I.S. EN 62435-2:2017
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ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
IEC PAS 62168 : 1.0
|
SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES |
BS EN 60068-2-58 : 2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
BS EN 62435-2:2017
|
Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
SAE AS 6294/1 : 2017
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REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS |
MIL PRF 38535 : K
|
INTEGRATED CIRCUITS (MICROCIRCUITS) MANUFACTURING, GENERAL SPECIFICATION FOR |
17/30357139 DC : 0
|
BS EN 61760-4 + A1 - SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
12/30261600 DC : DRAFT MAR 2012
|
BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
BS EN 60068-3-13:2016
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ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
DD IEC/TS 62239:2003
|
Process management for avionics. Preparation of an electronic components management plan |
DSCC 13031 : A
|
FUSE, INSTRUMENT, SUBMINIATURE |
IEC PAS 62239:2001
|
Electronic component management plans |
IPC 7095 : C
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
11/30243259 DC : 0
|
BS EN 60068-2-58 ED.4 - ENVIRONMENTAL TESTING - PART 2-58: TESTS TD- TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
J STD 035 : 0
|
ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS |
GEIA SSB 1.002 : 1999
|
ENVIRONMENTAL TESTS AND ASSOCIATED FAILURE MECHANISMS |
DSCC 14001 : 0
|
FUSE, INSTRUMENT, SUBMINIATURE |
12/30256751 DC : 0
|
BS EN 62047-20 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES |
BS EN 62258-1 : 2010
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
MIL PRF 38534 : K
|
HYBRID MICROCIRCUITS, GENERAL SPECIFICATION FOR |
BS EN 62047-20 : 2014
|
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES |
ANSI C78.374 : 2015
|
AMERICAN NATIONAL STANDARD FOR ELECTRIC LAMPS - LIGHT-EMITTING DIODE PACKAGE SPECIFICATION SHEET FOR GENERAL ILLUMINATION APPLICATIONS |
MIL PRF 19500/672 : 0
|
SEMICONDUCTOR DEVICE, TRANSISTOR, PLASTIC, NPN, SILICON, SWITCHING, TYPE 2N2222AUE1 JAN, JANTX, JANJ |
SAE AS 6171/8 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RAMAN SPECTROSCOPY TEST METHODS |
I.S. EN 62047-20:2014
|
SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES |
IPC 9631 GERMAN : -
|
RICHTLINIE FUER DIE ANWENDUNG DER IPC-TM-650, METHODE 2.6.27, THERMISCHER STRESS, SIMULATION DES KONVEKTIONS-REFLOW-LOETENS |
MIL PRF 19500/686 : 0
|
SEMICONDUCTOR DEVICE, TRANSISTOR, PLASTIC, PNP, SILICON, SWITCHING, TYPE 2N2907AUE1 JAN, JANTX, JANJ |
MIL PRF 19500/695 : 0
|
SEMICONDUCTOR DEVICE, TRANSISTOR, PLASTIC, PNP, SILICON, SWITCHING, TYPE 2N4033UE1 JAN, JANTX, JANJ |
BS EN 61760-4 : 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
IEC PAS 62686-2:2016
|
Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components |
SAE AS 6171/11 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY DESIGN RECOVERY TEST METHODS |
IEC 62047-20:2014
|
Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes |
BS EN 16602-60-13 : 2015
|
SPACE PRODUCT ASSURANCE - REQUIREMENTS FOR THE USE OF COTS COMPONENTS |
IEC PAS 62050:2004
|
Board level drop test method of components for handheld electronic products |
SAE J 1211 : 2012
|
HANDBOOK FOR ROBUSTNESS VALIDATION OF AUTOMOTIVE ELECTRICAL/ELECTRONIC MODULES |
IEC 61760-4:2015
|
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
SAE AS 6171/6 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY ACOUSTIC MICROSCOPY (AM) TEST METHODS |
I.S. EN 62258-1:2010
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
SAE AS 6294/2 : 2018
|
REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN MILITARY AND AVIONICS APPLICATIONS |
IEC 62090:2017
|
Product package labels for electronic components using bar code and two-dimensional symbologies |
CEI EN 61760-4 : 2016
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
I.S. EN 61760-4:2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
IEC TS 62686-1:2015
|
Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
IPC 1756 : 2010
|
MANUFACTURING PROCESS DATA MANAGEMENT |
IEEE 2700 : 2014
|
SENSOR PERFORMANCE PARAMETER DEFINITIONS |
IPC M 109 : LATEST
|
COMPONENTS HANDLING MANUAL |
TS 102 671 : 9.2.0
|
SMART CARDS; MACHINE TO MACHINE UICC; PHYSICAL AND LOGICAL CHARACTERISTICS (RELEASE 9) |
IPC 9631 : 0
|
USER GUIDE FOR IPC-TM-650 - METHOD 2.6.27: THERMAL STRESS, CONVECTION REFLOW ASSEMBLY SIMULATION |
I.S. EN 60068-3-13:2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
SAE J 1879 : 2014
|
HANDBOOK FOR ROBUSTNESS VALIDATION OF SEMICONDUCTOR DEVICES IN AUTOMOTIVE APPLICATIONS |
IEC 60068-2-58:2015+AMD1:2017 CSV
|
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
I.S. EN 60068-2-58:2015
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) |
IEC 61191-1:2013
|
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
IEC TS 62239-1:2015
|
Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan |
GEIA HB 0005-3 : 2008
|
REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
EN 61760-4:2015/A1:2018
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
IEC PAS 60191-6-19 : 1.0
|
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-19: MEASUREMENT METHODS OF PACKAGE WARPAGE AT ELEVATED TEMPERATURE AND THE MAXIMUM PERMISSIBLE WARPAGE |
IEC TS 62239 : 2.0
|
PROCESS MANAGEMENT FOR AVIONICS - PREPARATION OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
I.S. EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES |
EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
BS PD IEC TS 62647-1 : 2012
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN |
BS PD IEC TS 62861 : 2017
|
GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY TESTING FOR LED LIGHT SOURCES AND LED LUMINAIRES |
BS EN 61191-3:2017
|
Printed board assemblies Sectional specification. Requirements for through-hole mount soldered assemblies |
BS EN 61189-5-1 : 2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
IEC 62258-1:2009
|
Semiconductor die products - Part 1: Procurement and use |
17/30365636 DC : 0
|
BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
BS PD IEC TS 62239-1 : 2015
|
PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
BS PD IEC/PAS 62686-2 : 2016
|
PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 2: GENERAL REQUIREMENTS FOR PASSIVE COMPONENTS |
IEC TS 62647-23:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
PD IEC/TS 62647-23:2013
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
DD IEC PAS 62686-1 : DRAFT JULY 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
BS EN 61191-4:2017 (published 2017-11)
|
Printed board assemblies Sectional specification. Requirements for terminal soldered assemblies |
IEC PAS 62686-1:2011
|
Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
IEC PAS 62647-23:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
IEC 61191-2:2017
|
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
DD IEC PAS 62050 : DRAFT 2004
|
BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS |
IEC 61191-4:2017
|
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies |
BS EN 61191-1 : 2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
PD IEC/TS 62647-22:2013 (published 2013-10)
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
IEC TS 62861:2017
|
Guidelines for principal component reliability testing for LED light sources and LED luminaires |
IEC PAS 62647-1:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
15/30327712 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
BS EN 61191-2:2017
|
PRINTED BOARD ASSEMBLIES - PART 2: SECTIONAL SPECIFICATION - REQUIREMENTS FOR SURFACE MOUNT SOLDERED ASSEMBLIES (IEC 61191-2:2017) |
BS PD IEC/PAS 62647-1 : 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT |
IEC 61189-5-1:2016
|
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies |
11/30255124 DC : 0
|
BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES |
IEC TS 62647-22:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC PAS 62647-22:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC 62435-2:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
IEC 60068-3-13:2016
|
Environmental testing - Part 3-13: Supporting documentation and guidance on Test T - Soldering |
PD IEC/TS 62686-1:2015 (published 2015-04)
|
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
DD IEC PAS 62647-23 : DRAFT AUG 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
IEC 61191-3:2017
|
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
GEIA STD 0006 : 2008
|
REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
GEIA STD 0005-1 : 2012
|
PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
EIA STD 4899 : 2017-05
|
REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
GEIA SSB 1.001 : 1999
|
QUALIFICATION AND RELIABILITY MONITORS |
NASA MSFC STD 3012 : 2012
|
ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL (EEE) PARTS MANAGEMENT AND CONTROL REQUIREMENTS FOR MSFC SPACE FLIGHT HARDWARE |
NASA JSC 66491 : 2013
|
STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
J STD 075 : 0
|
CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
EIA 4899 : 2001
|
STANDARD FOR PREPARING AN ELECTRONIC COMPONENTS MANAGEMENT PLAN |
I.S. EN 61191-4:2017
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
J STD 001 CHINESE : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
I.S. EN 61191-3:2017
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES |
J STD 001 SPANISH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
J STD 001 FRENCH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 7093 : 0
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
EN 61189-5-1 : 2016
|
TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-1: GENERAL TEST METHODS FOR MATERIALS AND ASSEMBLIES - GUIDANCE FOR PRINTED BOARD ASSEMBLIES |
EN 60068-3-13 : 2016
|
ENVIRONMENTAL TESTING - PART 3-13: SUPPORTING DOCUMENTATION AND GUIDANCE ON TEST T - SOLDERING |
EN 62047-20 : 2014
|
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 20: GYROSCOPES (IEC 62047-20:2014) |
EN 62258-1:2010
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
I.S. EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV)) |
EN 61191-3:2017
|
PRINTED BOARD ASSEMBLIES - PART 3: SECTIONAL SPECIFICATION - REQUIREMENTS FOR THROUGH-HOLE MOUNT SOLDERED ASSEMBLIES (IEC 61191-3:2017) |
CEI EN 62258-1 : 2011
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
EN 61191-1:2013
|
PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013) |
EN 60068-2-58:2015/A1:2018
|
ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017) |
EN 62435-2 : 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS (IEC 62435-2:2017) |
EN 61191-4:2017
|
PRINTED BOARD ASSEMBLIES - PART 4: SECTIONAL SPECIFICATION - REQUIREMENTS FOR TERMINAL SOLDERED ASSEMBLIES |
EN 16602-60-13 : 2015
|
SPACE PRODUCT ASSURANCE - REQUIREMENTS FOR THE USE OF COTS COMPONENTS |