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UNE-EN 60249-2-19:1997

Current

Current

The latest, up-to-date edition.

BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.

Available format(s)

Hardcopy , PDF

Language(s)

Spanish, Castilian, English

Published date

11-08-1997

€69.60
Excluding VAT

Committees responsible
National foreword
Specification
1. Scope
2. Normative references
3. Materials and construction
4. Internal marking
5. Electrical properties
6. Non-electrical properties of the copper-clad sheet
7. Non-electrical properties of the base material
     after complete removal of the copper foil
8. Packaging and marking
9. Acceptance testing
Tables
1. Electrical properties
2. Types, sizes and permitted number of imperfections
3. Pull-off and peel strength
4. Wetting conditions
5. Dimensional stability
6. Size tolerances for cut panels
7. Rectangularity of cut panels
8. Nominal thickness and tolerances of sheet excluding
     metal foil
9. flammability
10. Glass transition temperature and cure factor
11. Thermal coefficient of expansion

modified epoxide woven glass fabric copper clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.

Committee
CTN 203/SC 91-119
DocumentType
Standard
Pages
16
ProductNote
NEW CHILD AMD 2 IS ADDED NEW CHILD IS ADDED AMD 1 THIS STANDARD IS IDENTICAL EN 60249-2-19:1993,IEC 249-2-19:1992
PublisherName
Asociacion Espanola de Normalizacion
Status
Current

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