IEC 60050-351:2013
|
International Electrotechnical Vocabulary (IEV) - Part 351: Control technology |
IEC 60747-4:2007+AMD1:2017 CSV
|
Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors |
IEC 60068-4:1987
|
Environmental testing. Part 4: Information for specification writers - Test summaries |
IEC 60050-31:1959
|
International Electrotechnical Vocabulary (IEV) - Part 31: Signalling and security apparatus for railways |
IEC 60050-541:1990
|
International Electrotechnical Vocabulary (IEV) - Part 541: Printed circuits |
IEC 60050-131:2002
|
International Electrotechnical Vocabulary (IEV) - Part 131: Circuit theory |
IEC 60050-394:2007
|
International Electrotechnical Vocabulary (IEV) - Part 394: Nuclear instrumentation - Instruments, systems, equipment and detectors |
IEC 60747-7:2010
|
Semiconductor devices - Discrete devices - Part 7: Bipolar transistors |
IEC 60068-2-5:2010
|
Environmental testing - Part 2-5: Tests - Test Sa: Simulated solar radiation at ground level and guidance for solar radiation testing |
IEC 60068-2-70:1995
|
Environmental testing - Part 2-70: Tests - Test Xb: Abrasion of markings and letterings caused by rubbing of fingers and hands |
IEC 60068-2-18:2017
|
Environmental testing - Part 2-18: Tests - Test R and guidance: Water |
IEC 60050-702:1992
|
International Electrotechnical Vocabulary (IEV) - Part 702: Oscillations, signals and related devices |
IEC 60747-7-2:1989
|
Semiconductor devices - Discrete devices - Part 7: Bipolartransistors - Section Two: Blank detail specification forcase-rated bipolar transistors for low-frequency amplification |
IEC 60068-2-43:2003
|
Environmental testing - Part 2-43: Tests - Test Kd: Hydrogen sulphide test for contacts and connections |
IEC 60068-2-68:1994
|
Environmental testing - Part 2-68: Tests - Test L: Dust and sand |
IEC 60050-731:1991
|
International Electrotechnical Vocabulary (IEV) - Part 731: Optical fibre communication |
IEC 60191-6:2009
|
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
IEC 60617-9:1996
|
Graphical symbols for diagrams - Part 9: Telecommunications - Switching and peripheral equipment |
IEC 60068-1:2013
|
Environmental testing - Part 1: General and guidance |
IEC 60191-1:2007
|
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
IEC 60050-806:1996
|
International Electrotechnical Vocabulary (IEV) - Part 806: Recording and reproduction of audio and video |
IEC 60748-5:1997
|
Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits |
IEC 60747-3:2013
|
Semiconductor devices - Part 3: Discrete devices: Signal, switching and regulator diodes |
IEC 60747-12-6:1997
|
Semiconductor devices - Part 12-6: Optoelectronic devices - Blank detail specification for avalanche photodiodes with/without pigtail, for fibre optic systems or subsystems |
IEC 60191-2R:1995
|
Sixteenth supplement |
IEC 60747-12:1991
|
Semiconductor devices - Part 12: Sectional specification foroptoelectronic devices |
IEC 60748-2-1:1991
|
Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays) |
IEC 60050-716-1:1995
|
International Electrotechnical Vocabulary (IEV) - Part 716-1: Integrated services digital network (ISDN) - General aspects |
IEC 60050-691:1973
|
International Electrotechnical Vocabulary (IEV) - Part 691: Tariffs for electricity |
IEC 60191-2G:1978
|
Seventh supplement |
IEC 60068-2-58:2015+AMD1:2017 CSV
|
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-27:2008
|
Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock |
IEC 60050-811:1991
|
International Electrotechnical Vocabulary (IEV) - Part 811: Electric traction |
IEC 60050-481:1996
|
International Electrotechnical Vocabulary (IEV) - Part 481: Primary cells and batteries |
IEC 60068-2-20:2008
|
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
IEC 60191-3C:1987
|
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Third supplement |
IEC 60050-531:1974
|
International Electrotechnical Vocabulary (IEV) - Part 531: Electronic tubes |
IEC 60068-3-1A:1978
|
Environmental testing - Part 3: Background information - First supplement |
IEC 60748-11-1:1992
|
Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits |
IEC 60068-2-60:2015 RLV
|
Environmental testing - Part 2-60: Tests - Test Ke: Flowing mixed gas corrosion test |
IEC 60068-5-2:1990
|
Environmental testing - Part 5-2: Guide to drafting of test methods - Terms and definitions |
IEC 60747-7-1:1989
|
Semiconductor devices - Discrete devices - Part 7: Bipolartransistors - Section One: Blank detail specification forambient-rated bipolar transistors for low and high-frequencyamplification |
IEC 60747-8-1:1987
|
Semiconductor devices - Discrete devices - Part 8: Field-effecttransistors - Section One: Blank detail specification forsingle-gate field-effect transistors up to 5 W and 1 GHz |
IEC 60050-605:1983
|
International Electrotechnical Vocabulary (IEV) - Part 605: Generation, transmission and distribution of electricity - Substations |
IEC 60050-601:1985
|
International Electrotechnical Vocabulary (IEV) - Part 601: Generation, transmission and distribution of electricity - General |
IEC 60050-721:1991
|
International Electrotechnical Vocabulary (IEV) - Part 721: Telegraphy, facsimile and data communication |
IEC 60617-10:1996
|
Graphical symbols for diagrams - Part 10: Telecommunications - Transmission |
IEC 60068-3-1:2011
|
Environmental testing - Part 3-1: Supporting documentation and guidance - Cold and dry heat tests |
IEC 60050-60:1970
|
International Electrotechnical Vocabulary (IEV) - Part 60: Radiocommunications. |
IEC 60050-471:2007
|
International Electrotechnical Vocabulary (IEV) - Part 471: Insulators |
IEC 60191-2D:1971
|
Fourth supplement |
IEC 60068-2-49:1983
|
Basic environmental testing procedures - Part 2-49: Tests - Guidance to test Kc: Sulphur dioxide test for contacts and connections |
ISO 2859:1974
|
Sampling procedures and tables for inspection by attributes |
IEC 60050-411:1996
|
International Electrotechnical Vocabulary (IEV) - Part 411: Rotating machinery |
IEC 60050-151:2001
|
International Electrotechnical Vocabulary (IEV) - Part 151: Electrical and magnetic devices |
ISO 1101:2017
|
Geometrical product specifications (GPS) — Geometrical tolerancing — Tolerances of form, orientation, location and run-out |
IEC 60617-3:1996
|
Graphical symbols for diagrams - Part 3: Conductors and connecting devices |
IEC 60748-2-7:1992
|
Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories |
IEC 60050-441:1984
|
International Electrotechnical Vocabulary (IEV) - Part 441: Switchgear, controlgear and fuses |
IEC 60068-2-21:2006
|
Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
IEC 60068-2-13:1983
|
Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure |
IEC 60068-2-57:2013
|
Environmental testing - Part 2-57: Tests - Test Ff: Vibration - Time-history and sine-beat method |
IEC 60068-2-50:1983
|
Environmental testing. Part 2: Tests. Tests Z/AFc: Combined cold/vibration (sinusoidal) tests for both heat-dissipating and non-heat-dissipating specimens |
IEC 60050-212:2010
|
International Electrotechnical Vocabulary (IEV) - Part 212: Electrical insulating solids, liquids and gases |
IEC 60191-2L:1982
|
Eleventh supplement |
IEC 60617-6:1996
|
Graphical symbols for diagrams - Part 6: Production and conversion of electrical energy |
IEC 60050-845:1987
|
International Electrotechnical Vocabulary (IEV) - Part 845: Lighting |
IEC 60068-5-1:1991
|
Environmental testing - Part 5-1: Guide to drafting of test methods - General principles |
IEC 60050-722:1992
|
International Electrotechnical Vocabulary (IEV) - Part 722: Telephony |
IEC 60068-3-2:1976
|
Basic environmental testing procedures - Part 3-2: Background information - Combined temperature/low air pressure tests |
IEC 60050-221:1990
|
International Electrotechnical Vocabulary (IEV) - Part 221: Magnetic materials and components |
IEC 60068-2-11:1981
|
Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist |
IEC 60050-486:1991
|
International Electrotechnical Vocabulary (IEV) - Part 486: Secondary cells and batteries |
IEC 60068-2-39:2015
|
Environmental testing - Part 2-39: Tests - Tests and guidance: Combined temperature or temperature and humidity with low air pressure tests |
IEC 60050-704:1993
|
International Electrotechnical Vocabulary (IEV) - Part 704: Transmission |
IEC 60191-1B:1970
|
Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Second supplement |
IEC 60747-12-5:1997
|
Semiconductor devices - Part 12-5: Optoelectronic devices - Blank detail specification for pin-photodiodes with/without pigtail, for fibre optic systems or subsystems |
IEC 60747-2-1:1989
|
Semiconductor devices - Discrete devices - Part 2: Rectifier diodes- Section One: Blank detail specification for rectifier diodes(including avalanche rectifier diodes), ambient and case-rated, upto 100 A |
IEC 60050-891:1998
|
International Electrotechnical Vocabulary (IEV) - Part 891: Electrobiology |
IEC 60068-2-66:1994
|
Environmental testing - Part 2: Test methods - Test Cx: Damp heat, steady state (unsaturated pressurized vapour) |
IEC 60747-2-2:1993
|
Semiconductor devices - Discrete devices - Part 2: Rectifier diodes - Section 2: Blank detail specification for rectifier diodes (including avalanche rectifier diodes), ambient and case-rated, for currents greater than 100 A |
IEC 60747-10:1991
|
Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits |
IEC 60191-2F:1976
|
Sixth supplement |
IEC 60748-2-6:1991
|
Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section Six: Blank detail specification for microprocessor integrated circuits |
IEC 60747-7-3:1991
|
Semiconductor devices - Discrete devices - Part 7: Bipolartransistors - Section three: Blank detail specification for bipolartransistors for switching applications |
IEC 60068-2-31:2008
|
Environmental testing - Part 2-31: Tests - Test Ec: Rough handling shocks, primarily for equipment-type specimens |
IEC 60191-2K:1981
|
Tenth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
IEC 60747-5-2:1997+AMD1:2002 CSV
|
Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics |
IEC 60748-4-2:1993
|
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC) |
IEC 60050-551:1998
|
International Electrotechnical Vocabulary (IEV) - Part 551: Power electronics |
IEC 60191-1A:1969
|
Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - First supplement |
IEC 60068-2-64:2008
|
Environmental testing - Part 2-64: Tests - Test Fh: Vibration, broadband random and guidance |
IEC 60068-2-53:2010
|
Environmental testing - Part 2-53: Tests and guidance - Combined climatic (temperature/humidity) and dynamic (vibration/shock) tests |
IEC 60027-1:1992
|
Letters symbols to be used in electrical technology - Part 1: General |
IEC 60191-1C:1974
|
Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Third supplement |
IEC 60191-2:2012 DB
|
Mechanical standardization of semiconductor devices - Part 2: Dimensions |
IEC 60068-2-67:1995
|
Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components |
IEC 60068-3-3:1991
|
Environmental testing - Part 3-3: Guidance - Seismic test methods for equipments |
IEC 60747-5-3:1997+AMD1:2002 CSV
|
Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods |
IEC 60050-801:1994
|
International Electrotechnical Vocabulary (IEV) - Part 801: Acoustics and electroacoustics |
IEC 60050-426:2008
|
International Electrotechnical Vocabulary (IEV) - Part 426: Equipment for explosive atmospheres |
IEC 60747-3-1:1986
|
Semiconductor devices - Discrete devices - Part 3: Signal(including switching) and regulator diodes - Section One: Blankdetail specification for signal diodes, switching diodes andcontrolled-avalanche diodes |
IEC 60191-2H:1978
|
Eigth supplement |
IEC 60191-3B:1978
|
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement |
IEC 60068-2-38:2009
|
Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test |
IEC 60617-5:1996
|
Graphical symbols for diagrams - Part 5: Semiconductors and electron tubes |
IEC 61747-5:1998
|
Liquid crystal and solid-state display devices - Part 5: Environmental, endurance and mechanical test methods |
IEC 60747-12-3:1998
|
Semiconductor devices - Part 12-3: Optoelectronic devices - Blank detail specification for light-emitting diodes- Display application |
IEC 60410:1973
|
Sampling plans and procedures for inspection by attributes |
IEC 60191-2A:1967
|
First supplement to Publication 191-2 (1966)Mechanical standardization of semiconductor devices - Part 2: DimensionsPart 2: Dimensions |
IEC 60191-2B:1969
|
Second supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
IEC 60050-715:1996
|
International Electrotechnical Vocabulary (IEV) - Part 715: Telecommunication networks, teletraffic and operation |
IEC 60747-3-2:1986
|
Semiconductor devices - Discrete devices - Part 3: Signal(including switching) and regulator diodes - Section Two: Blankdetail specification for voltage-regulator diodes andvoltage-reference diodes,excluding temperature-compensatedprecision reference diodes |
IEC 60068-2-47:2005
|
Environmental testing - Part 2-47: Test - Mounting of specimens for vibration, impact and similar dynamic tests |
IEC 60748-11:1990
|
Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits |
IEC 60068-2-3:1969
|
Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state |
IEC 60050-55:1970
|
International Electrotechnical Vocabulary (IEV) - Part 55: Telegraphy and telephony |
IEC 60747-8:2010
|
Semiconductor devices - Discrete devices - Part 8: Field-effect transistors |
IEC 60050-131A:1982
|
International Electrotechnical Vocabulary (IEV) - Part 131A: Electric and magnetic circuits - Polyphase circuits and components |
ISO 8601:2004
|
Data elements and interchange formats Information interchange Representation of dates and times |
IEC 60050-421:1990
|
International Electrotechnical Vocabulary (IEV) - Part 421: Power transformers and reactors |
IEC 60050-701:1988
|
International Electrotechnical Vocabulary (IEV) - Part 701: Telecommunications, channels and networks |
IEC 60068-2-54:2006
|
Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method |
IEC 60050-603:1986
|
International Electrotechnical Vocabulary (IEV) - Part 603: Generation, transmission and distribution of electricity - Power systems planning and management |
IEC 60027-3:2002
|
Letter symbols to be used in electrical technology - Part 3: Logarithmic and related quantities, and their units |
IEC 60050-714:1992
|
International Electrotechnical Vocabulary (IEV) - Part 714: Switching and signalling in telecommunications |
IEC 60050-466:1990
|
International Electrotechnical Vocabulary (IEV) - Part 466: Overhead lines |
IEC 60747-12-2:1995
|
Semiconductor devices - Part 12: Optoelectronic devices - Section 2: Blank detail specification for laser diode modules with pigtail for fibre optic systems and sub-systems |
IEC 60050-446:1983
|
International Electrotechnical Vocabulary (IEV) - Part 446: Electrical relays |
IEC 60068-2-17:1994
|
Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing |
IEC 60617-1:1985
|
Graphical symbols for diagrams. Part 1: General information, general index. Cross-reference tables |
IEC 60191-2J:1980
|
Ninth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
IEC 60068-2-10:2005
|
Environmental testing - Part 2-10: Tests - Test J and guidance: Mould growth |
IEC 60191-2S:1995
|
Seventeenth supplement |
IEC 60068-2-2:2007
|
Environmental testing - Part 2-2: Tests - Test B: Dry heat |
IEC 60747-8-3:1995
|
Semiconductor devices - Discrete devices - Part 8: Field-effect transistors - Section 3: Blank detail specification for case-rated field effect transistors for switching applications |
IEC 60068-2-9:1975
|
Environmental testing - Part 2: Tests. Guidance for solar radiation testing |
IEC 60747-1:2006+AMD1:2010 CSV
|
Semiconductor devices - Part 1: General |
IEC 60050-821:1998
|
International Electrotechnical Vocabulary (IEV) - Part 821: Signalling and security apparatus for railways |
IEC 60748-2-5:1992
|
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section five: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB) |
IEC 60617-13:1993
|
Graphical symbols for diagrams - Part 13: Analogue elements |
IEC 60068-2-61:1991
|
Environmental testing - Part 2-61: Test methods - Test Z/ABDM:Climatic sequence |
IEC 60191-3D:1988
|
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Fourth supplement |
IEC 60050-726:1982
|
International Electrotechnical Vocabulary (IEV) - Part 726: Transmission lines and waveguides |
IEC 60191-2C:1970
|
Third supplement |
IEC 60050-841:2004
|
International Electrotechnical Vocabulary (IEV) - Part 841: Industrial electroheat |
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV
|
Semiconductor devices - Mechanical and climatic test methods |
IEC 60617-7:1996
|
Graphical symbols for diagrams - Part 7: Switchgear, controlgear and protective devices |
IEC 60617-8:1996
|
Graphical symbols for diagrams - Part 8: Measuring instruments, lamps and signalling devices |
IEC 60068-2-42:2003
|
Environmental testing - Part 2-42: Tests - Test Kc: Sulphur dioxide test for contacts and connections |
IEC 60747-12-4:1997
|
Semiconductor devices - Part 12-4: Optoelectronic devices - Blank detail specification for pin-FET modules with/without pigtail, for fibre optic systems or subsystems |
IEC 60050-121:1998
|
International Electrotechnical Vocabulary (IEV) - Part 121: Electromagnetism |
IEC 60050-321:1986
|
International Electrotechnical Vocabulary (IEV) - Part 321: Instrument transformers |
IEC 60050-461:2008
|
International Electrotechnical Vocabulary (IEV) - Part 461: Electric cables |
IEC 60191-2Q:1990
|
fifteenth complement |
IEC 60748-4-1:1993
|
Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC) |
IEC 60050-561:2014
|
International Electrotechnical Vocabulary (IEV) - Part 561: Piezoelectric, dielectric and electrostatic devices and associated materials for frequency control, selection and detection |
IEC 60191-3A:1976
|
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement |
IEC 60748-2-9:1994
|
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories |
IEC 60050-826:2004
|
International Electrotechnical Vocabulary (IEV) - Part 826: Electrical installations |
IEC 60748-22:1997
|
Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
IEC 60748-1:2002
|
Semiconductor devices - Integrated circuits - Part 1: General |
IEC 60068-2-75:2014
|
Environmental testing - Part 2-75: Tests - Test Eh: Hammer tests |
IEC 60748-3-1:1991
|
Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiers |
IEC 60027-2:2005
|
Letter symbols to be used in electrical technology - Part 2: Telecommunications and electronics |
IEC 60068-2-29:1987
|
Environmental testing. Part 2: Tests. Test Eb and guidance: Bump |
IEC 60748-2-10:1994
|
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories |
IEC 60747-5-1:1997+AMD1:2001+AMD2:2002 CSV
|
Discrete semiconductor devices and integrated circuits - Part 5-1: Optoelectronic devices - General |
IEC 60068-2-28:1990
|
Environmental testing - Part 2: Tests. Guidance for damp heat tests |
IEC 60748-2:1997
|
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits |
IEC 60068-2-8:1960
|
Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test H: Storage |
IEC 60617-4:1996
|
Graphical symbols for diagrams - Part 4: Passive components |
IEC 60191-4:2013
|
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
IEC 60191-5:1997
|
Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB) |
IEC 60050-26:1968
|
International Electrotechnical Vocabulary (IEV) - Part 26: Nuclear power plants for electric energy generation |
IEC 60191-3F:1994
|
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Sixth supplement |
IEC 60748-20-1:1994
|
Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination |
IEC 60068-2-1:2007
|
Environmental testing - Part 2-1: Tests - Test A: Cold |
IEC 60050-111:1996
|
International Electrotechnical Vocabulary (IEV) - Part 111: Physics and chemistry |
IEC 60747-8-2:1993
|
Semiconductor devices - Discrete devices - Part 8: Field-effect transistors - Section two: Blank detail specification for field-effect transistors for case-rated power amplifier applications |
IEC 60748-2-8:1993
|
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section Eight: Blank detail specification for integrated circuit static read/write memories |
IEC 60027-4:2006
|
Letter symbols to be used in electrical technology - Part 4: Rotating electric machines |
IEC 60191-2U:1997
|
Nineteenth supplement |
IEC 60747-6:2016
|
Semiconductor devices - Part 6: Discrete devices - Thyristors |
IEC 60068-2-48:1982
|
Environmental testing - Part 2: Tests. Guidance on the application of the tests of IEC 68 to simulate the effects of storage |
IEC 60068-2-55:2013
|
Environmental testing - Part 2-55: Tests - Test Ee and guidance - Loose cargo testing including bounce |
IEC 60050-705:1995
|
International Electrotechnical Vocabulary (IEV) - Part 705: Radio wave propagation |
IEC 60050-602:1983
|
International Electrotechnical Vocabulary (IEV) - Part 602: Generation, transmission and distribution of electricity - Generation |
IEC 60748-21-1:1997
|
Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approva lprocedures |
IEC 60050-521:2002
|
International Electrotechnical Vocabulary (IEV) - Part 521: Semiconductor devices and integrated circuits |
IEC 60068-2-44:1995
|
Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
IEC 60748-21:1997
|
Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures |
IEC 60191-2N:1987
|
Thirteenth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions |
IEC 60050-448:1995
|
International Electrotechnical Vocabulary (IEV) - Part 448: Power system protection |
IEC 60027-2B:1980
|
Letter symbols to be used in electrical technology - Part 2: Telecommunications and electronics |
IEC 60068-2-14:2009
|
Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
IEC 60748-3:1986
|
Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits |
IEC 60191-3:1999
|
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits |
IEC 60050-712:1992
|
International Electrotechnical Vocabulary (IEV) - Part 712: Antennas |
IEC 60050-851:2008
|
International Electrotechnical Vocabulary (IEV) - Part 851: Electric welding |
IEC 60748-2-4:1992
|
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section four: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB |
IEC 60747-12-1:1995
|
Semiconductor devices - Part 12: Optoelectronic devices - Section 1: Blank detail specification for light emitting/infrared emitting diodes with/without pigtail for fibre optic systems and sub-systems |
IEC 60747-6-3:1993
|
Semiconductor devices - Discrete devices - Part 6: Thyristors - Section Three: Blank detail specification for reverse blocking triode thyristors, ambient and case-rated, for currents greater than 100 A |
IEC 60050-581:2008
|
International Electrotechnical Vocabulary (IEV) - Part 581: Electromechanical components for electronic equipment |
IEC 60068-2-52:2017
|
Environmental testing - Part 2-52: Tests - Test Kb: Salt mist, cyclic (sodium chloride solution) |
IEC 60050-723:1997
|
International Electrotechnical Vocabulary (IEV) - Part 723: Broadcasting: Sound, television, data |
IEC 60068-2-65:2013
|
Environmental testing - Part 2-65: Tests - Test Fg: Vibration - Acoustically induced method |
IEC 60747-11:1985
|
Semiconductor devices. Discrete devices. Part 11: Sectionalspecification for discrete devices |
IEC 60050-881:1983
|
International Electrotechnical Vocabulary (IEV) - Part 881: Radiology and radiological physics |
IEC 60068-2-69:2017
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Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
IEC 60027-2A:1975
|
Letter symbols to be used in electrical technology - Part 2: Telecommunications and electronics - First supplement |
IEC 60747-2:2016
|
Semiconductor devices - Part 2: Discrete devices - Rectifier diodes |
IEC 60050-371:1984
|
International Electrotechnical Vocabulary (IEV) - Part 371: Telecontrol |
IEC 60191-3E:1990
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Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Fifth supplement |
IEC 60748-4:1997
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Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits |
IEC 60191-2P:1988
|
Fourteenth supplement |
IEC 60617-11:1996
|
Graphical symbols for diagrams - Part 11: Architectural and topographical installation plans and diagrams |
IEC 60068-2-51:1983
|
Environmental testing. Part 2: Tests. Tests Z/BFc: Combined dry heat/vibration (sinusoidal) tests for both heat-dissipating and non-heat-dissipating specimens |
IEC 60050-393:2003
|
International Electrotechnical Vocabulary (IEV) - Part 393: Nuclear instrumentation - Physical phenomena and basic concepts |
IEC 60617-2:1996
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Graphical symbols for diagrams - Partie 2: Symbol elements, qualifying symbols and other symbols having general application |
IEC 60191-2M:1983
|
Twelfth supplement |
IEC 60191-2E:1974
|
Fifth supplement |
IEC 60747-6-2:1991
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Semiconductor devices - Discrete devices - Part 6: Thyristors -Section Two: Blank detail specification for bidirectional triodethyristors (triacs), ambient or case-rated, up to 100 A |
IEC 60617-12:1997
|
Graphical symbols for diagrams - Part 12: Binary logic elements |
IEC 60747-6-1:1989
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Semiconductor devices - Discrete devices - Part 6: Thyristors -Section One: Blank detail specification for reverse blocking triodethyristors, ambient and case-rated, up to 100 A |
IEC 60068-2-46:1982
|
Basic environmental testing procedures - Part 2-46: Tests - Guidance to test Kd: Hydrogen sulphide test for contacts and connections |
IEC 60050-725:1994
|
International Electrotechnical Vocabulary (IEV) - Part 725: Space radiocommunications |
IEC 60068-2-59:1990
|
Environmental testing. Part 2: Tests. Test Fe: Vibration - Sine-beat method |
IEC 60748-22-1:1997
|
Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures |
IEC 60191-2T:1996
|
Eighteenth supplement |
IEC 60068-2-56:1988
|
Environmental testing - Part 2: Tests. Test Cb: Damp heat, steady state, primarily for equipment |
IEC 60068-2-30:2005
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Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle) |