1 Scope
2 Normative references
3 Terms and definitions
4 Test methods
5 Performance levels
6 Base materials
7 Visual inspection
7.1 Test environment
7.2 Test specimens
7.3 Tools for testing
7.4 Preparation of limit samples
7.5 Description of inspection
8 Dimensional inspections
8.1 Measurement of dimension
8.2 External dimension
8.3 Thickness
8.4 Hole diameter
8.5 Conductor width
8.6 Cumulative pattern pitch
8.7 Distance between hole centers
8.8 Design minimum distance between board edge and
conductor
8.9 Position accuracy
8.10 Registration of pressure sensitive or heatactivated
adhesive (Including adhesive squeeze-out) to flexible
printed board and stiffener
9 Electrical performance test
10 Mechanical performance test
11 Environmental performance
12 Chemical resistance
13 Cleanliness
14 Flame resistance
15 Marking, packaging, and storage
15.1 Marking on products
15.2 Marking on package
15.3 Packaging and storage
Annex A - Handling instruction manual handling of
polyimide-base FPC
Annex B - Ion migration test
Annex C - Whisker test
Annex D - Additional information - Explanation on JPCA
performance guide for single-and double-sided
flexible printed wiring boards