• TR NWT 000870 : ISSUE 1

    Current The latest, up-to-date edition.

    ELECTROSTATIC DISCHARGE CONTROL IN THE MANUFACTURE OF TELECOMMUNICATIONS EQUIPMENT

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    Published date:  12-01-2013

    Publisher:  Telcordia Technologies

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    Table of Contents - (Show below) - (Hide below)

    1 INTRODUCTION
    1.1 Scope
    1.2 Document Organization
    1.3 Reason for Issue
    1.4 Requirements Terminology
    2 ESD TUTORIAL
    2.1 The Origin of ESD
    2.1.1 Electric Charge in Conductors and Insulators
    2.1.1.1 Electric Fields and Potentials Versus Charge
    2.1.1.2 Electrical Resistivity of Materials
    2.1.1.3 Electrical Capacitance
    2.1.2 Charging of Materials
    2.1.2.1 Triboelectric Charging
    2.1.2.2 Induction Charging
    2.1.2.3 Spray Charging
    2.1.2.4 Ion Beam Charging
    2.1.2.5 Other Charging Mechanisms
    2.1.2.6 Humidity Effects
    2.1.3 Discharging of Materials
    2.2 The Effects of ESD
    2.2.1 The Types of ESD
    2.2.1.1 The Human Body Model
    2.2.1.2 The Charged Device Model
    2.2.1.3 The Field Induced Model
    2.2.1.4 Electrical Overstress
    2.2.2 The Electrical Parameters of ESD Stress
    2.2.3 ESD Failure Mechanisms
    2.3 Sources of ESD
    2.3.1 Human-Related Sources
    2.3.1.1 Clothing
    2.3.1.2 Furniture
    2.3.1.3 Floors
    2.3.2 Packaging
    2.3.3 Tools
    2.3.4 Manufacturing Equipment and Processes
    2.3.4.1 Taping
    2.3.4.2 Curing in Airflow Ovens
    2.3.4.3 Freezing Sprays
    2.3.4.4 Degreasing or Defluxing Operations
    2.3.4.5 Ultraviolet Light Inspection Areas
    2.3.4.6 Sandblasting
    3 PRACTICAL ASPECTS OF ESD PREVENTION
    3.1 ESD Retardant Materials
    3.1.1 General Requirements for Packaging
    3.1.1.1 Protection from Physical Damage
    3.1.1.2 Protection from Triboelectric Charge Generation
    3.1.1.3 Protection from Direct ESD Events
    3.1.2 Other Materials Properties
    3.1.2.1 Cleanability
    3.1.2.2 Resistance to Sloughing
    3.1.2.3 Solderability/Contact Reliability
    3.1.3 Packaging Material Classifications
    3.1.3.1 Conductive and Shielding Materials
    3.1.3.2 Dissipative Materials
    3.1.3.3 Insulative Materials
    3.1.4 Packages for Sensitive Components
    3.1.4.1 Protective Bags
    3.1.4.2 IC Shipping Tubes
    3.2 Personnel Grounding
    3.2.1 Wrist Straps
    3.2.2 Conductive Flooring
    3.2.2.1 Topical Floor Treatments
    3.2.2.2 Mats
    3.2.2.3 Static Retardant Flooring
    3.2.2.4 Shoes and Heel Straps
    3.2.3 Static Retardant Clothing
    3.3 Automatic Device Handlers
    3.4 Ion Generators
    4 DEVICE CLASSIFICATION AND TEST METHODS
    4.1 ESD Sensitivity Classifications
    4.2 Determination of Human Body Model ESD Failure
                  Thresholds
    4.2.1 Use of Private or Public Databases
    4.2.2 Use of Component Vendor Data
    4.2.3 Experimental ESD Threshold Measurement
    4.2.3.1 Required Equipment
    4.2.3.2 Waveform Verification Procedure
    4.2.3.3 Classification Testing
    4.3 Charge Device Model Thresholds
    5 TEST METHODS FOR EVALUATION OF ESD PREVENTION
                  PROGRAMS
    5.1 Measuring Charge Levels
    5.1.1 IC Shipping Tubes
    5.1.2 Sheet Materials
    5.1.3 Bags and Pouches
    5.1.4 Miscellaneous Packaging
    5.2 Measuring Voltage Levels
    5.3 Measuring Resistivity Properties
    5.3.1 Sheet Resistance
    5.3.2 Decay Properties
    5.3.3 Buried Shielding Layers
    6 ESD GENERIC REQUIREMENTS
    6.1 Sensitivity Areas within the Manufacturing
                  Facility
    6.2 Failure Threshold Determination
    6.3 Limits for Electrostatic Potential
    6.4 Grounding
    6.4.1 Personnel
    6.4.1.1 Wrist Straps
    6.4.1.2 Conductive Floors/Heel Straps
    6.4.1.3 Static Retardant Garments
    6.4.2 Equipment
    6.5 Packaging
    6.5.1 Materials
    6.5.2 Physical Design
    6.5.3 Facility/Packaging Audits
    6.5.4 Limits on Packaging Charge
    6.6 Tote Boxes
    6.7 Table Tops
    6.8 Ion Generators
    6.8.1 Decay Time Specification
    6.8.2 Ionizer System Measurement and Calibration
                  Specifications
    6.9 Summary of Required Preventive Measures
    7 CONDUCTION OF ESD AUDITS AT VENDOR PLANT
    8 GLOSSARY
    8.1 Acronyms
    8.2 Definition of Terms
    9 REFERENCES
    LIST OF FIGURES
    Figure 2-1 Drawing of the Faraday Cup
    Figure 2-2 Charging of a Conductor by Induction
    Figure 2-3 The Ideal HBM ESD Waveform at 1500-V Stress
    Figure 2-4 Schematic Circuit Diagram of Standard HBM
                  ESD Simulator
    Figure 2-5 Schematic Drawing of CDM ESD Simulator
    Figure 2-6 CDM ESD Stress Waveform
    Figure 2-7 CDM, HBM and EOS Stressing Waveforms
    LIST OF TABLES
    Table 2-1 Triboelectric Series
    Table 2-2 Typical Electrostatic Voltages
    Table 2-3 ESD versus EOS Stressing Parameters
    Table 3-1 Classifications of Packaging Materials
    Table 4-1 ESD Sensitivity Classifications
    Table 4-2 Stress Current Waveform Specifications
    Table 4-3 Stressing Pin Combinations
    Table 6-1 Required ESD Preventive Measurements

    Abstract - (Show below) - (Hide below)

    Presents Bellcore's view of proposed generic requirements for the control of Electrostatic Discharge (ESD) in telecommunications equipment & component manufacturing plants. Contains Bellcore's view of ESD control requirements that are intended to minimize the adverse impact of ESD on the quality & reliability of telecommunications systems purchased by the BCCs. Also applies to internal ESD control measures in such locations as Plug-in Inventory Control (PIC) centers.

    General Product Information - (Show below) - (Hide below)

    Development Note Included in FR 796. (04/2001) Supersedes TA TSY 000870 and TR TSY 000382 (03/2004)
    Document Type Standard
    Publisher Telcordia Technologies
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    I.S. EN 62343-2:2014 DYNAMIC MODULES - PART 2: RELIABILITY QUALIFICATION
    GR 1221 CORE : ISSUE 3 GENERIC RELIABILITY ASSURANCE REQUIREMENTS FOR PASSIVE OPTICAL COMPONENTS
    IEC 62343-2:2014 Dynamic modules - Part 2: Reliability qualification
    CEI EN 62343-2 : 2015 DYNAMIC MODULES - PART 2: RELIABILITY QUALIFICATION
    TA NWT 000983 : ISSUE 2 RELIABILITY ASSURANCE PRACTICES FOR OPTOELECTRONIC DEVICES IN LOOP APPLICATIONS
    GR 468 CORE : ISSUE 2 GENERIC RELIABILITY ASSURANCE REQUIREMENTS FOR OPTOELECTRONIC DEVICES USED IN TELECOMMUNICATIONS EQUIPMENT
    GR 2903 CORE : ISSUE 1 RELIABILITY ASSURANCE PRACTICES FOR FIBER OPTIC DATA LINKS
    GR 2912 CORE : ISSUE 1 GENERIC REQUIREMENTS FOR RELIABILITY IN MANUFACTURING
    TR NWT 000418 : ISSUE 2 GENERIC RELIABILITY ASSURANCE REQUIREMENTS FOR FIBER OPTIC TRANSPORT SYSTEMS (A MODULE OF RQGR, FR-NWT-000796)
    BS EN 62343-2:2014 Dynamic modules Reliability qualification
    GR 78 CORE : ISSUE 2 GENERIC REQUIREMENTS FOR THE PHYSICAL DESIGN AND MANUFACTURE OF TELECOMMUNICATIONS PRODUCTS AND EQUIPMENT
    13/30280815 DC : 0 BS EN 62343-2 - DYNAMIC MODULES - PART 2: RELIABILITY QUALIFICATION
    TR NWT 000840 : ISSUE 1 SUPPLIER SUPPORT GENERIC REQUIREMENTS (SSGR)
    EN 62343-2:2014 Dynamic modules - Part 2: Reliability qualification
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