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  • SAC GB/T 37312.1:2019

    Current The latest, up-to-date edition.

    Process management for avionics—Electronic components for aerospace, defence and high performance (ADHP) applications—Part 1: General requirements for high reliability integrated circuits and discrete semiconductors

    Available format(s):  Hardcopy, PDF

    Language(s):  Chinese

    Published date:  25-03-2019

    Publisher:  Standardization Administration of China

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    Committee TC 427
    Document Type Standard
    Product Note THIS DOCUMENT ALSO REFERS TO - IPC JEDECJ-STD-020, IPC/JEDECJ-STD-033, IPC/JEDEC J-STD-609, JEDEC/IPC/ECIAJ-STD-048, JEP130, IPC/JEDECJ-STD-035, JEP 119, JESD6, JEP154, JEP148, JEP138, JEP122, JESD22-A102,JESD22-A108,JESD22-A109, JESD22-A113, JESD22-A114,JESD22-B100,JESD22-B101,JESD22-B102, JESD22-B103, JESD22-B104, JESD22-B105, JESD22-B106, JESD22-B107,JESD22-B116, JESD24, JESD24-4, JESD36, JESD51,JESD52, JESD625, JESD76, JESD76-1, JESD76-2, JESD76-3, JESD78, JESD79, JESD79-2, JESD79-3, JESD86, JESD94, JESD201, JESD202, JESD213, JESD282, JESD313, JP001.01, RC 14001, RTCA DO-254, TL 9000
    Publisher Standardization Administration of China
    Status Current
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