17/30352696 DC : DRAFT SEP 2017
Current
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The latest, up-to-date edition.
BS IEC 62047-31 ED1.0 - SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 31: FOUR-POINT BENDING TEST METHOD FOR INTERFACIAL ADHESION ENERGY OF LAYERED MEMS MATERIALS
Published date
21-09-2017
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FOREWORD
1 Scope
2 Normative references
3 Terms and symbols
4 Test piece
5 Testing method and test apparatus
6 Test report
Bibliography
BS IEC 62047-31 Ed1.0.
| Committee |
EPL/47
|
| DocumentType |
Draft
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials |
| IEC 62047-22:2014 | Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates |
| IEC 62047-9:2011 | Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS |
| IEC 62047-8:2011 | Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films |
| IEC 62047-3:2006 | Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing |
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