NASA GSFC STD 8002 : 2015

Current

Current The latest, up-to-date edition.

STANDARD QUALITY ASSURANCE REQUIREMENTS FOR THE USE OF WATER SOLUBLE FLUX

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Published date: 01-01-2015

Publisher: National Aeronautics and Space Administration

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DOCUMENT HISTORY LOG
FOREWORD
1. SCOPE
2. APPLICABLE DOCUMENTS
3. ACRONYMS AND DEFINITIONS
4. REQUIREMENTS
5. GUIDANCE
APPENDIX A - Examples of Percent Voiding In Chip Package
Solder Joints
APPENDIX B - Water Soluble Flux Initial Qualification
Reports Checklist

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Sets up the requirements applicable to soldering processes for Printed Wiring Assemblies (PWAs) that use Water Soluble Flux (WSF).

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Development Note	Expiration Date: 03-09-2020. (09/2015)
Document Type	Standard
ISBN
Pages
Published
Publisher	National Aeronautics and Space Administration
Status	Current

Standards Referencing This Book - (Show below) - (Hide below)

IPC J STD 001 : F	REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
IPC TM 650 : 0	TEST METHODS MANUAL
NASA GSFC STD 6001 : 2016	CERAMIC COLUMN GRID ARRAY DESIGN AND MANUFACTURING RULES FOR FLIGHT HARDWARE
IPC 9202 : 0	MATERIAL AND PROCESS CHARACTERIZATION/QUALIFICATION TEST PROTOCOL FOR ASSESSING ELECTROCHEMICAL PERFORMANCE
IPC 9203 : 0	USERS GUIDE TO IPC-9202 AND THE IPC-B-52 STANDARD TEST VEHICLE

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