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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    BS EN 61189-11 ED.1 - TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE AND MELTING TEMPERATURE RANGES OF SOLDER ALLOYS

    Available format(s):  Hardcopy, PDF

    Superseded date:  31-07-2013

    Language(s):  English

    Published date: 

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative reference
    3 Test and definition
      3.1 Melting temperature ranges
      3.2 Solidus temperature
      3.3 Liquidus temperature
      3.4 DSC curve
    4 Test Equipment
      4.1 DSC
      4.2 Balance
      4.3 Pans
      4.4 Inert gas
      4.5 alumina powder
    5 Calibration of the temperature
    6 Test condition
      6.1 Sample size
      6.2 Inert gas flow
      6.3 Heating rate
    7 Procedure for measuring the DSC curve
    8 Solidus temperature: Temperature of melting starts
    9 Liquidus temperature: Temperature of melting ends
    Annex A (Normative) - Test report on melting temperature
            ranges of solder alloys
    Annex B (Informative) - Example of test result (liquidus
            temperature)

    General Product Information - (Show below) - (Hide below)

    Comment Closes On
    Committee EPL/501
    Document Type Draft
    Publisher British Standards Institution
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
    ISO 11357-1:2016 Plastics — Differential scanning calorimetry (DSC) — Part 1: General principles
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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