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I.S. EN IEC 61760-1:2020

Current

Current

The latest, up-to-date edition.

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

12-10-2020

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Requirements for component design and component specifications
5 Assembly processes
6 Soldering
7 Conductive glue bonding
8 Sintering
9 Solderless interconnection
Annex A (informative) Details on compliance information
Bibliography

This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology.

Committee
TC 91
DocumentType
Standard
ISBN
978-2-8322-8588-6
Pages
102
ProductNote
The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document. THIS STANDARD IS ALSO REFERS TO ISO 25178, JEDEC SPP-024
PublisherName
National Standards Authority of Ireland
Status
Current
Supersedes

Standards Relationship
IEC 61760-1:2020 Identical
EN IEC 61760-1:2020 Identical

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