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  • ISO 9455-1:1990

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    Withdrawn A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
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    Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Withdrawn date:  02-12-2022

    Language(s):  English, French

    Published date:  15-11-1990

    Publisher:  International Organization for Standardization

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    Abstract - (Show below) - (Hide below)

    Specifies a gravimetric method for the determination of the content of non-volatile matter in soft soldering fluxes. Applies to liquid and paste fluxes of type 1, as defined in ISO 9454-1.

    General Product Information - (Show below) - (Hide below)

    Development Note Also numbered as BS EN 29455-1 (10/2005)
    Document Type Standard
    Publisher International Organization for Standardization
    Status Withdrawn
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS IEC 61189-5-4 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
    BS EN ISO 9454-1:2016 Soft soldering fluxes. Classification and requirements Classification, labelling and packaging
    12/30270787 DC : 0 BS EN ISO 9455-5 - SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST
    12/30274796 DC : 0 BS IEC 61189-5-2 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING FLUX
    CEI EN 61189-5-2 : 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
    I.S. EN ISO 9455-14:2017 SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES (ISO 9455-14:2017)
    UNE-EN ISO 9455-14:2018 Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)
    IEC 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
    BS EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Guidance for printed board assemblies
    BS EN ISO 9454-2:2001 Soft soldering fluxes. Classification and requirements Performance requirements
    EN 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    ONORM EN ISO 9455-5 : 2014 SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014)
    EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
    EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
    I.S. EN ISO 9455-6:1997 SOFT SOLDERING FLUXES - TEST METHODS - PART 6: DETERMINATION AND DETECTION OF HALIDE (EXCLUDING FLUORIDE) CONTENT
    BS EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering paste for printed board assemblies
    BS EN ISO 9455-15:2017 Soft soldering fluxes. Test methods Copper corrosion test
    12/30274800 DC : 0 BS IEC 61189-5-3 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDERING PASTE
    NF EN 61189-5 : 2008 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    DIN EN ISO 9455-3:1994-11 SOFT SOLDERING FLUXES - TEST METHODS - PART 3: DETERMINATION OF ACID VALUE, POTENTIOMETRIC AND VISUAL TITRATION METHODS
    IEC 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
    BS EN ISO 9455-6:1997 Soft soldering fluxes. Test methods Determination and detection of halide (excluding fluoride) content
    I.S. EN ISO 9454-2:2000 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 2: PERFORMANCE REQUIREMENTS
    14/30309692 DC : 0 BS EN 61189-5-1 ED 1.0 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: TEST METHODS FOR PRINTED BOARD ASSEMBLIES AND MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES - GUIDANCE DOCUMENTS AND HANDBOOKS
    BS EN 61189-5-4:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
    16/30337155 DC : 0 BS EN ISO 9455-14 - SOFT SOLDERING FLUXES - TEST METHODS - PART 14: ASSESSMENT OF TACKINESS OF FLUX RESIDUES
    BS IEC 61189-5-3 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
    14/30285529 DC : 0 BS EN ISO 9454-1 - SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING
    BS EN ISO 9455-5:2014 Soft soldering fluxes. Test methods Copper mirror test
    DIN EN ISO 9454-1:2016-07 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016)
    UNE-EN ISO 9454-1:2016 Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016)
    I.S. EN 61189-5:2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
    I.S. EN ISO 9454-1:2016 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016)
    EN ISO 9455-14:2017 Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)
    IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
    EN ISO 9454-2:2000 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
    EN ISO 9455-5:2014 Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014)
    DIN EN ISO 9455-5 E : 2014 SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014)
    DIN EN ISO 9454-1 E : 2016 SOFT SOLDERING FLUXES - CLASSIFICATION AND REQUIREMENTS - PART 1: CLASSIFICATION, LABELLING AND PACKAGING (ISO 9454-1:2016)
    12/30274804 DC : 0 BS IEC 61189-5-4 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: TEST METHODS FOR PRINTED BOARD ASSEMBLIES: SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE
    BS EN 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies Test methods for printed board assemblies
    BS EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies General test methods for materials and assemblies. Soldering flux for printed board assemblies
    BS EN ISO 9455-14:2017 Soft soldering fluxes. Test methods Assessment of tackiness of flux residues
    UNI EN ISO 9455-5 : 2014 SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST
    I.S. EN ISO 9455-5:2014 SOFT SOLDERING FLUXES - TEST METHODS - PART 5: COPPER MIRROR TEST (ISO 9455-5:2014)
    I.S. EN ISO 9455-15:2017 SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST (ISO 9455-15:2017)
    I.S. EN 61189-5-4:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-4: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID WIRE FOR PRINTED BOARD ASSEMBLIES
    ISO 9455-14:2017 Soft soldering fluxes — Test methods — Part 14: Assessment of tackiness of flux residues
    DIN EN ISO 9455-9:1995-11 Soft soldering fluxes - Test methods - Part 9: Determination of ammonia content (ISO 9455-9:1993); German version EN ISO 9455-9:1995
    DIN EN ISO 9455-2:1995-11 SOFT SOLDERING FLUXES - TEST METHODS - PART 2: DETERMINATION OF NON-VOLATILE MATTER, EBULLIOMETRIC METHOD
    DIN EN ISO 9455-6:1997-03 Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995); German version EN ISO 9455-6:1997
    ISO 9455-3:1992 Soft soldering fluxes — Test methods — Part 3: Determination of acid value, potentiometric and visual titration methods
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
    ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
    ISO 9455-5:2014 Soft soldering fluxes Test methods Part 5: Copper mirror test
    ISO 9455-6:1995 Soft soldering fluxes — Test methods — Part 6: Determination and detection of halide (excluding fluoride) content
    BS EN 29455-5:1993 Soft soldering fluxes. Test methods Copper mirror test
    EN 29455-5:1993 Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:1992)
    EN ISO 9455-6:1997 Soft soldering fluxes - Test methods - Part 6: Determination and detection of halide (excluding fluoride) content (ISO 9455-6:1995)
    EN ISO 9454-1:2016 Soft soldering fluxes - Classification and requirements - Part 1: Classification, labelling and packaging (ISO 9454-1:2016)
    IEEE DRAFT 1003.1Q : D8 2000 DRAFT STANDARD FOR INFORMATION TECHNOLOGY-PORTABLE OPERATING SYSTEMS INTERFACE (POSIX) - PART 1: SYSTEM APPLICATION PROGRAM INTERFACE (API) - AMENDMENT X: TRACING (C LANGUAGE)
    16/30337159 DC : 0 BS EN ISO 9455-15 - SOFT SOLDERING FLUXES - TEST METHODS - PART 15: COPPER CORROSION TEST
    BS IEC 61189-5-2 : 2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
    UNE-EN ISO 9455-5:2015 Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014)
    DIN EN ISO 9455-5:2014-10 Soft soldering fluxes - Test methods - Part 5: Copper mirror test (ISO 9455-5:2014)
    I.S. EN 61189-5-3:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-3: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING PASTE FOR PRINTED BOARD ASSEMBLIES
    I.S. EN 61189-5-2:2015 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-2: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - SOLDERING FLUX FOR PRINTED BOARD ASSEMBLIES
    EN ISO 9455-15:2017 Soft soldering fluxes - Test methods - Part 15: Copper corrosion test (ISO 9455-15:2017)
    ISO 9455-15:2017 Soft soldering fluxes — Test methods — Part 15: Copper corrosion test
    BS EN 29454-1:1994 Soft soldering fluxes. Classification and requirements Classification, labelling and packaging
    BS EN ISO 9455-3:1995 Soft soldering fluxes. Test methods Determination of acid value, potentiometric and visual titration methods
    EN 61189-5-2:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
    DIN EN ISO 9455-12:1994-11 SOFT SOLDERING FLUXES - TEST METHODS - PART 12: STEEL TUBE CORROSION TEST
    EN 61189-5 : 2006 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5: TEST METHODS FOR PRINTED BOARD ASSEMBLIES
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