IPC DW 424 : 0

1.0 SCOPE
     1.1 Scope
     1.2 Classification
     1.3 Statistical Process Control (SPC)
     1.4 Order of Precedence
2.0 APPLICABLE DOCUMENTS
     2.1 Institute for Interconnecting and Packaging
          Electronic Circuits
     2.2 Joint Industry Standards
     2.3 Military
     2.4 Federal
     2.5 Other Publications
3.0 REQUIREMENTS
     3.1 General
     3.2 Qualification
     3.3 Terms and Definitions
     3.4 Materials
     3.5 Visual Requirements
     3.6 Dimensional Requirements
     3.7 Physical Requirements
     3.8 Construction Integrity of Plated Holes
     3.9 Plated Holes After Stress
     3.10 Electrical and Environmental Requirements
     3.11 Shock and Vibration
     3.12 Repair and Modification
     3.13 Special Construction Techniques
4.0 QUALITY ASSURANCE PROVISIONS
     4.1 Responsibility for Inspection
     4.2 Classification of Inspection
     4.3 Materials Inspection
     4.4 Inspection Conditions
     4.5 Qualification Inspection
     4.6 In-process Inspection
     4.7 Quality Conformance Inspection
5.0 PACKAGING
Appendix A
Appendix B
Figures
Tables

Establishes the qualification and performance requirements for encapsulated discrete wire interconnection boards having wires, which terminate in plated holes.