Skip to content
Please enter a keyword to search

  • IEC TR 62878-2-7:2019

    Current The latest, up-to-date edition.

    Device embedding assembly technology - Part 2-7: Guidelines - Accelerated stress testing of passive embedded circuit boards

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Language(s):  English

    Published date:  20-03-2019

    Publisher:  International Electrotechnical Committee

    Add To Cart

    Abstract - (Show below) - (Hide below)

    IEC TR 62878-2-7:2019 (E) describes the accelerated stress testing of passive embedded circuit boards. It can be used for screening finished boards, including multilayer and high-density interconnection (HDI) boards. These boards are mainly for mobile devices.

    General Product Information - (Show below) - (Hide below)

    Document Type Technical Report
    Publisher International Electrotechnical Committee
    Status Current
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective