• SEMI G11 : 1988

    Current The latest, up-to-date edition.

    RECOMMENDED PRACTICE FOR RAM FOLLOWER GEL TIME AND SPIRAL FLOW OF THERMAL SETTING MOLDING COMPOUNDS

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    Published date:  12-01-2013

    Publisher:  Semiconductor Equipment & Materials Institute

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    Abstract - (Show below) - (Hide below)

    Describes a procedure for measuring the gel and flow characteristics of semiconductor grade transfer molding compounds using a ram follower device.

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    Development Note Not available for sale from ILI, customer to contact SEMI. (05/2001)
    Document Type Standard
    Publisher Semiconductor Equipment & Materials Institute
    Status Current
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