Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and symbols
3.1 Terms and definitions
3.2 Symbols and abbreviations
4 Principles
4.1 General principles of the measurement
4.2 Biaxial stress analysis
4.3 Triaxial stress analysis
5 Specimen
5.1 Material characteristics
5.1.1 General
5.1.2 Shape, dimensions and weight
5.1.3 Specimen composition/homogeneity
5.1.4 Grain size and diffracting domains
5.1.5 Specimen X-ray transparency
5.1.6 Coatings and thin layers
5.2 Preparation of specimen
5.2.1 Surface preparation
5.2.2 Stress depth profiling
5.2.3 Large specimen or complex geometry
6 Equipment
6.1 General
6.2 Choice of equipment
6.2.1 General
6.2.2 The [omega]-method
6.2.3 The [chi]-method
6.2.4 The modified [chi]-method
6.2.5 Other geometries
6.3 Choice of radiation
6.4 Choice of the detector
6.5 Performance of the equipment
6.5.1 Alignment
6.5.2 Performance of the goniometer
6.6 Qualification and verification of the equipment
6.6.1 General
6.6.2 Qualification
6.6.3 Verification of the performance of
the qualified equipment
7 Experimental Method
7.1 General
7.2 Specimen positioning
7.3 Diffraction conditions
7.4 Data collection
8 Treatment of the data
8.1 General
8.2 Treatment of the diffraction data
8.2.1 General
8.2.2 Intensity corrections
8.2.3 Determination of the diffraction
line position
8.2.4 Correction on the diffraction line
position
8.3 Stress calculation
8.3.1 Calculation of strains and stresses
8.3.2 Errors and uncertainties
8.4 Critical assessment of the results
8.4.1 General
8.4.2 Visual inspection
8.4.3 Quantitative inspection
9 Report
10 Experimental determination of XECs
10.1 Introduction
10.2 Loading device
10.3 Specimen
10.4 Loading device calibration and specimen
accommodation
10.5 Diffractometer measurements
10.6 Calculation of XECs
11 Reference specimens
11.1 Introduction
11.2 Stress-free reference specimen
11.2.1 General
11.2.2 Preparation of the stress-free specimen
11.2.3 Method of measurement
11.3 Stress-reference specimen
11.3.1 Laboratory qualified (LQ) stress-reference
specimen
11.3.2 Inter-laboratory qualified (ILQ)
stress-reference specimen
12 Limiting cases
12.1 Introduction
12.2 Presence of a subsurface stress gradient
12.3 Surface stress gradient
12.4 Surface roughness
12.5 Non-flat surfaces
12.6 Effects of specimen microstructure
12.6.1 Textured materials
12.6.2 Multiphase materials
12.7 Broad diffraction lines
Annex A (informative) - Schematic representation of
the European XRPD Standardisation Project
Annex B (informative) - Sources of Residual Stress
B.1 General
B.2 Mechanical processes
B.3 Thermal processes
B.4 Chemical processes
Annex C (normative) - Determination of the stress
state - General Procedure
C.1 General
C.2 Using the exact definition of the deformation
C.2.1 General
C.2.2 Determination of the stress tensor
components
C.2.3 Determination of [theta] and d[0]
C.3 Using an approximation of the definition
of the deformation
C.3.1 General
C.3.2 Determination of the stress tensor
components
C.3.3 Determination of [theta]0 and d[0]
Annex D (informative) - Recent developments
D.1 Stress measurement using two-dimensional
diffraction data
D.2 Depth resolved evaluation of near surface
residual stress - The Scattering Vector Method
D.3 Accuracy improvement through the use of
equilibrium conditions for determination
of stress profile
Annex E (informative) - Details of treatment of the
measured data
E.1 Intensity correction on the scan
E.1.1 General
E.1.2 Divergence slit conversion
E.1.3 Absorption correction
E.1.4 Background correction
E.1.5 Lorentz-polarisation correction
E.1.6 K-Alpha2 stripping
E.2 Diffraction line position determination
E.2.1 Centre of Gravity methods
E.2.2 Parabola Fit
E.2.3 Profile Function Fit
E.2.4 Middle of width at x% height method
E.2.5 Cross-correlation method
E.3 Correction on the diffraction line position
E.3.1 General
E.3.2 Remaining misalignments
E.3.3 Transparency correction
Annex F (informative) - General description of
acquisition methods
F.1 Introduction
F.2 Definitions
F.3 Description of the various acquisition methods
F.3.1 General method
F.3.2 Omega (omega) method
F.3.3 Chi (chi) method
F.3.4 Combined tilt method (also called
scattering vector method)
F.3.5 Modified chi method
F.3.6 Low incidence method
F.3.7 Modified omega method
F.3.8 Use of a 2D (area) detector
F.4 Choice of [phi] and [psi] angles
F.5 The stereographic projection
Annex G (informative) - Normal Stress Measurement
Procedure" and "Dedicated Stress Measurement
Procedure
G.1 Introduction
G.2 General
G.2.1 Introduction
G.2.2 Normal stress measurement procedure
for a single specimen
G.2.3 Dedicated Stress Measurement Procedure
for very similar specimens
Bibliography