BS EN IEC 60286-3:2022
Current
The latest, up-to-date edition.
Packaging of components for automatic handling Packaging of surface mount components on continuous tapes
Hardcopy , PDF
English
17-01-2023
Important note : Users cannot be edited or removed once added to your Multi user PDF.| Committee |
W/-
|
| DocumentType |
Standard
|
| Pages |
64
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.