• J STD 001 : F

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES

    Available format(s):  Hardcopy

    Superseded date:  21-02-2019

    Language(s): 

    Published date:  28-08-2014

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 GENERAL
    2 APPLICABLE DOCUMENTS
    3 MATERIALS, COMPONENTS AND EQUIPMENT REQUIREMENTS
    4 GENERAL SOLDERING AND ASSEMBLY REQUIREMENTS
    5 WIRES AND TERMINAL CONNECTIONS
    6 THROUGH-HOLE MOUNTING AND TERMINATIONS
    7 SURFACE MOUNTING OF COMPONENTS
    8 CLEANING PROCESS REQUIREMENTS
    9 PCB REQUIREMENTS
    10 COATING, ENCAPSULATION AND STAKING (ADHESIVE)
    11 WITNESS (TORQUE/ANTI-TAMPERING) STRIPE
    12 PRODUCT ASSURANCE
    13 REWORK AND REPAIR
    Appendix A - Guidelines for Soldering Tools and Equipment
    Appendix B - Minimum Electrical Clearance - Electrical
                 Conductor Spacing
    APPENDIX C - J-STD-001 Guidance on Objective Evidence of
                 Material Compatibility

    Abstract - (Show below) - (Hide below)

    Specifies materials, methods and acceptance criteria for producing soldered electrical and electronic assemblies.

    General Product Information - (Show below) - (Hide below)

    Committee 5-20
    Development Note Supersedes IPC S 815. Included in IPC C 103 & IPC C 1000. E2010 edition is still available in Swedish, Hungarian, Polish & Turkish Languages, See separate records. F2014 edition is still available in Chinese, German, French, Danish, Italian, Japanese, Romanian, Russian & Spanish Languages, See separate records. (05/2016) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Superseded
    Superseded By
    Supersedes

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