• J STD 005 : A

    Current The latest, up-to-date edition.

    REQUIREMENTS FOR SOLDERING PASTES

    Available format(s):  Hardcopy

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 GENERAL
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 QUALITY ASSURANCE PROVISIONS
    5 PREPARATION FOR DELIVERY
    6 NOTES
    APPENDIX A - Test Report on Solder Paste

    Abstract - (Show below) - (Hide below)

    Specifies requirements for qualification and characterization of solder paste. It references test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder pastes.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes QQ S 571, IPC SP 819, QPL 14256 and QPL QQ S 571. Included in IPC C 103 & IPC C 1000. (07/2009) 1995 Edition is still available in Japanese Language, See J STD 005 JAPANESE. (02/2012) Also available in Russian Language, See J STD 005 RUSSIAN. (11/2012) Also available in Chinese Language, See J STD 005 CHINESE. (03/2013) Also available in Hardcopy format. (01/2018)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL DTL 55235 : A CONNECTORS, COAXIAL, RADIO FREQUENCY, SERIES TPS, GENERAL SPECIFICATION
    MIL PRF 31032 : C PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
    MS 27145 : C CONNECTOR, PLUG, ELECTRICAL, NO. 14 AWG DOUBLE CONTACT, WATERPROOF
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    MIL STD 883 : K TEST METHOD STANDARD - MICROCIRCUITS
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1 : 2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    EN 61189-5-1 : 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
    MS 27144 : D CONNECTOR, PLUG, ELECTRICAL, SOCKET CONTACT, NO. 14 AND 16 AWG, WATERPROOF
    MS 90908 : C FILLER TUBE, FUEL TANK - MILITARY VEHICLES
    BS EN 61189-5-1 : 2016 TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES
    BS PD IEC TS 62647-1 : 2012 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
    J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC 7093 : 0 DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS
    MIL STD 186 : F PROTECTIVE FINISHING SYSTEMS FOR ROCKETS, GUIDED MISSILES, SUPPORT EQUIPMENT AND RELATED MATERIALS
    MIL DTL 32234 : 0 CONNECTORS, ELECTRICAL, ULTRA HIGH DENSITY, MODULAR, BLADE AND FORK, EIGHT ROW, GENERAL SPECIFICATION FOR
    MIL PRF 32560 : 0 COIL, RADIO FREQUENCY, SURFACE MOUNT, FIXED ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
    SAE AMS P 81728 : 2015 PLATING, TIN-LEAD (ELECTRODEPOSITED)
    BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
    MIL DTL 39024 : C JACK, TIP (TEST POINT, PANEL OR PRINTED WIRING TYPE), GENERAL SPECIFICATION FOR
    NASA MSFC STD 2904 : 2006 MSFC TAILORING GUIDE FOR NASA-STD-8739.2, WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY
    MIL STD 981 : C DESIGN, MANUFACTURING AND QUALITY STANDARDS FOR CUSTOM ELECTROMAGNETIC DEVICES FOR SPACE APPLICATIONS
    MIL B 49030 : A BATTERIES, DRY (ALKALINE)
    NASA KSC SPEC E 0031 : 2008 CABLES, ELECTRICAL, SPECIFICATION FOR
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    NASA MSFC STD 3012 : 2012 ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
    NASA KSC SPEC E 0024 : 2008 CABLE, ELECTRICAL, SHIELDED, JACKETED, FOR HARNESS ASSEMBLIES, GENERAL SPECIFICATION FOR
    NASA STD 8739.2 : 1999 WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    MIL DTL 5794 : C MICROPHONE UNIT M-6A/UR AND MICROPHONE, CARBON M-51/UR (CARBON NOISE CANCELING)
    SAE AS 4461 : 2016 ASSEMBLY AND SOLDERING CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING WIRE AND CABLE TERMINATION IN AEROSPACE VEHICLES
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    MIL STD 202-210 : 0 METHOD 210, RESISTANCE TO SOLDERING HEAT
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    BS EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    BS PD IEC/PAS 62647-1 : 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
    IEC 61189-5-1:2016 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC A 20/21 : 1996 STANDARD PITCH STENCIL PATTERN FOR SLUMP - GERBER FORMAT
    EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    MS 35644 : G FILLER NECK: FUEL TANK - MILITARY VEHICLES
    DSCC 99002 : A TRANSFORMER, SWITCHING
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    J STD 006 : C REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
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