09/30209670 DC : 0
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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BS EN 60749-21 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
Hardcopy , PDF
31-08-2011
English
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1 Scope
2 Test apparatus
2.1 Solder bath
2.2 Dipping device
2.3 Optical equipment
2.4 Steam ageing equipment
2.5 Lighting equipment
2.6 Materials
2.6.1 Flux
2.6.2 Solder
2.7 SMD reflow equipment
2.7.1 Stencil or screen
2.7.2 Rubber squeegee or metal spatula
2.7.3 Test substrate
2.7.4 Solder paste
2.7.5 Reflow equipment
2.7.6 Flux removal solvent
3 Procedure
3.1 Lead-free backward compatibility
3.2 Preconditioning
3.2.1 Preconditioning by steam ageing
3.2.2 Preconditioning by high temperature storage
3.3 Procedure for dip and look solderability testing
3.3.1 Solder dip conditions
3.3.2 Procedure
3.4 Procedure for simulated board mounting reflow
solderability testing of SMDs
3.4.1 Test equipment set-up
3.4.2 Specimen preparation and surface condition
3.4.3 Visual inspection
4 Summary
Bibliography
BS EN 60749-21
| Committee |
EPL/47
|
| DocumentType |
Draft
|
| Pages |
23
|
| PublisherName |
British Standards Institution
|
| Status |
Superseded
|
| SupersededBy |
| IEC 60749-20:2008 | Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat |
| IEC 60749-15:2010 | Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
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