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  • UNE-EN ISO 9453:2015

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)

    Available format(s):  Hardcopy, PDF

    Superseded date:  28-07-2021

    Language(s):  Spanish, Castilian, English

    Published date:  22-04-2015

    Publisher:  Asociacion Espanola de Normalizacion

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Introduction
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Chemical composition
    5 Forms of delivery
    6 Sampling and analysis
    7 Marking, labelling and packaging
    Annex A (informative) Comparison between alloy numbers
            in ISO 9453 and short names and chemical
            compositions according to IEC 61190-1-3
    Bibliography

    Abstract - (Show below) - (Hide below)

    Describes the requirements for chemical composition for the following families of soft solder alloys: - tin-lead, with and without antimony, bismuth, cadmium, copper, and silver; - tin-antimony; - tin-bismuth; - tin-copper, with and without silver; - tin-indium, with and without silver and bismuth; - tin-silver, with and without copper and bismuth; - tin-zinc, with and without bismuth.

    General Product Information - (Show below) - (Hide below)

    Committee CTN 14
    Development Note Supersedes UNE EN 29453. (03/2007)
    Document Type Standard
    Publisher Asociacion Espanola de Normalizacion
    Status Superseded
    Superseded By
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 3677:2016 Filler metal for soldering and brazing — Designation
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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