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  • IEC 61249-2-35:2008

    Current The latest, up-to-date edition.

    Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  27-11-2008

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Materials and construction
       3.1 Resin system
       3.2 Metal foil
       3.3 Reinforcement
    4 Internal marking
    5 Electrical properties
    6 Non-electrical properties of the copper-clad laminate
       6.1 Appearance of the copper-clad sheet
           6.1.1 Indentations (pits and dents)
           6.1.2 Wrinkles
           6.1.3 Scratches
           6.1.4 Raised areas
           6.1.5 Surface waviness
       6.2 Appearance of the unclad face
       6.3 Laminate thickness
       6.4 Bow and twist
       6.5 Properties related to the copper foil bond
       6.6 Punching and machining
       6.7 Dimensional stability
       6.8 Sheet sizes
           6.8.1 Typical sheet sizes
           6.8.2 Tolerances for sheet sizes
       6.9 Cut panels
           6.9.1 Cut panel sizes
           6.9.2 Size tolerances for cut panels
           6.9.3 Rectangularity of cut panels
    7 Non-electrical properties of the base material after
       complete removal of the copper foil
       7.1 Appearance of the dielectric base material
       7.2 Flexural strength
       7.3 Flammability
       7.4 Water absorption
       7.5 Measling
       7.6 Glass transition temperature and cure factor
       7.7 Decomposition temperature
       7.8 Thermal resistance
       7.9 Z-axis expansion
    8 Quality assurance
       8.1 Quality system
       8.2 Responsibility for inspection
       8.3 Qualification inspection
       8.4 Quality conformance inspection
       8.5 Certificate of conformance
       8.6 Safety data sheet
    9 Packaging and marking
    10 Ordering information
    Annex A (informative) Engineering information
    Annex B (informative) Common laminate constructions
    Annex C (informative) Guideline for qualification and
            conformance inspection
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 61249-2-35:2008 gives requirements for properties of modified brominated epoxide woven E-glass laminate sheet 0,05 mm up to 3,2 mm, of defined flammability (vertical burning test), copper-clad. The glass transition temperature is defined to be 150 °C to 200 °C.

    General Product Information - (Show below) - (Hide below)

    Committee TC 91
    Development Note Stability Date: 2020. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 61249-4-15 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 60115-1 : 2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    CEI EN 60068-2-58 : 2016 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    I.S. EN 61249-4-15:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 61249-4-15:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    IEC 60115-1:2008 Fixed resistors for use in electronic equipment - Part 1: Generic specification
    I.S. EN 60115-1:2011 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
    BS EN 60068-2-58 : 2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    CEI EN 61249-4-15 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    EN 60115-1:2011/A11:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
    IEC 61249-4-15:2009 Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    I.S. EN 60068-2-58:2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    EN 60068-2-58:2015/A1:2018 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 11014-1:1994 Safety data sheet for chemical products Part 1: Content and order of sections
    IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
    ISO 14001:2015 Environmental management systems — Requirements with guidance for use
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    ISO 9000:2015 Quality management systems — Fundamentals and vocabulary
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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