Skip to content
Please enter a keyword to search

  • IEC 62326-4:1996

    Current The latest, up-to-date edition.

    Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French, Spanish, Castilian

    Published date:  19-12-1996

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    Foreword
    Introduction
    1 Scope
    2 Normative references
    3 General
    4 Capability approval and maintenance of capability
        approval
    5 Test specimens
    6 Test sequence
    7 Quality assessment
    8 Customer detail specification (CDS) data
    9 Characteristics of printed boards
    10 Capability test programme
    11 Quality conformance inspection
    12 Test specimens
    Figures
    1 Resin smear at interface
    2 Circumferential defects
    3 Conductor pattern defects
    4 Minimum annular width (W1) of external land
    5 Minimum annular width (W2) of internal land
    6 Hole break-out
    7 Examples of soldered holes
    Annexes
    A Acronyms related to IECQ and their explanations
    B Conversion table
    C Bibliography

    Abstract - (Show below) - (Hide below)

    Applicable to rigid multilayer printed boards irrespective of theirmethod of manufacture. It is the basis on which agreements betweenmanufacturer and user are to be made.Provides additional information necessary to supplement therequirements of the Generic Specification, IEC 62326-1, for theprinted boards intended to be accepted under the IECQ system.Establishes uniform requirements, specifies the characteristics tobe assessed and the test methods to be used for qualityconformance.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes IEC 60326-6 (03/2001) Also numbered as BS EN 62326-4 and QC 230500. (09/2005) Stability Date: 2018. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 61249-4-15:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 61249-4-19:2013 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    CEI EN 61249-4-11 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 62326-20:2016 PRINTED BOARDS - PART 20: PRINTED CIRCUIT BOARDS FOR HIGHBRIGHTNESS LEDS
    CEI EN 61249-4-12 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    BS EN 16602-70-10:2015 Space product assurance. Qualification of printed circuit boards
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    IEC 62326-1:2002 Printed boards - Part 1: Generic specification
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1:2013 Printed board assemblies Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    EN 62326-1:2002 Printed boards - Part 1: Generic specification
    EN 61249-4-5:2005 Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
    EN 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    NF EN 60352-5 : 2012 SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
    EN 61249-4-15 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    EN 61249-4-2:2005 Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    EN 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
    EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    BS EN 61249-4-18:2013 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 61249-4-16:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    CEI EN 61249-4-16 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 61249-4-12:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability
    BS EN 61249-4-5:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability
    BS EN 62326-20:2016 Printed boards Printed circuit boards for high-brightness LEDs
    00/243930 DC : DRAFT AUG 2000 IEC 60079-18. ED. 2. ELECTRICAL APPARATUS FOR EXPLOSIVE ATMOSPHERES - PART 18: ENCAPSULATION 'M'
    I.S. EN 60352-5:2012-2015-10 SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012 (EQV))
    CEI EN 61249-4-2 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES PART 4-2: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    NF EN 61193-3 : 2013 QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING
    I.S. EN 16602-70-10:2015 SPACE PRODUCT ASSURANCE - QUALIFICATION OF PRINTED CIRCUIT BOARDS
    CEI EN 61249-4-14 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    I.S. EN 61193-3:2013 QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING (IEC 61193-3:2013 (EQV))
    I.S. EN 61249-4-12:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-12: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 61249-4-1:2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    IEC 61249-4-14:2009 Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    IEC 61249-4-5:2005 Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
    BS EN 60352-5:2012 Solderless connections Press-in connections. General requirements, test methods and practical guidance
    CEI EN 60352-5 : 2013 SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
    I.S. EN 61249-4-15:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 61249-4-17:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards). Epoxide woven E-glass prepreg of defined flammability
    09/30204447 DC : 0 BS EN 60352-5 - SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE
    BS EN 61193-3:2013 Quality assessment systems Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
    CEI EN 62326-1 : 2002 PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
    IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
    I.S. EN 61189-3:2008 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
    IEC 61249-4-19:2013 Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
    IEC 61249-4-16:2009 Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    CEI EN 61249-4-19 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HICH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-4-17 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-4-16:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-16: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-4-15 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-15: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    NF EN 62326 4-1 : 1998 PRINTED BOARDS - PART 4: RIGID MULTILAYER PRINTED BOARDS WITH INTERLAYER CONNECTIONS - SECTIONAL SPECIFICATION - SECTION 1: CAPABILITY DETAIL SPECIFICATION PERFORMANCE LEVELS A, B AND C
    BS EN 61249-4-2:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Multifunctional expoxide woven E-glass prepeg of defined flammability
    09/30178203 DC : 0 BS EN 61193-3, ED.1 - QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING
    I.S. EN 61249-4-19:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-19: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-4-17:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-17: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - NON-HALOGENATED EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    EN 60352-5:2012/AC:2014 SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012)
    15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC 61249-4-15:2009 Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    IEC 61193-3:2013 Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
    IEC 61249-4-12:2005 Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
    IEC 61249-4-2:2005 Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
    IEC 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    IEC 60352-5:2012 Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    EN 16602-70-10:2015 Space product assurance - Qualification of printed circuit boards
    CEI EN 61249-4-1 : 2010 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    BS EN 61249-4-14:2009 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    BS EN 62326-4-1:1997 Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification Capability detail specification. Performance levels, A, B and C
    BS EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
    I.S. EN 61249-4-11:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-11: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - NON-HALOGENATED EPOXIDE, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 61249-4-14:2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    BS EN 61249-4-11:2005 Materials for printed boards and other interconnecting structures Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability
    I.S. EN 61249-4-18:2013 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    I.S. EN 61249-4-5:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    CEI EN 61249-4-18 : 2014 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-18: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - HIGH PERFORMANCE EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY
    CEI EN 61249-4-5 : 2006 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-5: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - POLYIMIDE, MODIFIED OR UNMODIFIED, WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    I.S. EN 62326-1:2002 PRINTED BOARDS - GENERIC SPECIFICATION
    I.S. EN 61249-4-2:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-2: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD - MULTIFUNCTIONAL EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
    EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    IEC 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    IEC 61249-4-18:2013 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    IEC 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    IEC 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
    EN 61249-4-18 : 2013 Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    EN 61249-4-1:2008 Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
    EN 62326-20:2016 Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
    EN 61249-4-12:2005 Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
    EN 61249-4-17:2009 Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
    EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    EN 61249-4-11:2005 Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
    EN 61249-4-14 : 2009 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-14: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST) FOR LEAD-FREE ASSEMBLY

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 62326-1:2002 Printed boards - Part 1: Generic specification
    IEC 61249-5-1:1995 Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
    IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
    IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
    IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective