• IPC 2571 : 2001

    Current The latest, up-to-date edition.

    GENERIC REQUIREMENTS FOR ELECTRONIC MANUFACTURING SUPPLY CHAIN COMMUNICATION - PRODUCT DATA EXCHANGE (PDX)

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    Language(s): 

    Published date:  01-11-2001

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    Introduction
    Relationships to Other Standards Initiatives
    1 Scope
    2 Applicable Documents
       2.1 IPC Documents
       2.2 RosettaNet Documents
       2.3 OAG Documents
       2.4 RFC Documents
    3 Product Data eXchange Package
       3.1 Modeling Diagram Occurrence Indicator Meanings
    4 Pictorial Representation of IPC 2570 Series
       4.1 Product Data eXchange Package
       4.2 Items
       4.3 Additional Attributes
       4.4 Changes
       4.5 Manufacturer Parts
       4.6 Supplier Parts
       4.7 History
       4.8 Attachments
       4.9 Contact
       4.10 AsBuilt Product
       4.11 Product Instance
    5 Recommended Implementation Practices
       5.1 Inclusion of Linked Objects
       5.2 Attachments
       5.3 Missing Required Attributes
       5.4 Avoid Data Duplication in Product Data eXchange
            Package
       5.5 Excluding Data from the Product Data eXchange
            Package
       5.6 Format of Date/Time Fields
       5.7 isTopLevel Attribute
    6 ProductDataeXchangePackage
    7 History
       7.1 HistoryItem
    8 Attachments
       8.1 Attachment
    9 Contacts
       9.1 Contact
       9.2 ContactRoles
       9.3 PublicDigitalCertificate
    10 AdditionalAttributes
       10.1 AdditionalAttribute
    11 AlternateIdentifiers
       11.1 AlternateIdentifier
    12 Document Type Definition (DTD)

    Abstract - (Show below) - (Hide below)

    Gives an XML encoding schema that enables a total product definition to be described at a level appropriate to facilitate supply chain interactions.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    PD IEC/PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    IEC 61182-2:2006 Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
    IPC 2581 : B GENERIC REQUIREMENTS FOR PRINTED BOARD ASSEMBLY PRODUCTS MANUFACTURING DESCRIPTION DATA AND TRANSFER METHODOLOGY
    IEC PAS 61182-12:2014 Generic requirements for printed board assembly products manufacturing description data and transfer methodology
    BS IEC 61182-2:2006 Printed board assembly products. Manufacturing description data and transfer methodology Generic requirements
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