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WORKMANSHIP REQUIREMENTS FOR SOLDERED ELECTRONIC ASSEMBLIES - PART 3: THROUGH-HOLE MOUNT ASSEMBLIES
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Published date: 12-01-2013
Publisher: Swiss Standards
INTRODUCTION1 Scope2 Normative references3 Terms and definitions4 General requirements 4.1 Classification 4.2 Conflict 4.3 Inspection techniques 4.4 Interpretation of requirements5 Component preparation processes 5.1 Lead forming 5.2 Lead protrusion and clinching 5.3 Lead cutting/cropping 5.4 Pre-tinning6 Masking attributes 6.1 Misalignment 6.2 Improper adhesion 6.3 Thermal capability7 Insertion of through-hole components 7.1 General requirements 7.2 Orientation and mounting criteria 7.3 Missing components 7.4 Wrong components 7.5 Damaged components8 Soldering process attributes 8.1 General requirements 8.2 Misalignment 8.3 Damaged components 8.4 Solder joint characteristics9 Cleaning attributes 9.1 Flux residues 9.2 Other residues10 Rework/replacement attributesAnnex ZA (normative) Normative references to international publications with their corresponding European publications
Provides general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates.
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