• IPC DW 425 : A

    Current The latest, up-to-date edition.

    DESIGN AND END PRODUCT REQUIREMENTS FOR DISCRETE WIRING BOARDS

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    Published date:  01-09-1982

    Publisher:  Institute of Printed Circuits

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    Abstract - (Show below) - (Hide below)

    Establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards with wires that terminate in plated holes.

    General Product Information - (Show below) - (Hide below)

    Document Type Standard
    Publisher Institute of Printed Circuits
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL-STD-2000 Revision A:1991 STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    IPC DW 424 : 0 GENERAL SPECIFICATION FOR ENCAPSULATED DISCRETE WIRE INTERCONNECTION BOARDS
    ASME Y14.24 : 2012 TYPES AND APPLICATIONS OF ENGINEERING DRAWINGS - ENGINEERING DRAWING AND RELATED DOCUMENTATION PRACTICES

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC DW 424 : 0 GENERAL SPECIFICATION FOR ENCAPSULATED DISCRETE WIRE INTERCONNECTION BOARDS
    IPC S 100 : LATEST STANDARDS AND SPECIFICATIONS MANUAL
    IPC DW 426 : 0 SPECIFICATIONS FOR ASSEMBLY OF DISCRETE WIRING
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