Packaging of components for automatic handling Packaging of surface mount components on continuous tapes

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Hardcopy , PDF

Language(s)

English

Published date

17-01-2023

Publisher

British Standards Institution

Committee	W/-
DocumentType	Standard
Pages	64
PublisherName	British Standards Institution
Status	Current
Supersedes	BS EN IEC 60286-3:2019

This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).

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BS EN IEC 60286-3:2022

Packaging of components for automatic handling Packaging of surface mount components on continuous tapes

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