1 Scope
2 Normative references
3 Terminology
4 Test procedures
4.1 Test and measurement conditions
4.1.1 Measurement uncertainty
4.1.2 Alternative test methods
4.2 Visual inspection
4.2.1 Protective screen position
4.2.2 Quality of solder joints
4.3 Dimensioning and gauging procedure
4.4 Electrical test procedures
4.4.1 Winding resistance
4.4.2 Insulation tests
4.4.3 Losses
4.4.4 Inductance
4.4.5 Unbalance
4.4.6 Capacitance
4.4.7 Transformation ratios
4.4.8 Resonant frequency
4.4.9 Signal transfer characteristics
4.4.10 Frequency response
4.4.11 Pulse characteristics
4.4.12 Voltage-time product rating
4.4.13 Total harmonic distortion
4.4.14 Voltage regulation
4.4.15 Temperature rise
4.4.16 Surface temperature
4.4.17 Phase test (polarity)
4.4.18 Screens
4.4.19 Noise
4.4.20 Corona test
4.4.21 Magnetic fields
4.4.22 Inrush current
4.5 Environmental test procedures
4.5.1 General
4.5.2 Soldering
4.5.3 Robustness of terminations and integral
mounting devices
4.5.4 Shock
4.5.5 Bump
4.5.6 Vibration (sinusoidal)
4.5.7 Acceleration, steady state
4.5.8 Rapid change of temperature (thermal
shock in air)
4.5.9 Sealing
4.5.10 Climatic sequence
4.5.11 Damp heat, steady state
4.5.12 Dry heat
4.5.13 Mould grown
4.5.14 Salt mist, cyclic (sodium chloride
solution)
4.5.15 Sulphur dioxide test for contacts and
connections
4.5.16 Fire hazard
4.5.17 Immersion in cleaning solvents
4.6 Endurance test procedures
4.6.1 Short-term endurance (load run)
4.6.2 Long-term endurance (life test)
Annex
ZA Normative references to international publications
with their corresponding European publications