Skip to content
Please enter a keyword to search

  • IEC 62047-2:2006

    Current The latest, up-to-date edition.

    Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  15-08-2006

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Symbols and designations
    4 Testing method and test apparatus
      4.1 Method of gripping
      4.2 Method of loading
      4.3 Speed of testing
      4.4 Force measurement
      4.5 Elongation measurement
      4.6 Stress-strain curve
      4.7 Environment control
    5 Test piece
      5.1 General
      5.2 Plane shape of test piece
      5.3 Test piece thickness
      5.4 Gauge mark
    6 Test report
    Annex A (informative) Test piece grip methods
    Annex B (normative) Testing conditions
    Annex C (informative) Test piece

    Abstract - (Show below) - (Hide below)

    Specifies the method for tensile testing of thin film materials with length and width under 1 mm and thickness under 10 m, which are main structural materials for micro-electromechanical systems (MEMS), micromachines and similar devices. The main structural materials for MEMS, micromachines and similar devices have special features such as typical dimensions in the order of a few microns, a material fabrication by deposition, and a test piece fabrication by non-mechanical machining using etching and photolithography. This International Standard specifies the testing method, which enables a guarantee of accuracy corresponding to the special features.

    General Product Information - (Show below) - (Hide below)

    Development Note Stability Date: 2018. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    CEI EN 62047-9 : 2012 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
    BS EN 62047-22:2014 Semiconductor devices. Micro-electromechanical devices Electromechanical tensile test method for conductive thin films on flexible substrates
    NF EN 62047-13 : 2012 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR-TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES
    I.S. EN 62047-13:2012 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR-TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES (IEC 62047-13:2012 (EQV))
    08/30172398 DC : DRAFT FEB 2008 BS EN 62047-8 - SEMICONDUCTOR DEVICES - MICRO - ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS
    17/30352696 DC : DRAFT SEP 2017 BS IEC 62047-31 ED1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 31: FOUR-POINT BENDING TEST METHOD FOR INTERFACIAL ADHESION ENERGY OF LAYERED MEMS MATERIALS
    10/30211442 DC : 0 BS EN 62047-10 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 10: MICROPILLAR COMPRESSION TEST FOR MEMS MATERIALS
    I.S. EN 62047-3:2006 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
    EN 62047-13:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
    EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
    EN 62047-12 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES (IEC 62047-12:2011)
    10/30211454 DC : 0 BS EN 62047-13 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR- TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES
    11/30230316 DC : 0 BS EN 62047-18 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BENDING TEST METHODS OF THIN FILM MATERIALS
    NF EN 62047-17 : 2015 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS
    BS EN 62047-17:2015 Semiconductor devices. Micro-electromechanical devices Bulge test method for measuring mechanical properties of thin films
    05/30104054 DC : DRAFT APR 2005 IEC 62047-3 - SEMICONDUCTOR DEVICES - PART 3: MICRO ELECTROMECHANICAL DEVICES - THIN FILM STANDARD TEST PIECE
    BS EN 62047-9:2011 Semiconductor devices. Micro-electromechanical devices Wafer to wafer bonding strength measurement for MEMS
    CEI EN 62047-13 : 2013 SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 13: BEND- AND SHEAR- TYPE TEST METHODS OF MEASURING ADHESIVE STRENGTH FOR MEMS STRUCTURES
    CEI EN 62047-3 : 2007 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
    I.S. EN 62047-22:2014 SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES
    CEI EN 62047-12 : 2012 SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES
    BS EN 62047-6:2010 Semiconductor devices. Micro-electromechanical devices Axial fatigue testing methods of thin film materials
    BS EN 62047-13:2012 Semiconductor devices. Micro-electromechanical devices Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
    NF EN 62047-6 : 2010 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS
    IEC 62047-6:2009 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials
    IEC 62047-29:2017 Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
    BS EN 62047-12:2011 Semiconductor devices. Micro-electromechanical devices Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
    07/30163302 DC : 0 BS EN 62047-6 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS
    I.S. EN 62047-17:2015 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS
    BS EN 62047-8:2011 Semiconductor devices. Micro-electromechanical devices Strip bending test method for tensile property measurement of thin films
    BS EN 62047-3:2006 Semiconductor devices. Micro-electromechanical devices Thin film standard test piece for tensile testing
    I.S. EN 62047-6:2010 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS
    CEI EN 62047-6 : 2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 6: AXIAL FATIGUE TESTING METHODS OF THIN FILM MATERIALS
    CEI EN 62047-17 : 2016 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS
    I.S. EN 62047-9:2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 9: WAFER TO WAFER BONDING STRENGTH MEASUREMENT FOR MEMS
    IEC 62047-12:2011 Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
    IEC 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
    IEC 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
    IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
    EN 62047-17:2015 Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films
    EN 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
    10/30205425 DC : 0 BS IEC 62047-12 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: A METHOD FOR FATIGUE TESTING THIN FILM MATERIALS USING THE RESONANT VIBRATION OF A MEMS STRUCTURE
    CEI EN 62047-8 : 2012 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS
    15/30319018 DC : 0 BS EN 62951-1 ED 1.0 - SEMICONDUCTOR DEVICES - FLEXIBLE AND STRETCHABLE SEMICONDUCTOR DEVICES - PART 1: BENDING TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES
    14/30259233 DC : 0 BS EN 62047-16 ED 1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 16: TEST METHODS FOR DETERMINING RESIDUAL STRESSES OF MEMS FILMS; WAFER CURVATURE AND CANTILEVER BEAM DEFLECTION METHODS
    11/30231583 DC : 0 BS EN 62047-17 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 17: BULGE TEST METHOD FOR MEASURING MECHANICAL PROPERTIES OF THIN FILMS
    IEC 62951-1:2017 Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
    I.S. EN 62047-8:2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 8: STRIP BENDING TEST METHOD FOR TENSILE PROPERTY MEASUREMENT OF THIN FILMS
    I.S. EN 62047-12:2011 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES (IEC 62047-12:2011)
    IEC 62047-13:2012 Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures
    IEC 62047-22:2014 Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates
    IEC 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
    EN 62047-9:2011 Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS
    EN 62047-3 : 2006 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
    EN 62047-6:2010 Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 6892:1998 Metallic materials Tensile testing at ambient temperature
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective