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  • IEC 60749-3:2002

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  14-09-2019

    Language(s): 

    Published date:  09-04-2002

    Publisher:  International Electrotechnical Committee

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    Abstract - (Show below) - (Hide below)

    Aims at verifying that the materials, design, construction, markings, and workmanship of a semiconductor device are in accordance with the applicable procurement document. External visual inspection is a non-destructive test and applicable for all package types.The contents of the corrigendum of August 2003 have been included in this copy.

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    Committee TC 47
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
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