PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES

International Electrotechnical Committee

TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING

International Electrotechnical Committee

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY

International Electrotechnical Committee

ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES

International Electrotechnical Committee

COMPLETE FILTER UNITS FOR RADIO INTERFERENCE SUPPRESSION - PART 2-2: BLANK DETAIL SPECIFICATION - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - FILTERS FOR WHICH SAFETY TESTS ARE REQUIRED (SAFETY TESTS ONLY)

International Electrotechnical Committee

DEVICE EMBEDDED SUBSTRATE - PART 2-3: GUIDELINES - DESIGN GUIDE

International Electrotechnical Committee

DEVICE EMBEDDED SUBSTRATE - PART 2-1: GUIDELINES - GENERAL DESCRIPTION OF TECHNOLOGY

International Electrotechnical Committee

DEVICE EMBEDDED SUBSTRATE - PART 2-4: GUIDELINES - TEST ELEMENT GROUPS (TEG)

International Electrotechnical Committee

PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS

International Electrotechnical Committee

SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES

International Electrotechnical Committee