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    IEC 61191-1 : 2.0

    PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES

    International Electrotechnical Committee

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    IEC 62739-1 : 1ED 2013

    TEST METHOD FOR EROSION OF WAVE SOLDERING EQUIPMENT USING MOLTEN LEAD-FREE SOLDER ALLOY - PART 1: EROSION TEST METHOD FOR METAL MATERIALS WITHOUT SURFACE PROCESSING

    International Electrotechnical Committee

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    IEC 61190-1-2 : 3.0

    ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY

    International Electrotechnical Committee

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    IEC 62137-4 : 1ED 2014

    ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES

    International Electrotechnical Committee

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    IEC 60939-2-2 : 1.0

    COMPLETE FILTER UNITS FOR RADIO INTERFERENCE SUPPRESSION - PART 2-2: BLANK DETAIL SPECIFICATION - PASSIVE FILTER UNITS FOR ELECTROMAGNETIC INTERFERENCE SUPPRESSION - FILTERS FOR WHICH SAFETY TESTS ARE REQUIRED (SAFETY TESTS ONLY)

    International Electrotechnical Committee

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    IEC TS 62878-2-3 : 1ED 2015

    DEVICE EMBEDDED SUBSTRATE - PART 2-3: GUIDELINES - DESIGN GUIDE

    International Electrotechnical Committee

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    IEC TS 62878-2-1 : 1ED 2015

    DEVICE EMBEDDED SUBSTRATE - PART 2-1: GUIDELINES - GENERAL DESCRIPTION OF TECHNOLOGY

    International Electrotechnical Committee

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    IEC TS 62878-2-4 : 1ED 2015

    DEVICE EMBEDDED SUBSTRATE - PART 2-4: GUIDELINES - TEST ELEMENT GROUPS (TEG)

    International Electrotechnical Committee

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    IEC 60194 : 6.0

    PRINTED BOARD DESIGN, MANUFACTURE AND ASSEMBLY - TERMS AND DEFINITIONS

    International Electrotechnical Committee

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    IEC 61760-4 : 1ED 2015

    SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES

    International Electrotechnical Committee

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