IEC 61189-1:1997+AMD1:2001 CSV
Current
The latest, up-to-date edition.
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
Hardcopy , PDF
English - French
22-11-2001
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative reference
3 Accuracy, precision and resolution
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
9 M: Mechanical test methods
10 E: Electrical test methods
11 N: Environmental test methods
12 X: Miscellaneous test methods
Annex A (informative) Worked examples
Annex B (informative) Conversion table
Figures
Tables
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies. This consolidated version consists of the first edition (1997) and its amendment 1 (2001). Therefore, no need to order amendment in addition to this publication.
| DevelopmentNote |
Also numbered as BS EN 61189-1 (07/2002) Stability Date: 2017. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
51
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| GOST R IEC 61189-1 : 2012 | Identical |
| NF EN 61189-1 : 98 AMD 1 2002 | Identical |
| NEN EN IEC 61189-1 : 1997 AMD 1 2001 | Identical |
| I.S. EN 61189-1:1999 | Identical |
| PN EN 61189-1 : 2004 | Identical |
| EN 61189-1 : 97 AMD 1 2001 | Identical |
| DIN EN 61189-1:2002-04 | Identical |