SN EN 60749 : 1999 AMD 1 2000

Chapter 1: General
1 Scope and object
2 Normative references
3 Terms, definitions and letter symbols
4 Standard atmospheric conditions
5 External visual examination and verification of dimensions
6 Electrical measurements
Chapter 2: Mechanical test methods
1 Robustness of terminations
   1.1 Tensile
   1.2 Bending
   1.3 Torsion
   1.4 Torque
2 Soldering
   2.1 Solderability
   2.2 Resistance to soldering heat
   2.3 Resistance of plastic encapsulated SMDs to the
        combined effect of moisture and soldering heat
3 Vibration (sinusoidal)
4 Shock
5 Acceleration, steady state
6 Bond strength test
   6.1 General
   6.2 Methods A and B
   6.3 Method C
   6.4 Method D
   6.5 Methods E and F
   6.6 Method G: Wire ball shear test
   6.7 Information to be given in the relevant specification
7 Die shear strength test
   7.1 Object
   7.2 Description of the test apparatus
   7.3 Test method
   7.4 Failure criteria
   7.5 Requirements
   7.6 Information to be given in the relevant
        specification
Chapter 3: Climatic Test Methods
1 Change of temperature
   1.1 Rapid change of temperature: two-chamber method
   1.2 Rapid change of temperature: two-fluid-bath method
2 Storage (at high temperature)
3 Low air pressure
4A Damp heat, steady state
4B Damp heat, steady state, accelerated
4C Damp heat, steady state, highly accelerated
5 Sealing
   5.1 General terms
   5.2 Bomb pressure test
   5.3 Fine leak detection: radioactive krypton method
   5.4 Fine leak detection: tracer gas method with mass spectrometer
   5.5 Gross leak, perfluorocarbon vapour method using electronic
        detection apparatus
   5.6 Gross leak - perfluorocarbon - bubble detection method
   5.7 Test condition E, weight-gain gross-leak detection
   5.8 Penetrant dye gross leak detection
   5.9 Gross leak re-tests
6 Salt mist
7 Thermal intermittence test
8 Internal moisture content measurement by mass
   spectrometry method
   8.1 Object
   8.2 General description
   8.3 Test apparatus
   8.4 Preconditioning
   8.5 Conditioning
   8.6 Requirements
   8.7 Information to be given in the relevant specification
   8.8 Guidance
Chapter 4: Miscellaneous Test Methods
1 Flammability tests of plastic-encapsulated devices
   1.1 Flammability (internally induced)
   1.2 Flammability (externally induced)
2 Permanence of marking
Annex A (normative) Guidance
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Defines test methods to semiconductor devices (discrete devices and integrated circuits) from which a selection may be made. Additional test methods may be required for non-cavity devices.