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  • NEN-EN-IEC 61189-5-601:2021

    Current The latest, up-to-date edition.

    Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards

    Available format(s):  Hardcopy

    Language(s):  English - French

    Published date:  01-04-2021

    Publisher:  Netherlands Standards

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    Abstract - (Show below) - (Hide below)

    NEN-EN-IEC 61189-5-601 specifies the reflow soldering ability test method for componentsmounted on organic rigid printed boards, the reflow heat resistance test method for organic rigidprinted boards, and the reflow soldering ability test method for the lands of organic rigid printedboards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), orlead-free alloys.

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    Committee TC 91
    Document Type Test Method
    Publisher Netherlands Standards
    Status Current
    View more information

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