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  • IEC TS 61945:2000

    Current The latest, up-to-date edition.

    Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English - French

    Published date:  10-03-2000

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    Clause
    1 Scope and object
    2 Normative references
    3 Terms
    4 Classification of technology analysis
       4.1 First level: General visual inspection
            (AT1 test)
       4.2 Second level: Detailed visual inspection
            (AT2 test)
       4.3 Third level: Scanning electron microscope
            examination under large magnification
            (AT3 test)
       4.4 Fourth level: Construction analysis (AT4
            test)
       4.5 Fifth level: Complementary tests (AT5 test)
    5 Failure analysis (AT6 test)
       5.1 Objective
       5.2 Resources
       5.3 Description

    Abstract - (Show below) - (Hide below)

    Gives the methodology for technology and failure analysis in manufacturing integrated circuits. Technology analysis is used to determine the way a component is built by observing it using adequate resolution, which increases progressively with the level of analysis.

    General Product Information - (Show below) - (Hide below)

    Committee TC 47/SC 47A
    Development Note Stability Date: 2017. (10/2012)
    Document Type Technical Specification
    Publisher International Electrotechnical Committee
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    13/30286159 DC : 0 BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
    13/30286163 DC : 0 BS EN 62435-2 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2 - DETERIORATION MECHANISMS
    13/30286167 DC : 0 BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES
    IEC PAS 62435:2005 Electronic components - Long-duration storage of electronic components - Guidance for implementation
    CLC/TS 50466:2006 Long duration storage of electronic components - Specification for implementation
    EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
    UTEC 96 029 : 2011 ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION
    I.S. EN 62435-1:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
    I.S. CLC TS 50466:2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
    I.S. EN 62435-5:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES
    CEI CLC/TS 50466 : 2006 LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - SPECIFICATION FOR IMPLEMENTATION
    I.S. EN 62435-2:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
    BS EN 62435-2:2017 Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms
    DD CLC/TS 50466:2006 Long duration storage of electronic components. Specification for implementation
    IEC 62435-5:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices
    IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
    BS EN 62435-1:2017 Electronic components. Long-term storage of electronic semiconductor devices General
    DD IEC/PAS 62435:2005 Electronic components. Long duration storage of electronic components. Guidance for implementation
    EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

    Standards Referencing This Book - (Show below) - (Hide below)

    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
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