• IEC 62047-15:2015

    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

    Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  12-09-2022

    Language(s):  English - French

    Published date:  05-03-2015

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Testing method
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 62047-15:2015 describes test method for bonding strength between poly dimethyl siloxane (PDMS) and glass. Silicone-based rubber, PDMS, is used for building of chip-based microfluidic devices fabricated using lithography and replica moulding processes. The problem of bonding strength is mainly for high pressure applications as in the case of certain peristaltic pump designs where an off chip compressed air supply is used to drive the fluids in micro channels created by a twin layer, one formed by bondage between glass with replica moulded PDMS and another between PDMS and PDMS. Also, in case of systems having pneumatic microvalves, a relatively high level of bonding particularly between two replica moulded layers of PDMS becomes quite necessary. Usually there is a leakage and debonding phenomena between interface of bonded areas, which causes unstability and shortage of lifetime for MEMS devices. This standard specifies general procedures on bonding test of PDMS and glass chip.

    General Product Information - (Show below) - (Hide below)

    Development Note Stability date: 2017. (03/2015)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Withdrawn

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
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