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    IEC PAS 62137-3 : 1.0

    ELECTRONICS ASSEMBLY TECHNOLOGY - SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS

    International Electrotechnical Committee

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    IEC 62137-1-3 : 1.0

    SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-3: CYCLIC DROP TEST

    International Electrotechnical Committee

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    IEC 62137-1-4 : 1.0

    SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINT - PART 1-4: CYCLIC BENDING TEST

    International Electrotechnical Committee

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    IEC 62137-1-5 : 1.0

    SURFACE MOUNTING TECHNOLOGY - ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SURFACE MOUNT SOLDER JOINTS - PART 1-5: MECHANICAL SHEAR FATIGUE TEST

    International Electrotechnical Committee

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    IEC 60068-2-82 : 1.0 : COR 1

    ENVIRONMENTAL TESTING - PART 2-82: TESTS - TEST XW[1]: WHISKER TEST METHODS FOR ELECTRONIC AND ELECTRIC COMPONENTS

    International Electrotechnical Committee

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    IEC 61760-3 : 1.0

    SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING

    International Electrotechnical Committee

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    IEC 60068-2-83 : 1.0

    ENVIRONMENTAL TESTING - PART 2-83: TESTS - TEST TF: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS FOR SURFACE MOUNTING DEVICES (SMD) BY THE WETTING BALANCE METHOD USING SOLDER PASTE

    International Electrotechnical Committee

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    IEC 62137-3 : 1.0

    ELECTRONICS ASSEMBLY TECHNOLOGY - PART 3: SELECTION GUIDANCE OF ENVIRONMENTAL AND ENDURANCE TEST METHODS FOR SOLDER JOINTS

    International Electrotechnical Committee

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    IEC 60068-2-21 : 6.0 : COR 1

    ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES

    International Electrotechnical Committee

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    IEC 61193-3 : 1ED 2013

    QUALITY ASSESSMENT SYSTEMS - PART 3: SELECTION AND USE OF SAMPLING PLANS FOR PRINTED BOARD AND LAMINATE END-PRODUCT AND IN-PROCESS AUDITING

    International Electrotechnical Committee

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