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  • 13/30287806 DC : 0

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    BS EN 60539-1 - DIRECTLY HEATED NEGATIVE TEMPERATURE COEFFICIENT THERMISTORS - PART 1: GENERIC SPECIFICATION

    Available format(s):  Hardcopy, PDF

    Superseded date:  31-08-2016

    Language(s):  English

    Published date: 

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 General
    2 Technical data
    3 Quality assessment procedures
    4 Test and measurement procedures
    Annex A (normative) - Interpretation of sampling plans and
            procedures as described in IEC 61193-2 for use
            within the IEC quality assessment system for
            electronic components (IECQ)
    Annex B (normative) - Rules for the preparation of detail
            specifications for capacitors and resistors for
            electronic equipment
    Annex C (informative) - Typical examples of mountings for
            measurements of directly heated thermistors

    General Product Information - (Show below) - (Hide below)

    Comment Closes On
    Committee EPL/40X
    Document Type Draft
    Publisher British Standards Institution
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC Q 03-3 : 2.1 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ SYSTEM) - RULES OF PROCEDURE - PART 3: IECQ APPROVED COMPONENT PRODUCTS, RELATED MATERIALS & ASSEMBLIES SCHEME
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-11:1981 Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist
    IEC 60027-1:1992 Letters symbols to be used in electrical technology - Part 1: General
    IEC 60068-2-38:2009 Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
    IEC 60294:2012 Measurement of the dimensions of a cylindrical component with axial terminations
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60062:2016 Marking codes for resistors and capacitors
    ISO 80000-1:2009 Quantities and units — Part 1: General
    IEC 60717:2012 Method for the determination of the space required by capacitors and resistors with unidirectional terminations
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    IEC 60068-2-52:2017 Environmental testing - Part 2-52: Tests - Test Kb: Salt mist, cyclic (sodium chloride solution)
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
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