PD IEC/TS 62239-2:2017
|
Process management for avionics. Management plan Preparation and maintenance of an electronic COTS assembly management plan |
BS EN 16602-60-14:2014
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SPACE PRODUCT ASSURANCE - RELIFING PROCEDURE - EEE COMPONENTS |
J STD 035 : 0
|
ACOUSTIC MICROSCOPY FOR NON-HERMETIC ENCAPSULATED ELECTRONIC COMPONENTS |
GEIA SSB 1.002 : 1999
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ENVIRONMENTAL TESTS AND ASSOCIATED FAILURE MECHANISMS |
SAE AS 6294/2 : 2018
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REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN MILITARY AND AVIONICS APPLICATIONS |
BS EN 62258-1:2010
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SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
SAE AS 6171/11 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY DESIGN RECOVERY TEST METHODS |
IPC 7801 : 0
|
REFLOW OVEN PROCESS CONTROL STANDARD |
IEC PAS 62050:2004
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Board level drop test method of components for handheld electronic products |
I.S. EN 62258-1:2010
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SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
I.S. EN 16602-60-14:2014
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SPACE PRODUCT ASSURANCE - RELIFING PROCEDURE - EEE COMPONENTS |
SAE AS 6171 : 2016
|
TEST METHODS STANDARD; GENERAL REQUIREMENTS, SUSPECT/COUNTERFEIT, ELECTRICAL, ELECTRONIC, AND ELECTROMECHANICAL PARTS |
MIL STD 883 : K
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TEST METHOD STANDARD - MICROCIRCUITS |
EN 60749-20-1 : 2009
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
EN 62435-5 : 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES (IEC 62435-5:2017) |
EN 62435-1 : 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL (IEC 62435-1:2017) |
EN 62258-1:2010
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SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
I.S. EN 62435-2:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
I.S. EN 62435-1:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
IPC 7095 : C
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
BS EN 62258-2:2011
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SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
SAE AS 6171/8 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY RAMAN SPECTROSCOPY TEST METHODS |
SAE AS 6171/10 : 2016
|
TECHNIQUES FOR SUSPECT/COUNTERFEIT EEE PARTS DETECTION BY THERMOGRAVIMETRIC ANALYSIS (TGA) TEST METHODS |
BS PD IEC TS 62647-1 : 2012
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: PREPARATION FOR A LEAD-FREE CONTROL PLAN |
IEC PAS 62647-23:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
IPC 7351 : B
|
GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
DD IEC PAS 62050 : DRAFT 2004
|
BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS |
J STD 001 CHINESE : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
J STD 001 SPANISH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
J STD 001 FRENCH : F
|
REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES |
IPC 7093 : 0
|
DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BOTTOM TERMINATION COMPONENTS |
DSCC 89115 : E
|
CAPACITORS, FIXED, SURFACE MOUNT, METALLIZED POLYESTER FILM, NONHERMETICALLY SEALED |
IEC 62435-4:2018
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage |
I.S. EN 62258-2:2011
|
SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
IEC TS 62239-2:2017
|
Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan |
IEC 61760-4:2015
|
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
ARINC 669 : 2004
|
GUIDANCE FOR LEAD-BASED SOLDERING, REPAIR AND REWORK |
GEIA HB 0005-3 : 2008
|
REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
GEIA HB 0005-2 : 2007
|
TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES |
I.S. ES 59008-5-3:2002
|
DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-3: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - MINIMALLY-PACKAGED DIE |
EN 61760-4:2015/A1:2018
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
IEC PAS 62686-1:2011
|
Process management for avionics - Aerospace qualified electronic components (AQEC) - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
GEIA STD 0003 : 2006
|
LONG TERM STORAGE OF ELECTRONIC DEVICES |
GEIA STD 0006 : 2008
|
REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
GEIA STD 0005-1 : 2012
|
PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
NASA JSC 66491 : 2013
|
STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP) |
J STD 075 : 0
|
CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES |
EN 16602-60-14 : 2014
|
SPACE PRODUCT ASSURANCE - RELIFING PROCEDURE - EEE COMPONENTS |
IEC TS 62647-1:2012
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
IEC PAS 62168:2000
|
Symbols and labels for moisture-sensitive devices |
BS EN 62435-2:2017
|
Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
SAE AS 6294/1 : 2017
|
REQUIREMENTS FOR PLASTIC ENCAPSULATED MICROCIRCUITS IN SPACE APPLICATIONS |
BS EN 16602-60-13:2015
|
Space product assurance. Requirements for the use of COTS components |
IEC PAS 62686-2:2016
|
Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 2: General requirements for passive components |
ARINC 671 : 2006
|
GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
IEC TS 62686-1:2015
|
Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
J STD 020 : D-1
|
MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
J STD 020 CHINESE : D-1
|
MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES |
IPC M 109 : LATEST
|
COMPONENTS HANDLING MANUAL |
PD IEC/PAS 62686-2:2016
|
PROCESS MANAGEMENT FOR AVIONICS - ELECTRONIC COMPONENTS FOR AEROSPACE, DEFENCE AND HIGH PERFORMANCE (ADHP) APPLICATIONS - PART 2: GENERAL REQUIREMENTS FOR PASSIVE COMPONENTS |
IEC TS 62647-23:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
PD IEC/TS 62647-23:2013
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
DD IEC PAS 62686-1 : DRAFT JULY 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE QUALIFIED ELECTRONIC COMPONENTS (AQEC) - PART 1: GENERAL REQUIREMENTS FOR HIGH RELIABILITY INTEGRATED CIRCUITS AND DISCRETE SEMICONDUCTORS |
IEC PAS 62647-1:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Lead-free management |
PD IEC/PAS 62647-1:2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 1: LEAD-FREE MANAGEMENT |
IEC 62435-5:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
IEC TS 62647-22:2013
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC PAS 62647-22:2011
|
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines |
IEC 62435-2:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
IEC 62258-2:2011
|
Semiconductor die products - Part 2: Exchange data formats |
BS EN 62435-5:2017
|
Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
PD IEC/TS 62668-2:2016
|
PROCESS MANAGEMENT FOR AVIONICS - COUNTERFEIT PREVENTION - PART 2: MANAGING ELECTRONIC COMPONENTS FROM NON-FRANCHISED SOURCES |
PD IEC/TS 62686-1:2015 (published 2015-04)
|
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
DD IEC PAS 62647-23 : DRAFT AUG 2011
|
PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES |
ES 59008-5-3 : 2001
|
DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-3: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - MINIMALLY-PACKAGED DIE |
EN 16602-60-13 : 2015
|
SPACE PRODUCT ASSURANCE - REQUIREMENTS FOR THE USE OF COTS COMPONENTS |
BS EN 62435-1:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL (IEC 62435-1:2017) |
MIL PRF 23199/1 : B
|
PACKAGING, PACKING AND MARKING (PP&M) REQUIREMENTS FOR INSTRUMENTATION AND CONTROL EQUIPMENT |
BS EN 60749-20-1:2009
|
Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
12/30261600 DC : DRAFT MAR 2012
|
BS EN 61760-4 - CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
BS EN 61760-4 : 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
I.S. EN 61760-4:2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
I.S. EN 60749-20-1:2009
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
CEI EN 62258-2 : 2012
|
SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |
IEC 60749-20-1:2009
|
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
IEC 62258-1:2009
|
Semiconductor die products - Part 1: Procurement and use |
PD IEC/TS 62647-22:2013 (published 2013-10)
|
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines |
CEI EN 62258-1 : 2011
|
SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE |
EN 62435-2 : 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS (IEC 62435-2:2017) |
EN 62258-2:2011
|
SEMICONDUCTOR DIE PRODUCTS - PART 2: EXCHANGE DATA FORMATS |