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  • IEC 61192-2:2003

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  31-12-2021

    Language(s):  English - French

    Published date:  14-03-2003

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 General requirements
       4.1 Classification
       4.2 Conflict
       4.3 Interpretation of requirements
       4.4 Antistatic precautions
    5 Component preparation processes
    6 Solder paste deposition process qualification
       6.1 Solder paste characteristics
       6.2 Assessment of the process
       6.3 Solder paste deposition - Screen and stencil printing
            methods - Process control limits
    7 Non-conductive adhesive deposition process
       7.1 Pot life
       7.2 Inter-stage storage and handling
       7.3 Adhesive tackiness
       7.4 Assessment of the adhesive attachment process
       7.5 Adhesive deposition - Syringe dispensing method - Small
            components - Process control limits
    8 Temporary masking processes
    9 Component placement processes
       9.1 Assessment of the process
       9.2 Discrete components with gull-wing leads
       9.3 IC components with flat-ribbon, L- or gull-wing leads on
            two sides
       9.4 IC components with flat-ribbon, L- or gull-wing leads on
            four sides, for example, quad flat packs
       9.5 Components with round or flattened (coined) leads
       9.6 IC component packages with J-leads on two and four sides,
            for example, SOJ, PLCC
       9.7 Leadless rectangular components with metallized
            terminations
       9.8 Components with cylindrical endcap terminations
       9.9 Bottom-only terminations on leadless components
       9.10 Leadless chip carriers with castellated terminations
       9.11 Components with butt leads
       9.12 Components with inward L-shaped ribbon leads
       9.13 Flat-lug leads on power dissipating components
    10 Post-placement rework
       10.1 Rework of components placed on solder paste
       10.2 Rework of components placed on non-conductive adhesive
    11 Adhesive curing
    12 Soldering processes
    13 Cleaning processes
    14 Hand placement and hand soldering, including hand
       rework/repair
    15 Electrical test
    Annex A (normative)
       A.1 Introduction
       A.2 Example solder fillets and alignment: flat-ribbon, L- and
            gull-wing leads
       A.3 Example solder fillets and alignment: round or flattened
            (coined) leads
       A.4 Example solder fillets and alignment: J-leads
       A.5 Example solder fillets and alignment: rectangular or
            square end leadless components
       A.6 Example solder fillets and alignment: cylindrical end cap
            terminations, for example, MELFs
       A.7 Example solder fillets and alignment: bottom-only
            terminations on leadless components
       A.8 Example solder fillets and alignment: leadless chip
            carriers with castellated terminations
       A.9 Example solder fillets and alignment: butt joints
       A.10 Example solder fillets and alignment: inward L-shaped
            flat ribbon leads
       A.11 Example solder fillets and alignment: flat-lug leads on
            power dissipating components
    Figures

    Abstract - (Show below) - (Hide below)

    Specifies requirements for workmanship in soldered surface-mounted electronic assemblies and multichip modules on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. Applies to assemblies that are totally surface-mounted and to the surface-mount portions of assemblies that include other related assembly technologies, for example, through-hole mounting.

    General Product Information - (Show below) - (Hide below)

    Development Note To be used in conjunction with IEC 61192-1, IEC 61192-3 and IEC 61192-4. (03/2003) Stability Date: 2017. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Withdrawn

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies General
    BS EN 61188-5-1:2002 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Attachment (land/joint) considerations. Generic requirements
    I.S. EN 61193-1:2002 QUALITY ASSESSMENT SYSTEMS - PART 1: REGISTRATION AND ANALYSIS OF DEFECTS ON PRINTED BOARD ASSEMBLIES
    I.S. EN 61192-1:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - GENERAL
    IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
    EN 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
    I.S. EN 61192-3:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    BS EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies Terminal assemblies
    97/206324 DC : DRAFT MAY 1997
    UTEC 90 720-1 : 2000 ELECTRONIC ASSEMBLY TECHNOLOGY - MANUFACTURING LINE CERTIFICATION FOR ELECTRONIC BOARDS (QML) - PART 1: GUIDE FOR DESIGN AND MANUFACTURING OF ELECTRONIC ASSEMBLIES
    BS EN 61192-3:2003 Workmanship requirements for soldered electronic assemblies Through-hole mount assemblies
    BS 6221-25:2000 Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies
    I.S. EN 61192-4:2003 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - TERMINAL ASSEMBLIES
    I.S. EN 61188-5-1:2002 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    IEC 61192-5:2007 Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    97/230541 DC : DRAFT AUG 1997
    IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
    BS EN 61193-1:2002 Quality assessment systems Registration and analysis of defects on printed board assemblies
    BS EN 61192-5:2007 Workmanship requirements for soldered electric assemblies Rework, modification and repair of soldered electronic assemblies
    I.S. EN 61192-5:2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    EN 61193-1:2002 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
    EN 61192-5 : 2007 WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 5: REWORK, MODIFICATION AND REPAIR OF SOLDERED ELECTRONIC ASSEMBLIES
    EN 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    EN 61192-4:2003 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    NF EN 61188-5-1 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61193-1:2001 Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
    IEC 61192-3:2002 Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
    IEC 61192-4:2002 Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
    ISO 9002:1994 Quality systems — Model for quality assurance in production, installation and servicing
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC 61192-1:2003 Workmanship requirements for soldered electronic assemblies - Part 1: General
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    ISO 9001:2015 Quality management systems — Requirements
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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