• IEC 62739-1:2013

    Current The latest, up-to-date edition.

    Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  18-06-2013

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Test
    5 Method of erosion depth measurement
      (focal depth method with optical microscope)
    6 Items to be recorded in test report
    Annex A (normative) - Specifications of test
            equipment & measurement equipment
    Annex B (informative) - Method of estimation of
            maximum erosion depth by extreme
            value statistical analysis
    Bibliography

    Abstract - (Show below) - (Hide below)

    IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.

    General Product Information - (Show below) - (Hide below)

    Development Note Stability date: 2018. (06/2013)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
    BS EN 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Erosion test method for metal materials with surface processing
    BS EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy Selection guidance of erosion test methods
    I.S. EN 62739-2:2016 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 2: EROSION TEST METHOD FOR METAL MATERIALS WITH SURFACE PROCESSING
    IEC 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
    CEI EN 62739-3 : 1ED 2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
    IEC 62739-2:2016 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 2: Erosion test method for metal materials with surface processing
    I.S. EN 62739-3:2017 TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHODS
    16/30338642 DC : 0 BS EN 62739-3 - TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 3: SELECTION GUIDANCE OF EROSION TEST METHOD
    EN 62739-3:2017 Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    ISO 16143-3:2014 Stainless steels for general purposes Part 3: Wire
    ISO 16143-2:2014 Stainless steels for general purposes Part 2: Corrosion-resistant semi-finished products, bars, rods and sections
    ISO 16143-1:2014 Stainless steels for general purposes Part 1: Corrosion-resistant flat products
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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