Foreword
1 Scope
2 General
2.1 Related Documents
2.2 Units, symbols and terminology
2.3 Preferred values
2.4 Marking
3 QUALITY ASSESSMENT PROCEDURES
3.1 General
3.2 Primary stage of manufacture
3.3 Subcontracting
3.4 Structurally similar components
3.5 Qualification approval procedures
3.6 Capability approval procedures
3.7 Rework and repair work
3.8 Release for delivery
3.9 Certified test records
3.10 Delayed delivery
3.11 Alternative test methods
3.12 Manufacture outside the geographical limits of
CECC supervising
3.13 Intermediate values within an approved range
4 TESTS AND MEASUREMENT PROCEDURES
4.1 General
4.2 Standard atmospheric conditions
4.3 Visual examination and check of dimensions
4.4 Insulation resistance
4.5 Voltage proof, a.c. test
4.6 Capacitance
4.7 Tangent of loss angle
4.8 Variation of capacitance with temperature
4.9 Capacitive leakage current
4.10 Robustness of terminations
4.11 Resistance to soldering heat
4.12 Solderability
4.13 Rapid change of temperature
4.14 Vibration
4.15 Container sealing
4.16 Damp heat, steady state
4.17 Endurance
4.18 Dielectric stability
4.19 Pressure relief
4.20 Solvent resistance of marking
4.21 Electrical contact between metal case and
mounting device
ANNEX A (normative) INTERPRETATION OF SAMPLING PLANS AND
PROCEDURES AS DESCRIBED IN IEC 410 FOR USE WITHIN THE
CECC SYSTEM FOR ELECTRONIC COMPONENTS