• J STD 075 : 0

    NA Status of Standard is Unknown

    CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES

    Available format(s):  Hardcopy

    Language(s):  English

    Published date: 

    Publisher:  Institute of Printed Circuits

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    Table of Contents - (Show below) - (Hide below)

    1 GENERAL
       1.1 Scope
       1.2 Purpose
       1.3 Definitions
       1.4 General Requirements
           1.4.1 Agreements
           1.4.2 Definition of Requirements
           1.4.3 Measurement Units and Applications
    2 APPLICABLE DOCUMENTS
       2.1 IPC
       2.2 Joint Industry Standards
    3 SOLDERABILITY
    4 PROCESS
       4.1 Process Sensitivity Classification
       4.2 PSL Reclassification
       4.3 PSL Evaluation
       4.4 MSL Bake Out
    5 PSL CLASSIFICATION
    6 NUMBER OF PASSES/REFLOWS
    7 REWORK
    8 FLUX
    9 CLEANING
    10 BASE SOLDER PROCESS CONDITIONS - WAVE
    11 BASE SOLDER PROCESS CONDITIONS - REFLOW
    12 MSL CLASSIFICATION AND LABELING/PACKING
    13 PSL LABELING

    Abstract - (Show below) - (Hide below)

    Represents maximum process sensitivity levels and do not establish rework conditions or recommended processes for an assembler. Also outlines a process to classify and label non-semiconductor electronic component's Process Sensitivity Level (PSL) and Moisture Sensitivity Level (MSL) consistent with the semiconductor industry's classification levels (J-STD-020, Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Devices and J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices).

    General Product Information - (Show below) - (Hide below)

    Development Note Jointly published by ECA, IPC & JEDEC. Included in IPC C 103 & IPC C 1000. Supersedes IPC 9503. (09/2008) Also available in German Language, See J STD 075 GERMAN. (04/2009) Also available in Chinese Language, See J STD 075 CHINESE. (10/2010)
    Document Type Standard
    Publisher Institute of Printed Circuits
    Status NA

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 60068-2-58 : 2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    17/30357139 DC : 0 BS EN 61760-4 + A1 - SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    IPC 7801 : 0 REFLOW OVEN PROCESS CONTROL STANDARD
    IPC 1756 : 2010 MANUFACTURING PROCESS DATA MANAGEMENT
    J STD 001 CHINESE : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    J STD 001 SPANISH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    J STD 001 FRENCH : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    EN 61760-4:2015/A1:2018 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018)
    GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
    J STD 020 : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
    J STD 020 CHINESE : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    I.S. EN 61760-4:2015 SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES
    I.S. EN 60068-2-58:2015 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD)
    EN 60068-2-58:2015/A1:2018 ENVIRONMENTAL TESTING - PART 2-58: TESTS - TEST TD: TEST METHODS FOR SOLDERABILITY, RESISTANCE TO DISSOLUTION OF METALLIZATION AND TO SOLDERING HEAT OF SURFACE MOUNTING DEVICES (SMD) (IEC 60068-2-58:2015/A1:2017)

    Standards Referencing This Book - (Show below) - (Hide below)

    J STD 004 : B REQUIREMENTS FOR SOLDERING FLUXES
    J STD 033 : C-1 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
    IPC CH 65 : B GUIDELINES FOR CLEANING OF PRINTED BOARDS AND ASSEMBLIES
    J STD 002 : D SOLDERABILITY TESTS FOR COMPONENT LEADS, TERMINATIONS, LUGS, TERMINALS AND WIRES
    J STD 020 : D-1 MOISTURE/REFLOW SENSITIVITY CLASSIFICATION FOR NONHERMETIC SURFACE MOUNT DEVICES
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