC 61188-5-6 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
IEC 61188-5-1 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
IEC 60194 : 6.0	PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS
IEC 61188-5-5 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-5: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH GULL-WING LEADS ON FOUR SIDES
ISO 9001:2015	QUALITY MANAGEMENT SYSTEMS - REQUIREMENTS
IEC 61191-2 : 3.0	PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
IEC 61191-4 : 2.0	PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
IEC 62326-4-1 : 1.0	PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION - PERFORMANCE LEVELS A, B AND C
IPC OI 645 : 0	STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
IEC 61188-5-4 : 1.0	PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-4: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - COMPONENTS WITH J LEADS ON TWO SIDES
J STD 003 : C	SOLDERABILITY TESTS FOR PRINTED BOARDS
IEC 61249-8-8 : 1.0	MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS
IPC SM 817 : A	GENERAL REQUIREMENTS FOR DIELECTRIC SURFACE MOUNTING ADHESIVES
J STD 020 : D-1	MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
IEC 61189-2 : 2.0	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 2: TEST METHODS FOR MATERIALS FOR INTERCONNECTION STRUCTURES
IEC 60721-3-1 : 2.0	CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - PART 3-1: CLASSIFICATION OF GROUPS OF ENVIRONMENTAL PARAMETERS AND THEIR SEVERITIES - STORAGE
IEC 61190-1-3 : 2.1	ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
IEC 61191-3 : 2.0	PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES

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IEC 61191-1 : 2.0

Table of Contents - (Show below) - (Hide below)

Abstract - (Show below) - (Hide below)

General Product Information - (Show below) - (Hide below)

International Equivalents – Equivalent Standard(s) & Relationship - (Show below) - (Hide below)

Standards Referenced By This Book - (Show below) - (Hide below)

Standards Referencing This Book - (Show below) - (Hide below)

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