• J STD 006 : C

    Current The latest, up-to-date edition.

    REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDERS FOR ELECTRONIC SOLDERING APPLICATIONS

    Available format(s):  Hardcopy

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 PREFACE
    2 APPLICABLE DOCUMENTS
    3 REQUIREMENTS
    4 QUALITY ASSURANCE PROVISIONS
    5 PREPARATION FOR DELIVERY
    6 NOTES
    Appendix A - Solder Alloys
    Appendix B - Examples of Inspection
                 Report Format
    Appendix B-1 - Test Report for Solder Alloy Composition
                   and Impurity Level
    Appendix B-2 - Inspection Report for Fluxed
                   Wire/Ribbon Solder Individual
                   Inspection and Test Results
    Appendix B-3 - Inspection Report for Non-Fluxed Solder
                   Individual Inspection and Test Results
    Appendix B-4 - Inspection Report for
                   Solder Powder

    Abstract - (Show below) - (Hide below)

    Describes the nomenclature, requirements and test methods for electronic grade solder alloys; for fluxed and non-fluxed bar, ribbon, wire, and powder solders, for electronic soldering applications; and for ''special form'' electronic grade solders.

    General Product Information - (Show below) - (Hide below)

    Committee 5-20
    Development Note Supersedes MIL F 14256, QQ S 571, QPL 14256 & QPL QQ S 571. (07/2004) Also available in CD-ROM format. Included in IPC C 103 & IPC C 1000. B2006 + A1 2008 Edition is still available in Japanese Language, See J STD 006 JAPANESE. (10/2009) B2006 + A2 2009 Edition is still available in Russian Language, See separate record (12/2011) Also available in Chinese Language, See J STD 006 CHINESE. (04/2014)
    Document Type Standard
    Product Note NEW CHILD AMD 1 2017 IS NOW ADDED
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL-DTL-28754/59A:2016 CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER CONTACT TAILS ON .100 CENTERS (CERAMIC COMPATIBLE)
    MIL DTL 28754/61 : A CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 100 PIN, CENTER, CROSSOVER, CONTACT TAILS ON .100 CENTERS (CERAMIC COMPATIBLE)
    MIL DTL 83513/29 : B CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 3 ROW, SOLDER TYPE, STANDARD PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 28748/18 : 0 CONNECTORS, ELECTRICAL, RECTANGULAR, RACK AND PANEL, PRINTED WIRING BOARD (PWB) MOUNT, STRAIGHT THROUGH, PIN CONTACTS, SIZE 22
    MIL DTL 83513/30 : B CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 4 ROW, SOLDER TYPE, STANDARD PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 83513/28 : B CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 2 ROW, SOLDER TYPE, STANDARD PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 24308 : G CONNECTORS, ELECTRIC, RECTANGULAR, NONENVIRONMENTAL, MINIATURE, POLARIZED SHELL, RACK AND PANEL, GENERAL SPECIFICATION FOR
    MIL DTL 26482 : H CONNECTORS, ELECTRICAL, CIRCULAR, MINIATURE, QUICK DISCONNECT, ENVIRONMENT RESISTING, RECEPTACLES AND PLUGS, GENERAL SPECIFICATION FOR
    MIL DTL 28748/21 : 0 CONNECTORS, ELECTRICAL, RECTANGULAR, RACK AND PANEL, PRINTED WIRING BOARD (PWB) MOUNT, RIGHT ANGLE, SOCKET CONTACTS, SIZE 22
    MIL DTL 83513/25 : D CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL PRF 31033 : B CAPACITORS, FIXED, CERAMIC DIELECTRIC, HIGH RELIABILITY, DISCOIDAL, GENERAL SPECIFICATION FOR
    MIL PRF 6864 : F CLEANING COMPOUND, SOLVENT, OIL COOLER
    MIL DTL 83513/22 : D CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 2 ROW, SOLDER TYPE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 32025 : 0 CARTRIDGE, IMPULSE, CCU-96/B
    MIL DTL 55235 : A CONNECTORS, COAXIAL, RADIO FREQUENCY, SERIES TPS, GENERAL SPECIFICATION
    MIL DTL 83513/12 : D CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 4 ROW, SOLDER TYPE, NARROW PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 8416 : C ADAPTER, HEADSET-MICROPHONE MX-1646()/AIC
    MIL DTL 83513/11 : D CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 3 ROW, SOLDER TYPE, NARROW PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 13625 : G SWITCHES, PULL; SWITCHES, PUSH; SWITCHES, BEAM SELECTING, HEADLIGHT: ELECTRICAL (28 VOLTS DC MAXIMUM, FOR MILITARY VEHICLES)
    MIL DTL 83513/17 : D CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 3 ROW, SOLDER TYPE, STANDARD PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 83513/19 : D CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, STANDARD PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 83513/21 : D CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 4 ROW, SOLDER TYPE, STANDARD PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 83513/24 : D CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 4 ROW, SOLDER TYPE, 100 CONTACTS, PRINTED CIRCUIT BOARD
    MIL PRF 31032 : C PRINTED CIRCUIT BOARD/PRINTED WIRING BOARD, GENERAL SPECIFICATION FOR
    MIL PRF 94 : G RESISTOR, VARIABLE, COMPOSITION GENERAL SPECIFICATION FOR
    MIL DTL 4339 : E CORROSION PREVENTIVE, SOLUBLE OIL FOR WATER INJECTION SYSTEMS (NATO CODE NUMBER C-630)
    MIL DTL 4510 : F SPOTLIGHTS, INCANDESCENT, ROOF-MOUNTED, AUTOMOTIVE
    MS 27145 : C CONNECTOR, PLUG, ELECTRICAL, NO. 14 AWG DOUBLE CONTACT, WATERPROOF
    MIL DTL 21617 : B CONNECTORS, PLUG AND RECEPTACLE, ELECTRICAL, RECTANGULAR, POLARIZED SHELL, MINIATURE TYPE, GENERAL SPECIFICATION FOR
    MIL DTL 83502 : E SOCKETS, PLUG-IN ELECTRONIC COMPONENTS, ROUND STYLE, GENERAL SPECIFICATION FOR
    MIL DTL 5794 : C MICROPHONE UNIT M-6A/UR AND MICROPHONE, CARBON M-51/UR (CARBON NOISE CANCELING)
    MIL DTL 32234 : 0 CONNECTORS, ELECTRICAL, ULTRA HIGH DENSITY, MODULAR, BLADE AND FORK, EIGHT ROW, GENERAL SPECIFICATION FOR
    MIL DTL 83513/31 : B CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATUREE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, STANDARD PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 83513/32 : B CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, STANDARD PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 13623 : E SWITCH, ROTARY: 28 VOLT DC
    MIL DTL 83513/13 : D CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 2 ROW, SOLDER TYPE, NARROW PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL R 23285 : B RESISTOR, VARIABLE, NONWIRE WOUND GENERAL SPECIFICATION FOR
    MIL DTL 28748/20 : 0 CONNECTORS, ELECTRICAL, RECTANGULAR, RACK AND PANEL, PRINTED WIRING BOARD (PWB) MOUNT, RIGHT ANGLE, PIN CONTACTS, SIZE 22
    MIL DTL 3655 : D CONNECTOR, PLUG AND RECEPTACLE, ELECTRICAL (COAXIAL, SERIES TWIN), AND ASSOCIATED FITTINGS, GENERAL SPECIFICATION FOR
    MIL DTL 55302/83 : C CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: PLUG, PIN CONTACTS, 41, 66, 114 CONTACT POSITIONS: FOR PRINTED WIRING BOARDS (.100 X .050 OFFSET GRID)
    MIL DTL 16878 : H WIRE, ELECTRICAL, INSULATED, GENERAL SPECIFICATION FOR
    MIL DTL 25516 : F CONNECTORS, ELECTRICAL, MINIATURE, COAXIAL, ENVIRONMENT RESISTANT TYPE, GENERAL SPECIFICATION FOR
    MIL DTL 83513/18 : D CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 4 ROW, SOLDER TYPE, STANDARD PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 28748/19 : 0 CONNECTORS, ELECTRICAL, RECTANGULAR, RACK AND PANEL, PRINTED WIRING BOARD (PWB) MOUNT, STRAIGHT THROUGH, SOCKET CONTACTS, SIZE 22
    MIL L 12632 : D LOUDSPEAKER, PERMANENT MAGNET (ENCASED, 2 WATT, FUNGUS, GUNBLAST, AND IMMERSION RESISTANT), GENERAL SPECIFICATION FOR
    MIL DTL 83513/16 : D CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 2 ROW, SOLDER TYPE, STANDARD PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL PRF 15733 : J FILTERS AND CAPACITORS, RADIO FREQUENCY INTERFERENCE, GENERAL SPECIFICATION FOR
    MIL R 27208 : D RESISTOR, VARIABLE, WIRE-WOUND, NONPRECISION, GENERAL SPECIFICATION FOR
    MIL F 28861 : B FILTER AND CAPACITOR, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, GENERAL SPECIFICATION FOR
    MS 27144 : D CONNECTOR, PLUG, ELECTRICAL, SOCKET CONTACT, NO. 14 AND 16 AWG, WATERPROOF
    MIL DTL 83513/27 : D CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 4 ROW, SOLDER TYPE, 100 CONTACTS, PRINTED CIRCUIT BOARD
    SAE AS 95234 : 2014 CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR
    MIL DTL 27434 : B ADAPTERS, CONNECTOR, COAXIAL, RADIO FREQUENCY, BETWEEN SERIES, GENERAL SPECIFICATION FOR
    MIL STD 1276 : H LEADS FOR ELECTRONIC COMPONENT PARTS
    MIL DTL 76 : E WIRE AND CABLE, HOOKUP, ELECTRICAL, INSULATED, GENERAL SPECIFICATION FOR
    MIL DTL 83513/23 : D CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, PIN CONTACTS, 3 ROW, SOLDER TYPE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 83513/33 : B CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 4 ROW, SOLDER TYPE, STANDARD PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
    MIL PRF 27208 : F RESISTOR, VARIABLE, WIREWOUND, NONPRECISION, GENERAL SPECIFICATION FOR
    SAE AS 29600 : 2017 CONNECTORS, ELECTRICAL, CIRCULAR, MINIATURE, COMPOSITE, HIGH DENSITY, QUICK COUPLING, ENVIRONMENT RESISTANT, REMOVABLE CRIMP CONTACTS ASSOCIATED HARDWARE, GENERAL SPECIFICATION FOR
    AWS C3.11M/C3.11 : 2011 SPECIFICATION FOR TORCH SOLDERING
    MIL DTL 83513/14 : D CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, NARROW PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    AWS WHC2.13 : 0 WELDING PROCESSES - PART 1, WELDING HANDBOOK, 9TH EDITION, VOL. 2 - CHAPTER 13: SOLDERING
    MIL DTL 83513/26 : D CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, STRAIGHT, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 10986 : G INDICATORS AND TRANSMITTERS: LIQUID, TEMPERATURE AND PRESSURE
    MIL PRF 29607 : 0 CLEANING COMPOUND, AVIONICS COMPONENTS, NON-OZONE DEPLETING
    MIL DTL 83513/15 : E CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKETS CONTACTS, 4 ROW, SOLDER TYPE, NARROW PROFILE, 100 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 3976 : F LIGHTS, MARKER, CLEARANCE (SERVICE AND BLACKOUT), GENERAL SPECIFICATION FOR
    MIL DTL 83513/20 : D CONNECTORS, ELECTRICAL, RECTANGULAR, RECEPTACLE, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, SOCKET CONTACTS, 3 ROW, SOLDER TYPE, STANDARD PROFILE, 51 CONTACTS, PRINTED CIRCUIT BOARD
    MIL DTL 3643 : B CONNECTORS, COAXIAL, RADIO FREQUENCY, SERIES HN, AND ASSOCIATED FITTINGS, GENERAL SPECIFICATION FOR
    MIL DTL 3650 : B CONNECTORS, COAXIAL, RADIO FREQUENCY, SERIES LC
    MIL PRF 22097 : J RESISTOR, VARIABLE, NONWIREWOUND, ADJUSTMENT TYPE, GENERAL SPECIFICATION FOR
    MIL DTL 83513/10 : D CONNECTORS, ELECTRICAL, RECTANGULAR, PLUG, MICROMINIATURE, POLARIZED SHELL, RIGHT ANGLE, PIN CONTACTS, 2 ROW, SOLDER TYPE, NARROW PROFILE, 9 THROUGH 37 CONTACTS, PRINTED CIRCUIT BOARD
    MIL PRF 28861 : E FILTERS AND CAPACITORS, RADIO FREQUENCY/ELECTROMAGNETIC INTERFERENCE SUPPRESSION, GENERAL SPECIFICATION FOR
    MIL DTL 21567 : B COMPOUND, SILICONE, SOFT FILM
    MIL R 94 : E RESISTORS, VARIABLE, COMPOSITION, GENERAL SPECIFICATION FOR
    MIL PRF 81705 : E BARRIER MATERIALS, FLEXIBLE, ELECTROSTATIC DISCHARGE PROTECTIVE, HEAT-SEALABLE
    SAE AS 83519 : 2015 SHIELD TERMINATION, SOLDER STYLE, INSULATED, HEAT-SHRINKABLE, ENVIRONMENT RESISTANT GENERAL SPECIFICATION FOR
    IPC TR 582 : 0 CLEANING AND CLEANLINESS TESTING PROGRAM FOR PHASE 3 - LOW SOLIDS, FLUXES AND PASTES PROCESSED IN AMBIENT AIR
    MIL PRF 32560 : 0 COIL, RADIO FREQUENCY, SURFACE MOUNT, FIXED ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR
    SAE AS 39029 : 2017 CONTACTS, ELECTRICAL CONNECTOR, GENERAL SPECIFICATION FOR
    SAE AS 50151 : 2015 CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE, GENERAL SPECIFICATION FOR
    MIL DTL 15514 : G TELEPHONE EQUIPMENT, SOUND POWERED TELEPHONE HANDSET, HEADSET - CHEST SET, AND HEADSET - CHEST SET, NOISE ATTENUATING
    MIL DTL 28754/10 : D CONNECTORS, ELECTRICAL, MODULAR, CONNECTOR, TYPE 4, 40 PIN, CONTACT TAILS ON 0.050 CENTERS
    MIL DTL 28754/14 : D CONNECTORS, ELECTRICAL, MODULAR, CONNECTOR, TYPE 4, 20 CONTACT, RIGHT ANGLE (FOR DIE CAST FRAME)
    MIL DTL 28754/8 : D CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, 40 CONTACT, RIGHT ANGLE (FOR DIE CAST FRAME)
    MIL DTL 28754/11 : F CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, 40 CONTACT, RIGHT ANGLE (FOR SOLID OR DIP FRAME)
    MIL DTL 28754/100 : A CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 200 CONTACT, CENTER
    MIL DTL 28754/101 : A CONNECTORS, ELECTRICAL, MODULAR, TYPE 4, CONNECTOR, 0.6 PITCH, 250 CONTACT, CENTER
    SAE AS 4461 : 2016 ASSEMBLY AND SOLDERING CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING WIRE AND CABLE TERMINATION IN AEROSPACE VEHICLES
    SAE AMS P 81728 : 2015 PLATING, TIN-LEAD (ELECTRODEPOSITED)
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    I.S. EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES
    EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    MIL STD 202-210 : 0 METHOD 210, RESISTANCE TO SOLDERING HEAT
    MS 90908 : C FILLER TUBE, FUEL TANK - MILITARY VEHICLES
    MIL STD 883 : K TEST METHOD STANDARD - MICROCIRCUITS
    MS 35644 : G FILLER NECK: FUEL TANK - MILITARY VEHICLES
    BS PD IEC TS 62647-1 : 2012 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN
    BS EN 61191-3:2017 Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies
    SAE AS 95234A : 2020 CONNECTORS, ELECTRICAL, REVERSE BAYONET, GENERAL SPECIFICATION FOR
    IEC TS 62647-23:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    BS EN 61191-4:2017 (published 2017-11) Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies
    IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
    13/30295427 DC : 0 BS IEC/PAS 61249-8-5 ED.1 - QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IEC PAS 62250:2001 Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
    IEC 61191-4:2017 Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
    BS EN 61191-1 : 2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    PD IEC/TS 62647-22:2013 (published 2013-10) Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
    IEC PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
    IEC PAS 62647-1:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management
    15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    BS EN 61191-2:2017 PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017)
    BS PD IEC/PAS 62647-1 : 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT
    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62249:2001 Qualification and performance specification for flexible printed boards
    DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
    IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
    PD IEC/PAS 61249-8-5:2014 Qualification and performance specification of permanent solder mask and flexible cover materials
    MIL DTL 39024 : C JACK, TIP (TEST POINT, PANEL OR PRINTED WIRING TYPE), GENERAL SPECIFICATION FOR
    NASA STD 8739.3 : 1998 SOLDERED ELECTRICAL CONNECTIONS
    MIL STD 981 : C DESIGN, MANUFACTURING AND QUALITY STANDARDS FOR CUSTOM ELECTROMAGNETIC DEVICES FOR SPACE APPLICATIONS
    NASA MSFC STD 2907 : 2006 WORKMANSHIP STANDARD FOR PRINTED WIRING BOARDS
    MIL B 49030 : A BATTERIES, DRY (ALKALINE)
    NASA KSC SPEC E 0031 : 2008 CABLES, ELECTRICAL, SPECIFICATION FOR
    GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
    MIL DTL 28754/47 : C CONNECTORS, ELECTRICAL MODULAR, TYPE 4, CONNECTOR, 100 PIN, RIGHT ANGLE CONTACT TAILS ON .100 CENTERS
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    NASA MSFC STD 3012 : 2012 ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE
    NASA KSC SPEC E 0024 : 2008 CABLE, ELECTRICAL, SHIELDED, JACKETED, FOR HARNESS ASSEMBLIES, GENERAL SPECIFICATION FOR
    NASA STD 8739.2 : 1999 WORKMANSHIP STANDARD FOR SURFACE MOUNT TECHNOLOGY
    I.S. EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES
    J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    I.S. EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES
    MIL DTL 5015 : H CONNECTORS, ELECTRICAL, CIRCULAR THREADED, AN TYPE - GENERAL SPECIFICATION FOR
    J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC WHMA A 620 DANISH : B REQUIREMENTS AND ACCEPTANCE FOR CABLE AND WIRE HARNESS ASSEMBLIES
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    EN 61191-3:2017 PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017)
    DSCC 99002 : A TRANSFORMER, SWITCHING
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    IPC 2221 FRENCH : B2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    MIL DTL 18714 : F PRIMER, ELECTRIC, MARK 45 MOD 1
    EN 61191-4:2017 PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES

    Standards Referencing This Book - (Show below) - (Hide below)

    J STD 609 : A MARKING AND LABELING OF COMPONENTS, PCBS AND PCBAS TO IDENTIFY LEAD (PB), LEAD-FREE (PB-FREE) AND OTHER ATTRIBUTES
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    IPC TM 650 : 0 TEST METHODS MANUAL
    J STD 005 : A REQUIREMENTS FOR SOLDERING PASTES
    ISO 9001:2015 Quality management systems Requirements
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