IEC PAS 62173:2000

Superseded

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Solderability test method

Available format(s): Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

Superseded date: 15-03-2004

Language(s): English

Published date: 22-08-2000

Publisher: International Electrotechnical Committee

Table of Contents - (Show below) - (Hide below)

1 Purpose
2 Apparatus
  2.1 Solder pot
  2.2 Dipping device
  2.3 Optical equipment
  2.4 Steam aging equipment
  2.5 Lighting equipment
  2.6 Materials
  2.7 SMD reflow equipment
3 Procedure for simulated board mounting reflow
  solderability test in SMDs
  3.1 Test equipment set-up
  3.2 Specimen preparation and surface condition
  3.3 Visual inspection
4 Procedure for dip and look solderability testing
  4.1 Preconditioning
  4.2 Solder dip conditions
  4.3 Testing
5 Summary
Figures
Tables

Abstract - (Show below) - (Hide below)

Provides a means of determining the solderability of device package terminations that are intended to be joined to another surface using solder for the attachment.Provides also optional conditions for ageing and soldering for the purpose of allowing simulation of the soldering process to be used in the device application.

General Product Information - (Show below) - (Hide below)

Document Type	Miscellaneous Product
ISBN
Pages
Published
Publisher	International Electrotechnical Committee
Status	Superseded
Superseded By	IEC 60749-21:2011

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