Foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and symbols
3.1 Terms and definitions
3.2 Symbols and abbreviations
4 Principles
4.1 General principles of the measurement
4.2 Biaxial stress analysis
4.3 Triaxial stress analysis
5 Specimen
5.1 Material characteristics
5.2 Preparation of specimen
6 Equipment
6.1 General
6.2 Choice of equipment
6.3 Choice of radiation
6.4 Choice of the detector
6.5 Performance of the equipment
6.6 Qualification and verification of the equipment
7 Experimental Method
7.1 General
7.2 Specimen positioning
7.3 Diffraction conditions
7.4 Data collection
8 Treatment of the data
8.1 General
8.2 Treatment of the diffraction data
8.3 Stress calculation
8.4 Critical assessment of the results
9 Report
10 Experimental determination of XECs
10.1 Introduction
10.2 Loading device
10.3 Specimen
10.4 Loading device calibration and specimen
accommodation
10.5 Diffractometer measurements
10.6 Calculation of XECs
11 Reference specimens
11.1 Introduction
11.2 Stress-free reference specimen
11.3 Stress-reference specimen
12 Limiting cases
12.1 Introduction
12.2 Presence of a subsurface stress gradient
12.3 Surface stress gradient
12.4 Surface roughness
12.5 Non-flat surfaces
12.6 Effects of specimen microstructure
12.7 Broad diffraction lines
Annex A (informative) Schematic representation of the
European XRPD Standardisation Project
Annex B (informative) Sources of Residual Stress
B.1 General
B.2 Mechanical processes
B.3 Thermal processes
B.4 Chemical processes
Annex C (normative) Determination of the stress
state - General Procedure
C.1 General
C.2 Using the exact definition of the deformation
C.3 Using an approximation of the definition
of the deformation
Annex D (informative) Recent developments
D.1 Stress measurement using two-dimensional
diffraction data
D.2 Depth resolved evaluation of near surface
residual stress - The Scattering Vector Method
D.3 Accuracy improvement through the use
of equilibrium conditions for determination of
stress profile
Annex E (informative) Details of treatment of
the measured data
E.1 Intensity correction on the scan
E.2 Diffraction line position determination
E.3 Correction on the diffraction line position
Annex F (informative) General description
of acquisition methods
F.1 Introduction
F.2 Definitions
F.3 Description of the various acquisition methods
F.4 Choice of [phi] and [psi] angles
F.5 The stereographic projection
Annex G (informative) Normal Stress Measurement
Procedure and Dedicated Stress
Measurement Procedure
G.1 Introduction
G.2 General
Bibliography
National Annex NA (informative) Bibliography