UNE-EN 60249-2-19:1997
Current
The latest, up-to-date edition.
BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION Nº 19: THIN BISMALEIMIDE/TRIAZINE MODIFIED EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS.
Hardcopy , PDF
Spanish, Castilian, English
11-08-1997
Committees responsible
National foreword
Specification
1. Scope
2. Normative references
3. Materials and construction
4. Internal marking
5. Electrical properties
6. Non-electrical properties of the copper-clad sheet
7. Non-electrical properties of the base material
after complete removal of the copper foil
8. Packaging and marking
9. Acceptance testing
Tables
1. Electrical properties
2. Types, sizes and permitted number of imperfections
3. Pull-off and peel strength
4. Wetting conditions
5. Dimensional stability
6. Size tolerances for cut panels
7. Rectangularity of cut panels
8. Nominal thickness and tolerances of sheet excluding
metal foil
9. flammability
10. Glass transition temperature and cure factor
11. Thermal coefficient of expansion
modified epoxide woven glass fabric copper clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards.
Committee |
CTN 203/SC 91-119
|
DocumentType |
Standard
|
Pages |
16
|
ProductNote |
NEW CHILD AMD 2 IS ADDED NEW CHILD IS ADDED AMD 1 THIS STANDARD IS IDENTICAL EN 60249-2-19:1993,IEC 249-2-19:1992
|
PublisherName |
Asociacion Espanola de Normalizacion
|
Status |
Current
|
Standards | Relationship |
IEC 60249-2-19:1992 | Identical |
SN EN 60249-2-19 : 1993 AMD 2 1995 | Identical |
DIN EN 60249-2-19 : 1993 AMD 2 1996 | Identical |
I.S. EN 60249-2-19:1996 | Identical |
BS EN 60249-2-19:1993 | Identical |
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