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  • IPC J STD 006 : C

    Current The latest, up-to-date edition.

    REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

    Available format(s):  Hardcopy

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 PREFACE
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 QUALITY ASSURANCE PROVISIONS
    5 PREPARATION FOR DELIVERY
    6 NOTES
    Appendix A - Solder Alloys
    Appendix B - Examples of Inspection
                 Report Format
    Appendix B-1 - Test Report for Solder Alloy Composition
                   and Impurity Level
    Appendix B-2 - Inspection Report for Fluxed
                   Wire/Ribbon Solder Individual
                   Inspection and Test Results
    Appendix B-3 - Inspection Report for Non-Fluxed Solder
                   Individual Inspection and Test Results
    Appendix B-4 - Inspection Report for
                   Solder Powder

    Abstract - (Show below) - (Hide below)

    Describes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for 'special form' electronic grade solders.

    General Product Information - (Show below) - (Hide below)

    Committee 5-20
    Development Note Supersedes MIL F 14256, QQ S 571, QPL 14256 & QPL QQ S 571. (07/2004) Also available in CD-ROM format. Included in IPC C 103 & IPC C 1000. B2006 + A1 2008 Edition is still available in Japanese Language, See J STD 006 JAPANESE. (10/2009) B2006 + A2 2009 Edition is still available in Russian Language, See separate record (12/2011) Also available in Chinese Language, See J STD 006 CHINESE. (04/2014)
    Document Type Standard
    Product Note NEW CHILD AMD 1 2017 IS NOW ADDED
    Publisher Institute of Printed Circuits
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

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    MIL-DTL-32025 Base Document:1998 CARTRIDGE, IMPULSE, CCU-96/B
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    MIL-PRF-94 Revision G:2006 Resistor, Variable, Composition, General Specification for
    MIL-DTL-4339 Revision E:2009 CORROSION PREVENTIVE, SOLUBLE OIL FOR WATER INJECTION SYSTEMS (NATO CODE NUMBER C-630)
    MIL-DTL-4510 Revision F:2009 SPOTLIGHTS, INCANDESCENT, ROOF-MOUNTED, AUTOMOTIVE
    MS27145 Revision C:2003 CONNECTOR, PLUG, ELECTRICAL, NO. 14 AWG DOUBLE CONTACT, WATERPROOF
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    MIL-DTL-13623 Revision E:2010 SWITCH, ROTARY: 28 VOLT DC
    MIL-DTL-83513-13 Revision D:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, NARROW PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL R 23285 : B RESISTOR, VARIABLE, NONWIRE WOUND GENERAL SPECIFICATION FOR
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    MIL-DTL-83513-23 Revision D:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 3 ROW, SOLDER TYPE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    MIL-DTL-83513-33 Revision B:2008 Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Straight, Socket Contacts, 4 Row, Solder Type, Standard Profile, 100 Contacts, Printed Circuit Board
    MIL-PRF-27208 Revision F:2006 RESISTOR, VARIABLE, WIREWOUND, NONPRECISION, GENERAL SPECIFICATION FOR
    SAE AS 83519 : 2015 SHIELD TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT GENERAL SPECIFICATION FOR
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    SAE AS 95234A : 2020 CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR
    IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    EN 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    IPC J STD 002 CHINESE : C SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    MIL-DTL-83513 Revision G:2008 CONNECTORS, ELECTRICAL, RECTANGULAR, MICROMINIATURE, POLARIZED SHELL, GENERAL SPECIFICATION FOR
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    IPC 6012 RUSSIAN : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
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    MIL-STD-202-208 Base Document:2015 METHOD 208, SOLDERABILITY
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    IPC SPVC-LAT1 : 2010 ANALYTICAL PROCEDURES FOR PORTABLE LEAD-FREE ALLOY TEST DATA
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    IPC J STD 001 TURKISH : E2010 REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 HUNGARIAN : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC J STD 001 POLISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    MIL-DTL-13253 Revision E:2007 HANDSETS, GENERAL SPECIFICATION FOR
    IPC LDFR1006-CD : 2006 IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND"
    MIL-DTL-14072 Revision F:2013 FINISHES FOR GROUND BASED ELECTRONIC EQUIPMENT
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    IPC WHMA A 620 TURKISH : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC 2221 GERMAN : B GENERIC STANDARD ON PRINTED BOARD DESIGN
    IPC 6012 POLISH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    MIL-DTL-15743 Revision F:2017 SWITCHES, ROTARY, ENCLOSED
    IPC TP 1090 : 1996 THE LAYMAN'S GUIDE TO QUALIFYING NEW FLUXES FOR MIL-STD-2000A OR MT-0002
    MIL-STD-2003-1 Revision A:2009 ELECTRIC PLANT INSTALLATION STANDARD METHODS FOR SURFACE SHIPS AND SUBMARINES (CABLE)
    IPC LDFR0806-CD : 2006 IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND"
    IPC LDFR0605-CD : 2005 IPC/SOLDERTEC 3RD INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONICS "TOWARDS IMPLEMENTATION OF THE ROHS DIRECTIVE"
    IPC LDFR1005-CD : 2005 IPC/JEDEC 11TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES
    IPC LDFR1106-CD : 2006 IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES "ROHS COMPLIANCE AND BEYOND"
    IPC WHMA A 620 SPANISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC WHMA A 620 CHINESE : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC WHMA A 620 VIETNAMESE : B2012 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    MIL-DTL-32106 Base Document:2003 INITIATORS, ELECTRICAL, FOR ROCKET MOTOR IGNITERS
    MIL B 18 : F BATTERIES, NON-RECHARGEABLE, DRY
    MIL-PRF-39003 Revision N:2016 Capacitor, Fixed, Electrolytic (Solid Electrolyte), Tantalum, Established Reliability, General Specification for
    MIL-DTL-28754-62 Revision A:2016 CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER, CROSSOVER, CONTACT TAILS ON .050 CENTERS
    MIL-STD-2003-5 Revision A:2009 ELECTRIC PLANT INSTALLATION STANDARD METHODS FOR SURFACE SHIPS AND SUBMARINES (CONNECTORS)
    MIL-DTL-28748 Revision D:2001 CONNECTOR, PLUG AND RECEPTACLE, RECTANGULAR, RACK AND PANEL SOLDER TYPE AND CRIMP TYPE CONTACTS - GENERAL SPECIFICATION FOR
    MIL-PRF-55681 Revision G:2016 CAPACITOR, CHIP, MULTIPLE LAYER, FIXED, CERAMIC DIELECTRIC, ESTABLISHED RELIABILITY AND NON-ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
    IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC LDFR0306-CD : 2006 IPC/JEDEC INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES
    IPC SPVC2005-CD : 2005 ROUND ROBIN TESTING AND ANALYSIS OF LEAD FREE SOLDER PASTES WITH ALLOYS OF TIN, SILVER AND COPPER
    IPC CH 65 CHINESE : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    IPC LDFR1205-CD : 2006 IPC/JEDEC 12TH INTERNATIONAL CONFERENCE ON LEAD FREE ELECTRONIC COMPONENTS AND ASSEMBLIES - DECEMBER 2005
    MIL-DTL-917 Revision F:2014 ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR
    MIL-DTL-3786 Revision J:2013 SWITCHES, ROTARY (CIRCUIT SELECTOR, LOW-CURRENT CAPACITY), GENERAL SPECIFICATION FOR
    MIL-STD-1353 Revision C:2014 ELECTRICAL CONNECTORS, PLUG-IN SOCKETS AND ASSOCIATED HARDWARE, SELECTION AND USE OF
    MIL-DTL-87104 Revision C:2014 COAXIAL ASSEMBLIES, GENERAL SPECIFICATION FOR
    MIL STD 750-2 : A MECHANICAL TEST METHODS FOR SEMICONDUCTOR DEVICES - PART 2: TEST METHODS 2001 THROUGH 2999
    MIL-PRF-49467 Revision C:2005 Capacitor, Fixed, Ceramic, Multilayer, High Voltage (General Purpose), General Specification For
    MIL-DTL-28827 Revision C:2011 SWITCHES, THERMOSTATIC, (VOLATILE LIQUID), HERMETICALLY SEALED, GENERAL SPECIFICATION FOR
    IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    MIL PRF 24308 : D CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, GENERAL SPECIFICATION FOR
    IPC J STD 001 HUNGARIAN : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 GERMAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC HDBK 005 : 0 GUIDE TO SOLDER PASTE ASSESSMENT
    IPC J STD 003 : C SOLDERABILITY TESTS FOR PRINTED BOARDS
    IPC SM 840 CHINESE : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC WHMA A 620 POLISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC 6012 FRENCH : C QUALIFICATION AND PERFORMANCE SPECIFICATION FOR RIGID PRINTED BOARDS
    MIL-DTL-28754-6 Revision D:2014 CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, 40 PIN, STRAIGHT THROUGH
    MIL-DTL-1716 Revision J:1997 POLE, TENT, TELESCOPIC, ADJUSTABLE 5 FEET TO 9 FEET, MAGNESIUM
    IPC MI 660 : 1984 INCOMING INSPECTION OF RAW MATERIALS MANUAL
    MIL-DTL-28754-97 Revision A:2015 CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 150 CONTACT, RIGHT ANGLE, CONTACT TAILS ON 0.100 CENTERS
    MIL-DTL-9395 Revision K:2016 Switches, Pressure (Absolute, Gage and Differential) General Specification for
    IPC 6013 GERMAN : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR FLEXIBLE PRINTED BOARDS
    IPC LDFR0406-CD : 2006 IPC/SOLDERTEC GLOBAL 4TH INTERNATIONAL ELECTRONICS CONFERENCE AND EXHIBITION "ROHS COMPLIANCE AND BEYOND"
    IPC J STD 001 ROMANIAN : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
    MIL-PRF-27 Revision G:2014 TRANSFORMERS AND INDUCTORS (AUDIO, POWER, AND HIGH-POWER PULSE), GENERAL SPECIFICATION FOR
    MIL STD 11991 : A GENERAL STANDARD FOR PARTS, MATERIALS, AND PROCESSES
    IPC J STD 005 CHINESE : A REQUIREMENTS FOR SOLDERING PASTES
    IPC J STD 001 DANISH : E REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    MIL DTL 28754/60 : A CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER CONTACT TAILS ON .100 CENTERS
    MIL-DTL-16225 Revision C:2010 LOUDSPEAKER, PERMANENT MAGNET, BLASTPROOF AND SUBMERSIBLE, NAVY TYPE 49546()
    MIL-DTL-11996 Revision C:2015 HANDSETS, GENERAL SPECIFICATION FOR
    PPP-B-1672 Revision E:2013 BOXES, SHIPPING, REUSABLE WITH CUSHIONING
    MIL-DTL-12606 Revision E:2000 LOUDSPEAKER, PERMANENT MAGNET (UNENCASED, 3-INCH AND 4-INCH DIAMETER CONE, 2-WATT; FUNGUS-, AND IMMERSION-RESISTANT), TYPE LS-445/U, M12606-01, AND M12606-02
    IPC 6018 CHINESE : B QUALIFICATION AND PERFORMANCE SPECIFICATION FOR HIGH FREQUENCY (MICROWAVE) PRINTED BOARD
    MIL-DTL-12632 Revision E:2016 LOUDSPEAKERS, PERMANENT MAGNET (ENCASED, 2-WATT, FUNGUS-, GUNBLAST-, AND IMMERSION-RESISTANT), GENERAL SPECIFICATION FOR
    IPC WHMA A 620 ESTONIAN : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    IPC TP 1115 : 1998 SELECTION AND IMPLEMENTATION STRATEGY FOR A LOW-RESIDUE, NO-CLEAN PROCESS
    IPC WHMA A 620 KOREAN : B2012 AMD 1 2013 REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    MIL-DTL-18793 Revision B:2011 ANTENNA AS-333/AP
    MIL-DTL-28754-8 Revision D:2014 CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, 40 CONTACT, RIGHT ANGLE (FOR DIE CAST FRAME)
    MIL-DTL-28754-11 Revision F:2014 CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, 40 CONTACT, RIGHT ANGLE (FOR SOLID OR DIP FRAME)
    MIL-DTL-28754-59 Revision A:2016 CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER CONTACT TAILS ON .100 CENTERS (CERAMIC COMPATIBLE)
    MIL-DTL-83513-29 Revision B:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 3 ROW, SOLDER TYPE, STANDARD PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    MIL-DTL-28748-18 Base Document:2005 CONNECTORS, ELECTRICAL, RECTANGULAR, RACK AND PANEL, PRINTED WIRING BOARD (PWB) MOUNT, STRAIGHT THROUGH, PIN CONTACTS, SIZE 22
    MIL-DTL-83513-25 Revision D:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL-DTL-83513-22 Revision D:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 2 ROW, SOLDER TYPE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL-DTL-13625 Revision G:2017 SWITCHES, PULL; SWITCHES, PUSH; SWITCHES, BEAM SELECTING, HEADLIGHT: ELECTRICAL (28 VOLTS DC MAXIMUM, FOR MILITARY VEHICLES)
    MIL-DTL-83513-17 Revision D:2009 Connectors, Electrical, Rectangular, Plug, Microminiature, Polarized Shell, Right Angle, Pin Contacts, 3 Row, Solder Type, Standard Profile, 51 Contacts, Printed Circuit Board
    MIL-DTL-83513-19 Revision D:2009 Connectors, Electrical, Rectangular, Receptacle, Microminiature, Polarized Shell, Right Angle, Socket Contacts, 2 Row, Solder Type, Standard Profile, 9 Through 37 Contacts, Printed Circuit Board
    MIL-DTL-83513-21 Revision D:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 4 ROW, SOLDER TYPE, STANDARD PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
    MIL-DTL-83513-24 Revision D:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 4 ROW, SOLDER TYPE, 100 CONTACTS, PRINTED CIRCUIT BOARD
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    MIL-DTL-25516 Revision F:2004 CONNECTORS, ELECTRICAL, MINIATURE, COAXIAL, ENVIRONMENT RESISTANT TYPE, GENERAL SPECIFICATION FOR
    MIL-DTL-83513-18 Revision D:2009 Connectors, Electrical, Rectangular, Plug, Microminiature, Polarized Shell, Right Angle, Pin Contacts, 4 Row, Solder Type, Standard Profile, 100 Contacts, Printed Circuit Board
    MIL-PRF-15733 Revision J:2010 FILTERS AND CAPACITORS, RADIO FREQUENCY INTERFERENCE, GENERAL SPECIFICATION FOR
    MIL R 27208 : D RESISTOR, VARIABLE, WIRE-WOUND, NONPRECISION, GENERAL SPECIFICATION FOR
    MIL F 28861 : B FILTER AND CAPACITOR, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, GENERAL SPECIFICATION FOR
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    AWS WHC2.13 : 0 WELDING PROCESSES - PART 1, WELDING HANDBOOK, 9TH EDITION, VOL. 2 - CHAPTER 13: SOLDERING
    MIL-DTL-83513-26 Revision D:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    MIL-DTL-3976 Revision F:2013 LIGHTS, MARKER, CLEARANCE (SERVICE AND BLACKOUT), GENERAL SPECIFICATION FOR
    MIL-DTL-83513-10 Revision D:2008 CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 2 ROW, SOLDER TYPE, NARROW PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
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    MIL-DTL-21567 Revision B:2009 COMPOUND, SILICONE, SOFT FILM
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    IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    13/30295427 DC : 0 BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
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    IPC J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
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    MIL-DTL-28748-21 Base Document:2005 Connectors, Electrical, Rectangular, Rack and Panel, Printed Wiring Board (PWB) Mount, Right Angle, Socket Contacts, Size 22
    MIL-PRF-6864 Revision F:2010 CLEANING COMPOUND, SOLVENT, OIL COOLER
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    MIL-DTL-83513-16 Revision D:2009 Connectors, Electrical, Rectangular, Plug, Microminiature, Polarized Shell, Right Angle, Pin Contacts, 2 Row, Solder Type, Standard Profile, 9 Through 37 Contacts, Printed Circuit Board
    MIL-DTL-83513-14 Revision D:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, NARROW PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    MIL-PRF-22097 Revision J:2007 RESISTOR, VARIABLE, NONWIREWOUND, ADJUSTMENT TYPE, GENERAL SPECIFICATION FOR
    IPC TR 582 : 0 CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR
    MIL-PRF-32560 Base Document:2016 COIL, RADIO FREQUENCY, SURFACE MOUNT, FIXED ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
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    GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    BS EN 61191-4:2017 Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
    MIL-DTL-39024 Revision C:2014 JACK, TIP (TEST POINT, PANEL OR PRINTED WIRING TYPE), GENERAL SPECIFICATION FOR
    NASA STD 8739.3 : 1998 SOLDERED ELECTRICAL CONNECTIONS
    MIL-STD-981 Revision C:2010 DESIGN, MANUFACTURING AND QUALITY STANDARDS FOR CUSTOM ELECTROMAGNETIC DEVICES FOR SPACE APPLICATIONS
    NASA MSFC STD 2907 : 2006 WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS
    MIL-B-49030 Revision A:2010 BATTERIES, DRY (ALKALINE)
    NASA KSC SPEC E 0031 : 2008 CABLES, ELECTRICAL, SPECIFICATION FOR
    GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
    MIL-DTL-28754-47 Revision C:2015 CONNECTORS, ELECTRICAL MODULAR, TYPE 4, CONNECTOR, 100 PIN, RIGHT ANGLE CONTACT TAILS ON .100 CENTERS
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    NASA MSFC STD 3012 : 2012 ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
    NASA KSC SPEC E 0024 : 2008 CABLE, ELECTRICAL, SHIELDED, JACKETED, FOR HARNESS ASSEMBLIES, GENERAL SPECIFICATION FOR
    NASA STD 8739.2 : 1999 WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    MIL-STD-186 Revision F:2002 PROTECTIVE FINISHING SYSTEMS FOR ROCKETS, GUIDED MISSILES, SUPPORT EQUIPMENT AND RELATED MATERIALS
    MIL-DTL-28754-10 Revision D:2014 CONNECTORS, ELECTRICAL, MODULAR, CONNECTOR, TYPE 4, 40 PIN, CONTACT TAILS ON 0.050 CENTERS
    MIL-DTL-28754-101 Revision A:2015 CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 0.6 PITCH, 250 CONTACT, CENTER
    MIL-DTL-24308 Revision G:2009 Connectors, Electric, Rectangular, Nonenvironmental, Miniature, Polarized Shell, Rack and Panel, General Specification for
    MIL-PRF-31033 Revision B:2011 Capacitor, Fixed, Ceramic Dielectric, High Reliability, Discoidal, General Specification for
    MIL-DTL-83513-12 Revision D:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 4 ROW, SOLDER TYPE, NARROW PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
    MIL-DTL-8416 Revision C:2005 ADAPTER, HEADSET-MICROPHONE MX-1646()/AIC
    MIL-DTL-83513-11 Revision D:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 3 ROW, SOLDER TYPE, NARROW PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
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    MIL-DTL-76 Revision E:2016 WIRE AND CABLE, HOOKUP, ELECTRICAL, INSULATED, GENERAL SPECIFICATION FOR
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    MIL-DTL-10986 Revision G:2007 INDICATORS AND TRANSMITTERS: LIQUID, TEMPERATURE AND PRESSURE
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    MIL-DTL-83513-15 Revision E:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKETS CONTACTS, 4 ROW, SOLDER TYPE, NARROW PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
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    SAE AS 50151 : 2015 CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE, GENERAL SPECIFICATION FOR
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    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    MIL-STD-202-210 Base Document:2015 METHOD 210, RESISTANCE TO SOLDERING HEAT
    IEC TS 62647-23:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    IEC PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    BS EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    PD IEC/PAS 62647-1:2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
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    DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
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    PD IEC/PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
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    MIL-DTL-83513-28 Revision B:2009 CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 2 ROW, SOLDER TYPE, STANDARD PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL-DTL-55235 Revision A:2003 CONNECTORS, COAXIAL, RADIO FREQUENCY, SERIES TPS, GENERAL SPECIFICATION
    MIL-DTL-21617 Revision B:2012 CONNECTORS, PLUG AND RECEPTACLE, ELECTRICAL, RECTANGULAR, POLARIZED SHELL, MINIATURE TYPE, GENERAL SPECIFICATION FOR
    MIL-DTL-83502 Revision E:2007 Sockets, Plug-in Electronic Components, Round Style, General Specification for
    MIL-DTL-28748-20 Base Document:2005 Connectors, Electrical, Rectangular, Rack and Panel, Printed Wiring Board (PWB) Mount, Right Angle, Pin Contacts, Size 22
    MIL-DTL-3655 Revision D:2004 Connector, Plug and Receptacle, Electrical (Coaxial, Series Twin), and Associated Fittings, General Specification for
    MIL-DTL-55302-83 Revision C:2004 CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PLUG, PIN CONTACTS, 41, 66, 114 CONTACT POSITIONS: FOR PRINTED WIRING BOARDS (.100 X .050 OFFSET GRID)
    SAE AS 95234 : 2014 CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR
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    EN 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    MS35644 Revision G:2011 FILLER NECK: FUEL TANK - MILITARY VEHICLES
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
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    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
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    MIL-DTL-18714 Revision F:2012 PRIMER, ELECTRIC, MARK 45 MOD 1
    EN 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    IPC J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC TM 650 : 0 TEST METHODS MANUAL
    IPC J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
    ISO 9001:2015 Quality management systems — Requirements
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    ISO 10012-1:1992 Quality assurance requirements for measuring equipment Part 1: Metrological confirmation system for measuring equipment
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